• 제목/요약/키워드: Thick Layered Manufacturing

검색결과 12건 처리시간 0.029초

쾌속조형 원리를 이용한 대형 모델의 제작 (Fabrication of a Large Object by Rapid Prototyping Technics)

  • 최홍석
    • 한국군사과학기술학회지
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    • 제10권3호
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    • pp.120-128
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    • 2007
  • In order to reduce the lead-time and cost, the technology of rapid prototyping(RP) has been widely used. This paper describes the methodology to fabricate a large object by using the principle of rapid prototyping. By laminating thick and sloping polystyrene foam plates, we can make the large model which has three dimensional, continuous surfaces faster and easier than conventional processes. Estimated error was much smaller than other RP products which have stepped effect. For accuracy improvement and post processing, machined metal plates are added between the thick plates. To keep the continuity of surface and strengthen the model, pilot holes and guide rods are applied. By the methodology described in this paper, a missile body with flush air intake was fabricated.

VLM-ST 공정에서 입체 절단을 이용한 대형 물체의 쾌속 제작 (Rapid Manufacturing of Large Object by Splitting Solid Model in VLM-ST)

  • 이상호;안동규;김효찬;양동열;채희창
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.50-53
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    • 2003
  • Most companies use technologies such as stereolithography, selective laser sintering, and fused deposition modeling to make parts for such small consumer products as telephones, heads, and shoes. The largest part that the existing RP systems can make is only 600 mm in length. Because most RP systems build parts by depositing, solidifying, or sintering material point-by-point, making larger objects takes a long time. and in many cases, large objects won't fit the build size. A new effective thick-layered RP process. Transfer type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. In this paper, a scaledown model of F16 Fighter with the length of 800 mm is rapidly fabricated using the VLM-ST process. In order to build a CAD model of F16 larger than 600 mm in length, the approach in VLM-ST is to build larger parts in multiple sub-parts and then glue them together. The fabricated result shows that the VLM-ST process employing thick layers and sloped surfaces is adequate for creating the real-sized large objects in the diverse fields such as automobiles, electric home appliances, electronics. and etc.

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VLM-ST 시작품의 적층무늬 제거를 위한 표면처리 방법론 개발 (Development of Surface Finishing Methodology for the Laminated Pattern Removal of VLM-ST Parts)

  • 이상호;김효찬;송민섭;양동열
    • 한국정밀공학회지
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    • 제22권2호
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    • pp.202-209
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    • 2005
  • A new effective thick-layered RP process, Transfer-type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. VLM-ST has the innate advantages by virtue of its working principle: high building speed, low cost for introduction and maintenance of VLM-ST apparatus, little staircase surface irregularities of parts. Despite these advantages in VLM-ST, the surface roughness of VLM-ST parts is still inadequate to be used as RP master patterns for rapid tooling (RT). This paper describes the systematic and effective methodology to remove the laminated pattern and improve the surface roughness for VLM-ST parts. From the results of surface finishing of VLM-ST parts, it can be seen that the laminated pattern is completely removed and the surface characteristics such as surface roughness, surface hardness, and paintability are improved.

헬리콥터 착륙장치를 위한 복합재 토크링크의 설계에 대한 연구 (Study on design of the composite torque link for a landing gear system of a helicopter)

  • 김진봉;엄문광;이상용;김태욱;신정우
    • Composites Research
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    • 제22권2호
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    • pp.30-36
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    • 2009
  • 본 논문에서는 헬리콥터 착륙장치를 위한 복합재료 토크링크를 개발하기 위한 설계 기법을 제시하였다. 복합재 토크링크는 헬리콥터 착륙장치의 충격흡수부의 정렬을 위해 장착되는 장치로서 가벼우면서도 강성이 커서 외부하중에 대해 최소의 변형량을 가져야 한다. 또 가격적인 측면을 고려한 복합재 구조물 제조 공정(RTM: 수지충전공정)이 반영되어 대량생산이 가능한 구조 및 형태를 가져야 한다. 본 논문에서는 복합재 구조물 제조 공정과 동일한 공정으로 시편을 제작하여 설계에 필요한 기계적 특성을 얻었으며, 유한요소해석을 통하여 복합재 토크링크에 대한 최적 형상설계를 수행하였다. Lug 형태를 가지는 두꺼운 복합재료 구조물인 복합재료 토크링크의 설계를 위해서는 ABAQUS의 3D Layered Solid 요소로 구성된 유한요소모델을 활용하여 복합재료의 두께방향을 포함한 강도해석을 수행하였으며, Rigid-Deform 구속조건의 접촉문제를 고려한 비선형 정적 해석을 반복적으로 수행하여 주어진 정강도 요구조건을 만족시키는 복합재 토크링크를 설계하였다.

발포 폴리스티렌 폼을 이용한 다기능 열선절단장치 개발 (Development of Multi-functional Hotwire Cutting System using EPS-foam)

  • 이상호;김효찬;양동열;박승교;김찬국
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.1414-1417
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    • 2004
  • A thick-layered RP process, transfer-type variable lamination manufacturing using expandable polystyrene foam (VLMST) has been developed to have the advantageous characteristics such as high building speed, low cost for introduction and maintenance of VLM-ST apparatus, and little staircase surface irregularities of parts. However, VLM-ST has difficulty fabricating an axisymmetric shape and a large-sized freeform shape because of the limited sloping angles and small build size. The objective of this paper is to develop a multi-functional hotwire cutting system using EPS-foam (MHC). MHC employs a four-axis synchronized hotwire cutter with the structure of two XY movable heads and a turntable. In order to examine the applicability of the developed MHC apparatus, an axisymmetric shape, a polyhedral shape and a large-sized freeform shape were fabricated on the apparatus.

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마이크로 드릴링 M/C에 의한 미세구멍가공특성에 관한 연구 (A Study on the Characteristics of Micro Deep Hole Machining in Micro Drilling Machine)

  • 민승기;이동주;이응숙;강재훈;김동우
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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    • pp.275-280
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    • 2001
  • Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

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용접 공정 디자인에 따른 클래드강의 기계적 성질 변화 (Change of Mechanical Properties of Clad Steel According to the Welding Process Design)

  • 이정현;박재원
    • 한국생산제조학회지
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    • 제22권3호
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    • pp.372-379
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    • 2013
  • In this study, we investigated the traits of the clad metals used in hot-rolled clad steel plates. We examined the sensitization and mechanical properties of STS 316 steel plate and carbon steel (A516) under the specific circumstances of post heat treatment and whether a weld was multilayered and thick or repeated because of repairs. The test conditions were as follows. The clad steel plates were butt-welded using FCAW/SAW, and the heat treatment was conducted at $625^{\circ}C$, for 80, 160, 320, 640, or 1280 min. The change in the corrosion resistance was evaluated in these specimens. In the case of the carbon steel (A516), as the heat treatment time increased, the annealing effect caused the tensile strength to decrease. The micro- hardness gradually increased and then decreased after 640 min. The elongation and contraction of the area increased gradually. An oxalic acid etch test and EPR test on STS316, a clad metal, showed a STEP structure and no sensitization. From the test results for the multi-layered and repair welds, it could be concluded that there is no effect on the corrosion resistance of clad metals. In summary, the purpose of this study was to suggest some considerations when developing on-site techniques and evaluate the sensitization of stainless steels.

Gradient YZO Buffer Deposition on RABiTS for Coated Conductor

  • Kim, T.H.;Kim, H.S.;Ko, R.K.;Song, K.J.;Lee, N.J.;Ha, D.W.;Ha, H.S.;Oh, S.S.;Pa, K.C.
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.240-241
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    • 2007
  • In general, high temperature superconducting coated conductors have intermediary buffers layer consisting of seed, diffusion barrier and cap layers. Simplification of the oxide materials buffer architecture in the fabrication of high temperature superconducting coated conductors is required because the deposition of multi-layers buffer architecture leads to a longer manufacturing time and a higher cost process of coated conductors. Thus, single buffer layer deposition seems to be important for practical coated conductor manufacturing process. In this study, a single gradient layered buffer deposition process of YZO for low cost coated conductors has been tried using DC reactive sputtering technique. About several thick YZO gradient single buffer layers deposited by DC co-sputtering process were found to act as a diffusion layer.

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Copper Seed Layer 형성 및 도금 첨가제에 따른 Copper Via Filling (Formation of Copper Seed Layers and Copper Via Filling with Various Additives)

  • 이현주;지창욱;우성민;최만호;황윤회;이재호;김양도
    • 한국재료학회지
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    • 제22권7호
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    • pp.335-341
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    • 2012
  • Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

열증착법으로 제조한 박막헝 CuCo와 AgCo의 자기저항 효과 (Magnetoresistance Behavior of CuCo and AgCo Films using a Thermal Evaporation)

  • 송오성;윤기정
    • 한국산학기술학회논문지
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    • 제7권5호
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    • pp.811-816
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    • 2006
  • 이방성 자기저항효과(anisotropic magnetoresistance : AMR)는 단층 자성박막으로 구성되므로 경제성 있게 박막화 시켜서 소형화가 가능하다. 기존의 급속응고법으로 생산된 리본형 MCo(M=Cu, Ag) 소자가 경제적으로 공업적 목적을 달성하였으나, 리본형 특유의 두께와 가공성이 부족하여 소형 소자에 함께 집적하기 곤란한 단점이 있었다. 새로운 박막형을 쓰면 추가 열처리 없이 기존의 리본형 소자와 비교하여 박막상태로 적절한 AMR 특성이 나오는지와 최적 AMR을 얻기 위한 Co의 조성을 아는 것이 중요하다. 열증착기를 써서 100nm의 $Cu_{1-x}Co_x$$Ag_{1-x}$ 박막을 Co의 조성을 $10{\sim}70wt%$로 달리하며 제작하여 이때의 자기적 특성을 확인하였다. CuCo는 40% Co에 0.5T에서 1.4%, AgCo는 30% Co에 2.6%의 MR비를 얻었고 이는 리본형 소자보다는 표면 산란 효과에 의해 MR비는 작지만 표면산화막 없이 직접 다른 소자공정과 함께 진행할 수 있는 장점이 있음을 확인하였다.

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