• Composites Research
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• v.27 no.3
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• pp.90-95
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• 2014

Cure shrinkage during cure process of polymer matrix composites develope residual stress that cause some structural deformation, such as spring-in, spring-out and warpage. The carbon/epoxy prepreg used in this study is Hexply M21EV/34%/UD268NFS/IMA-12K supplied by Hexcel corp. Cure shrinkage and degree of cure measured by TMA(thermomechanical analyzer) and DSC(differential scanning calorimetry). Cure shrinkages are measured by TMA within a temperature range of $140{\sim}240^{\circ}C$ in a nitrogen atmosphere, and degree of cure determined by the heat of reaction using dynamic and isothermal DSC runs in argon atmosphere. As a result, the cure shrinkage is increased dramatically in a degree of cure range between 27~80%. the higher the cure temperature, the lower the degree of cure occurring to begin cure shrinkage.

• Korean Journal of Metals and Materials
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• v.50 no.9
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• pp.629-636
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• 2012

Volume shrinkage behavior accompanying the cure of resin formulations might be a critical factor when assembly processes using polymer materials are considered. In this study, cure shrinkage behavior with respect to resin formulation type and heating method was measured on sandwich structure samples by a thermomechanical analyzer (TMA). Quartz, used as a cover material for the sandwich structure, indicated the coefficient of thermal expansion close to $0ppm/^{\circ}C$. When a dynamic heating mode was conducted, a squeeze-out region and a cross-linking region for each resin formulation could be separated clearly with overlapping differential scanning calorimeter results on the TMA results. In addition, a cure shrinkage dominant region and a thermal expansion dominant region in the cross-linking region were distinguished. Consequently, the degree of cure at the initiation of the thermal expansion dominant region was successfully measured. Measurement of all resin formulations indicated the thermal expansion behavior exceeded cure shrinkage before full cure.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.51-57
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• 2021

This paper analyzed the effects of the concentration of nano-silica particles contained in epoxy resin on the thermomechanical properties of the composite materials. The 12nm sized nanoparticles were mixed with epoxy polymer by 5 different weight ratios for the test samples. The glass transition temperature, stress relaxation, and thermal expansion behaviors were measured using dymanic mechanical analyzer (DMA) and thermomechanical analyzer (TMA). It was shown that the nano particle mixing ratios had significant influences on the viscoelastic behaviors of the materials. As the content of the silica particles was increased, the elastic modulus was also increased, while the glass transition temperatures were decreased. Fourier Transform Infrared Spectroscopy (FTIR) results played an important role in determining the causes of the property changes by the filler contents in terms of the molecular structures, enabling the interpretations on the material behaviors based on the chemical structure changes.

• Polymer(Korea)
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• v.36 no.5
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• pp.573-578
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• 2012

In general, most physical properties of wood/polyvinyl chloride (PVC) composites are lower than those of corresponding neat PVC resin because of poor interfacial adhesion between the hydrophilic wood flour and hydrophobic PVC. Therefore, in this study, we treated wood flour with three aminosilanes to improve wood/PVC interfacial adhesion strength, and eco-friendly wood/PVC/nanoclay composites were prepared by melt blending the aminosilane-treated wood flour, a heavy metal free PVC compound, and a type of nanoclay. The effects of treating wood flour with the aminosilanes and adding the nanoclay on the mechanical properties of the composites were investigated. Mechanical properties of the composites were investigated by universal testing machine (UTM), izod impact tester, dynamic mechanical analyzer (DMA), and thermomechanical analyzer (TMA). The tensile properties of the composites with the aminosilane-treated wood flour were considerably higher than those of the composites with neat wood flour. Furthermore, a small amount of the nanoclay improved mechanical properties of the composites. The performance of the wood/PVC composites was considerably improved by using the aminosilane-treated wood flour and the nanoclay.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.62-62
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• 2010

PVC(Polyvinyl Chloride)와 HDPE(High-density Polyethlene) 하수도관은 수많은 고분자 재료 중에도 높은 기계적 강도를 가지며, 광범위하게 사용되고 있다. 하지만, PVC와 HDPE 하수관을 연결하기 위해 소모 접착제나 고무링 이용한 소켓 방법 이음 방법은 낮은 수밀성과 기계적 강도로 오 폐수의 누수가 발생되고, 이것이 흙에 스며들어 지하수, 하천 및 토양을 오염시키고 있다. 따라서, 대안으로 최근에는 열판을 이용한 맞대기 융착 용접을 PE 하수도 관에 제한적으로 적용하여 시공하고 있다. 그러나, PVC 하수관은 열을 가할 시 열에 의한 민감한 거동으로 인해 맞대기 융착 용접법이 적용되지 못하고 있는 실정이다. 따라서 본 연구에서는 하수도 관 중, 국내에서 가장 많이 사용되고 있는 내 충격 PVC 하수도관과 HDPE 이중 벽관의 DSC(Diffential Scanning Calorimeter), TGA(Thermogravimetric analyzer), TMA(Thermomechanical Analysis), DMA(Dynamic Mechanical Analysis) 분석으로 온도에 따른 열적 거동을 분석하여, 적절한 융착 온도 조건을 제시하였다. 또한 접합강도 향상을 위한 이음부 설계를 제안하여, 융착 용접 특성을 평가하였다.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.5
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• pp.226-232
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• 2021

The relationship between precipitation and coefficient of thermal expansion of Al-6%Si-0.4%Mg-0.9%Cu-(Ti) alloy (in wt.%) after various heat treatments were studied by the thermodynamic analyzer (TMA) and differential scanning calorimetry (DSC). Solution heat treatment of the alloy was carried out at 535℃ for 6 h followed by water quenching, and the samples were artificially aged in the air at 180℃ and 220℃ for 5 h. The coefficient of thermal expansion (CTE) curve showed some residual strain and decreased with increasing aging temperature. The CTE curves changed sharply in the temperature range of 200℃ to 400℃, and the corresponding peak shifted for the aged samples due to the change in the precipitation behavior of the secondary phase. These transformation peaks in the aged sample are related to the volume of the precipitation of the Si phase as determined by DSC analysis. The change in CTE is mainly caused by the precipitation of the Si phase in the Al-Si alloy, and the size of the change occurs simultaneously with the size of the precipitate.

• Polymer(Korea)
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• v.38 no.4
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• pp.510-517
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• 2014

A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.

• Polymer(Korea)
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• v.38 no.6
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• pp.752-759
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• 2014

Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.

• Journal of Adhesion and Interface
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• v.17 no.1
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• pp.7-14
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• 2016

Epoxy composites with concentrations of 5-70 wt% of silica particles were prepared in order to improve mechanical property and poor thermal stability. The mechanical and thermal properties were investigated and compared to the corresponding properties of neat epoxy composite. Furthermore, the effects of silane compound treatment on silica particles were observed by the experimental results of the tensile strength, glass transition temperature, and thermal stability of epoxy composite. Tensile strength of epoxy composites was measured by universal testing machine (UTM) and after that, the structure and morphology analysis of epoxy nanocomposites were analyzed by field emission scanning electron microscope (FE-SEM) and energy dispersive spectroscopy (EDS). The increased solid content of CA0030 particle improved the tensile strength of epoxy/ modified composites to give 30-50 MPa. The thermal expansion coefficients (CTE) of neat epoxy resin and epoxy/silica composites measured with a thermomechanical analyzer (TMA) showed that the incorporation of silica particles was helpful to reduce the CTE of neat epoxy resin.