• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• 대한금속재료학회지
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• 제48권3호
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• pp.210-217
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• 2010

The effects of cooling rate and onset time of fatigue test on hot ductility of plain carbon steels containing 0.06$\sim$0.8 wt.% carbon were investigated at various temperatures. The tensile tested specimen after fatigue strain during cooling showed higher hot ductility than the specimen fatigued and tensile-strained after cooling. With a decreasing cooling rate from solutionizing temperature to test temperature, hot ductility was increased in all temperature ranges, typically in the trough region, and the minimum point of ductility moved to a lower temperature. Also, the depth and width of the trough decreased with lowering the cooling rate.

• 대한금속재료학회지
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• 제47권11호
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• pp.707-715
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• 2009

This paper deals with cyclic stress and strain responses during isothermal low cycle fatigue (LCF) and thermo-mechanical fatigue (TMF) loadings on Nb and Mo containing 15Cr stainless steel, which is used for exhaust manifolds in automobiles. The test temperatures ($T_{i}$) of the isothermal LCF were 600 and $800^{\circ}C$. The minimum temperature of the TMF test was $100^{\circ}C$ and the maximum temperaures ($T_{p}$) were varied between 500 and $800^{\circ}C$. In both loading conditions, weak cyclic softening is observed at $T_{i}=T_{p}=800^{\circ}C$, but the transition to strong cyclic hardening is completed with the temperature decrease below $T_i=600{\sim}700^{\circ}C$ for LCF and $T_{p}=500{\sim}600^{\circ}C$ for TMF. The stress-strain hysteresis loops in the TMF loading show a significant stress relaxation during compressive (heating) half cycle at $T_{p}>500^{\circ}C$, which develops tensile mean stress during cycling. Due to the stress relaxation, the TMF test sample reveals much lower dislocation density than the isothermally fatigued sample at the same temperature with $T_{p}$. A detailed correlation between fatigue microstructure and cycling deformation behavior is discussed.

• Journal of Welding and Joining
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• 제29권1호
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• 한국도로학회논문집
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• 제2권3호
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• pp.129-144
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• 2000

골재의 입도에 따른 SBS 개질 아스팔트 혼합물의 점탄성 물성 및 피로공용 특성을 소개하였다. 아스팔트 바인더와 혼합물의 열역학적 거동분석을 위해 DSR 시험과 일축인장 크립시험을 실시하였다. 골재의 입도와 SBS 개질재가 피로공용성에 미치는 영향을 평가하기 위하여 7종의 아스팔트 혼합물에 대해 일축인장 피로시험을 실시하였다. DSR 및 일축인장 크립시험결과, 골재의 입도에 관계없이 SBS 개질 아스팔트 혼합물이 일반 아스팔트 혼합물에 비해 고온에서 소성변형에 대한 저항성이 큰 것으로 나타났다. Superpave 아스팔트 바인더 규격의 피로인자 $G^*sin\delta$는 아스팔트 혼합물의 피로 공용성 평가에 사용하기에는 부적절한 것으로 사료된다. 일축인장피로시험결과, 골재의 입도(밀입도, Superpave입도, SMA입도)에 관계없이 SBS 개질 아스팔트 혼합물이 일반 혼합물에 비해 약 10배 이상 피로수명이 큰 것으로 나타났다. 장기노화후의 경우에 있어서도 SBS 개질 혼합물의 피로수명이 일반 혼합물에 비해 높게 나타났다. 골재의 입도변화는 SBS 개질재에 비해 피로공용성에 미치는 영향이 적었다. SMA 혼합물에 첨가한 셀룰로오스 섬유는 혼합물의 점탄성 물성이나 피로공용성에 미치는 영향이 미미하였으나, Draindown을 방지하는 데는 효과적이었다. SMA 입도에 SBS 개질아스팔트를 사용할지라도 Draindown 방지를 위해서는 셀룰로오스 섬유를 첨가할 필요가 있을 것으로 사료된다.

• 대한기계학회논문집A
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• 제20권3호
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• pp.753-764
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• 1996

The metal matrix composites(MMC) are currently receiving a great deal of attention. These composites possess exellent mechanical and physical properties such as modulus, strength, wear resistance and thermal stability, which make them very attractive for use in automotive piston. In this study, $Al/{Al_2}{O_3}$(15%) composites are fabricated by the squeeze casting method. Mechanical properties such as tensile strength and ductility are performed at room and elevated temperature($250^{\circ}C$ and $350^{\circ}C$), respectively. Through thermomechanical analyser, thermal expansion coefficient of $Al/{Al_2}{O_3}$ composites are conducted for ranging from room temperature to ($400^{\circ}C$.And bending fatigue tests are also performed by the rotary bending machine at room temperature.The tensile strength and elastic modulus have been improved up to 38% and 35% by the addition of the reinforcements, respectively. Thermal expansion coefficients of MMCs which is located normal and parralel to the applied pressure are showed slightly different less than 10%. Fatigue strengh of the composite was improved by about 20% compared with that of unreinforced Al alloy. The results of this study will be used to understand the basic fracture behavior of MMCs and eventually to expand the applocation of MMCs as a machine parts undertaken various loadings.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.103-111
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• 2017

본 연구에서는 전동차의 전력 변환 장치로 많이 사용되고 있는 고전압 대전류용(3,300 V/1200 A급) insulated gate bipolar transistor(IGBT) 모듈에 대하여 열 사이클 조건하에서의 열-기계적 응력해석 및 피로수명해석을 수행하였다. 특히 최근 고전압 IGBT용으로 개발되고 있는 구리(copper) 와이어, 리본(ribbon) 와이어를 사용하였을 경우의 응력 및 피로수명을 기존의 알루미늄 와이어와 비교하여 분석하였다. 알루미늄 와이어 보다는 구리 와이어에 응력이 3배 이상 많이 발생하였다. 리본 와이어의 경우 원형 와이어 보다 응력이 더 크게 발생하며, 구리 리본 와이어의 응력이 제일 높았다. 칩과 direct bond copper(DBC)를 접합하고 있는 칩 솔더부의 피로해석을 수행한 결과, 솔더의 크랙은 주로 솔더의 모서리에서 발생하였다. 원형 와이어를 사용할 경우 솔더의 크랙은 약 35,000 사이클에서 발생하기 시작하였으며, 알루미늄 와이어 보다는 구리 와이어에서의 크랙의 발생 면적이 더 컸다. 반면 리본 와이어를 사용하였을 경우 크랙의 면적은 원형 와이어를 사용하였을 경우보다 적음을 알 수 있다. DBC와 베이스 플레이트 사이에 존재하는 솔더의 경우 크랙의 성장 속도는 와이어의 재질이나 형태에 관계없이 비슷하였다. 그러나 칩 솔더에 비하여 크랙의 발생이 일찍 시작하며, 40,000 사이클이 되면 전체 솔더의 반 이상이 파괴됨을 알 수 있었다. 따라서 칩 솔더 보다는 DBC와 베이스 플레이트 사이에 존재하는 솔더의 신뢰성이 더 큰 문제가 될 것으로 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Earthquakes and Structures
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• 제4권6호
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• pp.607-627
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• 2013

The application of shape memory alloys (SMAs) to the seismic response reduction of civil engineering structures has attracted growing interest due to their self-centering feature and excellent fatigue performance. The loading rate dependence of SMAs raises a concern in the seismic analysis of SMA-based devices. However, the implementation of micromechanics-based strain-rate-dependent constitutive models in structural analysis software is rather complicated and computationally demanding. This paper investigates the feasibility of replacing complex rate-dependent models with rate-independent constitutive models for superelastic SMA elements in seismic time-history analysis. Three uniaxial constitutive models for superelastic SMAs, including one rate-dependent thermomechanical model and two rate-independent phenomenological models, are considered in this comparative study. The pros and cons of the three nonlinear constitutive models are also discussed. A parametric study of single-degree-of-freedom systems with different initial periods and strength reduction factors is conducted to examine the effect of the three constitutive models on seismic simulations. Additionally, nonlinear time-history analyses of a three-story prototype steel frame building with special SMA-based damping braces are performed. Two suites of seismic records that correspond to frequent and design basis earthquakes are used as base excitations in the seismic analyses of steel-braced frames. The results of this study show that the rate-independent constitutive models, with their parameters properly tuned to dynamic test data, are able to predict the seismic responses of structures with SMA-based seismic response modification devices.

• Smart Structures and Systems
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• 제30권2호
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• pp.183-193
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• 2022

Structural health monitoring and structural vibration control are multidisciplinary and frontier research directions of civil engineering. As intelligent materials that integrate sensing and actuation capabilities, shape memory alloys (SMAs) exhibit multiple excellent characteristics, such as shape memory effect, superelasticity, corrosion resistance, fatigue resistance, and high energy density. Moreover, SMAs possess excellent resistance sensing properties and large deformation ability. Superfine NiTi SMA wires have potential applications in structural health monitoring and micro-drive system. In this study, the mechanical properties and electrical resistance sensing characteristics of superfine NiTi SMA wires were experimentally investigated. The mechanical parameters such as residual strain, hysteretic energy, secant stiffness, and equivalent damping ratio were analyzed at different training strain amplitudes and numbers of loading-unloading cycles. The results demonstrate that the detwinning process shortened with increasing training amplitude, while austenitic mechanical properties were not affected. In addition, superfine SMA wires showed good strain-resistance linear correlation, and the loading rate had little effect on their mechanical properties and electrical resistance sensing characteristics. This study aims to provide an experimental basis for the application of superfine SMA wires in engineering.