• Journal of the Korean Society for Precision Engineering
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• v.28 no.5
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• pp.537-542
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• 2011

The thermo-mechanical interaction between brake block and wheel tread during braking has been found to cause thermal crack on the wheel tread. Due to thermal expansion of the rim material, the thermal cracks will protrude from the wheel tread and be more exposed to wear during the wheel/block contact than the rest of the tread surface. The wheel rim is in residual compression stress when is new. After service running, the region in the tread has reversed to tension. This condition can lead to the formation and growth of thermal cracks in the rim which can ultimately lead to premature failure of wheel. In the present paper, the thermal cracks of railway wheel, one of severe damages on the wheel tread, were evaluated to understand the safety of railway wheel in running condition. The residual stresses for damaged wheel which are applied to tread brake are investigated. Mainly X-ray diffusion method is used. Under the condition of concurrent loading of continuous rolling contact with rails and cyclic frictional heat from brake blocks, the reduction of residual stress is found to correlate well with the thermal crack initiation.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• Journal of the Korean Geotechnical Society
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• v.27 no.11
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• pp.55-69
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• 2011

The importance of unsaturated state in various geo-engineering problems has led to the advance of mechanical constitutive model emulating behavior of unsaturated soils in response to thermo-hydro-mechanical loading. Elasto-plastic mechanical constitutive model for unsaturated soil is formulated based on Bishop's effective stress. Effective stress and temperature are main variables in constitutive equation, and incremental formulation of constitutive relationship is derived to compute stress update and stiffness tensor. Numerical simulations involving coupled THM processes are conducted to discuss numerical stability and applicability of developed constitutive model: one-dimensional test, tri-axial compression test, and clay-buffering at high level radioactive waste disposal. Numerical results demonstrated that developed model can predict very complex behavior of coupled THM phenomena and is applicable to geo-engineering problems under various environmental conditions, as well as interpret typical behavior of unsaturated soils.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.26-31
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• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.11-18
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• 2011

The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

• Korean Journal of Food Science and Technology
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• v.54 no.2
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• pp.179-184
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• 2022

In this study, edible films made of fish and mammalian gelatins were produced using heat pressing, and their physical properties were investigated. Transparent and smooth films were formed continuously and uniformly using a mixture of fish skin gelatin (FG) or mammalian gelatin (MG), glycerol, and water under the process of heat pressing at 90℃ and 20 MPa for 5 min. Heat-pressed FG films possessed lower light transmittance and tensile strength than heat-pressed MG films; however, their appearance, surface morphology, water vapor permeability, lightness, and redness were not different from those of heat-pressed MG films. Although heat-pressed FG films had lower tensile strength, they had a flatter and more uniform surfaces and demonstrated higher transparency and moisture barrier properties compared to the casted FG films. These results demonstrate the potential utility of heat pressing for the large-scale production of edible films using both FG and MG.