• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• The KSFM Journal of Fluid Machinery
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• v.7 no.2 s.23
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• pp.35-40
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• 2004

A generation rate of sludge in Korea had increased dramatically about $200\%$ for a decade. A requirement for high efficiency dewatering system being possible to produce the low water content cake have suggested due to the appearance of commercial and social problems about handling of dewatered cake. The conventional dewatering system with mechanical compression device was not suitable to produce the low water content cake and didn't cope with lots of requirements. Therefore, this paper was to develop the high efficient filter press with the compressive and heating forces through the heating plate to be built between membrane fillet plates. It is possible to produce the low water content cake and improve the dewatering rate, so this equipment positively coped with several types of problems related to the sludge dewatering. The plate heated by heat transfer materials such as steam, hot water and thermo-oil made the sludge make the residual moisture within the cake to discharge easily and to improve the dewatering efficiency of equipment. The pilot scale experiment with 500kg of cake production showed that the dewatering efficiency determined by the final water content and dewatering velocity was improved $30\%$ more than the conventional dewatering equipment.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.821-826
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• 2009

Due to environmental concerns $CO_2$ has been reintroduced as a potential candidate to replace HFCs in refrigeration systems. Oils are always required in a vapor-compression cycle, and thus actual working fluid in the system is $CO_2$-oil mixtures even though the oil concentrations are low at the heat exchangers and the expansion device. The cooling heat transfer coefficients for $CO_2$-oil mixtures under supercritical condition are required to designing of the gas cooler in the $CO_2$ refrigeration system properly. In the present study, the gas cooling heat transfer coefficients for $CO_2$-PEC9 was estimated by using the Gnileinski correlation, and the Kim and Ghajar model through the previous prediction models for the thermo-physical properties of $CO_2$-oil mixture. The Gnileinski correlation was used when the oil wt.% in the mixture is less than 1.0, and for the higher oil concentration the Kim and Ghajar model was applied. The estimated results agree with the experimental results conducted by the Dang et al.

• Steel and Composite Structures
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• v.22 no.1
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• pp.91-112
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• 2016

In this paper, post-buckling behavior of sandwich plates with functionally graded (FG) face sheets under uniform temperature rise loading is examined based on both sinusoidal shear deformation theory and stress function. It is supposed that the sandwich plate is in contact with an elastic foundation during deformation, which acts in both compression and tension. Thermo-elastic non-homogeneous properties of FG layers change smoothly by the variation of power law within the thickness, and temperature dependency of material constituents is considered in the formulation. In the present development, Von Karman nonlinearity and initial geometrical imperfection of sandwich plate are also taken into account. By employing Galerkin method, analytical solutions of thermal buckling and post-buckling equilibrium paths for simply supported plates are determined. Numerical examples presented in the present study discuss the effects of gradient index, sandwich plate geometry, geometrical imperfection, temperature dependency, and the elastic foundation parameters.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.231-234
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• 2005

The high temperature deformation behavior of AZ 31 Mg alloy was investigated by designing a back propagation neural network that uses a gradient descent-learning algorithm. A neural network modeling is an intelligent technique that can solve non-linear and complex problems by learning from the samples. Therefore, some experimental data have been firstly obtained from continuous compression tests performed on a thermo-mechanical simulator over a range of temperatures $(250-500^{\circ}C)$ with strain rates of $0.0001-100s^{-1}$ and true strains of 0.1 to 0.6. The inputs for neural network model are strain, strain rate, and temperature and the output is flow stress. It was found that the trained model could well predict the flow stress for some experimental data that have not been used in the training. Workability of a material can be evaluated by means of power dissipation map with respect to strain, strain rate and temperature. Power dissipation map was constructed using the flow stress predicted from the neural network model at finer Intervals of strain, strain rates and subsequently processing maps were developed for hot working processes for AZ 31 Mg alloy. The safe domains of hot working of AZ 31 Mg alloy were identified and validated through microstructural investigations.

• Laser Solutions
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• v.9 no.1
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• pp.9-16
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• 2006

Glass is one of brittle materials. Generally, brittle material is weak for tensile stress but strong for compression stress. Laser breaking of glass used this brittle characteristics. Laser breaking of glass was simulated to optimize breaking condition by using commercial FEM code MARC which is applicable to thermo-mechanical coupling analysis. Various shapes of heat sources were applied to the analysis and the distance between heating and cooling source were varied for each simulation. The shapes of heat sources were circle, single and double ellipse and the distance was varied from 0mm to 30mm. Moving heat sources were designed on the basis of experimental condition. As a result, double elliptic shape of heat source was the most suitable among them in laser breaking of glass. And it should be useful to determine optimal condition of laser breaking for glass.

• 유체기계공업학회:학술대회논문집
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• 2003.12a
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• pp.278-283
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• 2003

A generation rate of sludge in Korea had increased dramatically about 200 % for a decade. A requirement for high efficiency dewatering system being possible to produce the low water content cake have suggested due to the appearanceof commercial and social problems about handling of dewatered cake. The conventional dewatering system with mechanical compression device was not suitable to produce the low water content cake and didn'tcope with lots of requirements. Therefore, this paper was to develop the high efficient filter press with the compressive and heating forces through the heating plate to be built between membrane filter plates. It is possible to produce the low water content cake and improve the dewatering rate, so this equipment positively coped with several types of problems related to the sludge dewatering. The plate heated by heat transfer materials such as steam, hot water and thermo-oil made the sludge make the residual moisture within the cake to discharge easilyand to improve the dewatering efficiency of equipment. The pilot scale experiment with 500kg of cake production showed that the dewatering efficiency determined by the final water content and dewatering velocity was improved 30% more than the conventional dewatering equipment.

• Journal of the Korean Geosynthetics Society
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• v.16 no.2
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• pp.175-181
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• 2017

This paper presents the results of an investigation into the effect of forced temperature change cycles on physical and mechanical properties of sand and weathered granite soil. The effect of forced temperature change cycles on the particle arrangement and the thermal conductivity was first investigated. A series of triaxial compression tests on the soils were also performed to look into the effect of temperature change cycles on the stress-strain-strength behavior.