• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• Tunnel and Underground Space
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• v.2 no.2
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• pp.224-236
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• 1992

It is very important to determine the thermo-mechanical characteristics of the rock mass surrounding the repository of radioctive waste and the LPG storage cavern. In this study, Hwasoon-Shist. Dado-Tuff adn Chunan-Tonalite were the selected rock types. Temperature dependence of the mechanical properteis such as uniaxial compressive strength, tensile strength, Young's modulus was investigated by measuring the behaviour of these properties due to the variation of temperature. Also, the characteristics of strength and deformation of these rocks were examined through high-temperature triaxial compression tests with varing temperatures and confining pressures. Important results obtained are as follows: In high temperature tests, the uniaxial compressive strength and Yong's modulus of Tonalite showed a sligth increase at a temperature up to 300$^{\circ}C$ and a sharp decrease beyond 300$^{\circ}C$, and the tensile strength showed a linear decrease with increasing heating-temperature. In high-temperature triaxial compression test, both the failure stress and Young's modulus of Tonalite increased with the increase of confining pressure at constant heating-temperature, and the failure stress decreased at 100$^{\circ}C$ but increased at 200$^{\circ}C$ under a constant confining pressure. In low temperature tests, the uniaxial compressive and tensile strengths and Young's modulus of these rocks increased as the cooling-temperature is reduced. Also, the uniaxial compressive and tensile strengths of wet rock specimens are less than those of dry rock specimens.

• Korean Journal of Materials Research
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• v.16 no.12
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• pp.743-746
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• 2006

ZTA tubes were prepared by centrifugal casting and sintered at $1600^{\circ}C$ for 2 hrs. The ZTA tubes were machined into specimens of $3{\times}4{\times}40$ mm. Molten Soda lime glass (SLG) was penetrated into the surface of ZTA at an optimized condition of $1500^{\circ}C$ for the holding time of 5 h and furnace cooled. The extra glass on the surface was removed using a resin bonded diamond wheel. The glass penetrated samples were tested for their flexural strength using four point bend test. Vickers Indentation cracks were made on the glass penetrated surface at different loads of 9.8 N, 49 N, 98 N and 196 N. The residual compression on the surface enhanced the flexural strength and crack arrest behaviour remarkably. This was attributed to the thermoelastic mismatch between the glass and ZTA matrix during cooling.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.6
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• pp.443-453
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• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

• Computers and Concrete
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• v.27 no.4
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• pp.355-367
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• 2021

This paper investigates the mechanical response of simply supported one-way reinforced concrete slabs under fire through numerical analysis. The numerical model is constructed using the software ABAQUS, and verified by experimental results. Generally, mechanical response of the slab can be divided into four stages, accompanied with drastic stress redistribution. In the first stage, the bottom of the slab is under tension and the top is under compression. In the second stage, stress at bottom of the slab becomes compression due to thermal expansion, with the tension zone at the mid-span section moving up along the thickness of the slab. In the third stage, compression stress at bottom of the slab starts to decrease with the deflection of the slab increasing significantly. In the fourth stage, the bottom of the slab is under tension again, eventually leading to cracking of the slab. Parametric studies were further performed to investigate the effects of load ratio, thickness of protective layer, width-span ratio and slab thickness on the performance of the slab. Results show that increasing the thickness of the slab or reducing the load ratio can significantly postpone the time that deflection of the slab reaches span/20 under fire. It is also worth noting that slabs with the span ratio of 1:1 reached a deflection of span/20 22 min less than those of 1:3. The thickness of protective layer has little effect on performance of the slab until it reaches a deflection of span/20, but its effect becomes obvious in the late stages of fire.

• Composites Research
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• v.33 no.3
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• pp.161-168
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• 2020

In this paper, we have studied the mechanical properties of thermoplastic carbon fiber fabric composites with spread technology and compression molding temperature were investigated. Carbon fiber reinforcement composites were fabricated using commercial carbon fiber fabrics and spread carbon fiber fabrics. Mechanical properties of the commercial carbon fiber composites (CCFC) and spread carbon fiber composites (SCFC) according to compression molding temperatures were investigated. Thermal properties of the polypropylene film were examined by rheometer, differential scanning calorimetry, thermal gravimetric analysis. Tensile, flexural and Inter-laminar shear test. Commercial carbon fiber reinforcement composites and spread carbon fiber composites were fabricated at 200~240℃ above the melting temperature of the polypropylene film. Impregnation properties according to compression molding temperature of the polypropylene film were investigated by scanning electron microscopy. As a result, as the compression molding temperature was increased, the viscosity of the polypropylene film was decreased. The mechanical properties of the compression molding temperature of 230℃ spread carbon fiber composite was superior.

• Journal of Mechanical Science and Technology
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• v.16 no.7
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• pp.942-949
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• 2002

The use of a combined starter/generator integrated into the drive train of an automobile offers several possibilities for improvement of fuel economy The use of such a starter/generator system is made feasible by a switch from a 14 volts electrical system to a 42 volts system, however, the sizing of the components is not a trivial problem. This study combines a dynamic electromechanical model of the starter, battery and power electronics with the nonlinear mechanics of the piston/crankshaft system and a thermofluid model of the compression and expansion processes to investigate the cold start problem. The example involves the start of an eight cylinder engine at -25 degrees Celsius. This paper shows how the mechatronic V8 engine of an automotive starter/generator system for the startability works well.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10b
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• pp.298-301
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• 1993

In pneumatic systems the temperature changes during operation owing to air compression or expansion, friction of air movement and friction between solid interface. The temperature change usually ha undesirable influence on process. To attain higher quality of pneumatics, studies in thermo-fluid dynamics is needed. This paper presents experimental results anti theoretical analysis on the temperature change by air charge and discharge to cylinders, which has no piston yet. The temperature increase by charge shows a strong, dependence on axial location along the cylinder, which is proved in theoretical analysis. The temperature decreases by discharge shows rather uniform in the cylinder, which is also proved by theory.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.126-133
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• 2015

Recently, there has been demand for polymeric porous membranes in various fields, such as environmental engineering, pharmaceutics, tissue engineering, drug delivery, biology, and fuel cells. In this study, it is proposed that a polymer particle-based porous membrane can be fabricated using electrospraying and sintering processes. Electrospraying can fabricate polymeric particles with diameters ranging from several micrometers to tens of nanometers without the cumbersome particle aggregation problem. Additionally, the particles can be sintered through thermo-compression under the glass transition temperature. In this study, a polymethyl methacrylate particle-based porous membrane with an average pore size of less than 500 nm is fabricated using the proposed method.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.9
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• pp.488-493
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• 2004

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.