• 제목/요약/키워드: Thermo-compression

검색결과 86건 처리시간 0.021초

고집적 소자용 구리기둥범프 패키징에서 산화문제를 해결하기 위한 방법에 대한 연구 (Method of Solving Oxidation Problem in Copper Pillar Bump Packaging Technology of High Density IC)

  • 정원철;홍상진;소대화;황재룡;조일환
    • 한국전기전자재료학회논문지
    • /
    • 제23권12호
    • /
    • pp.919-923
    • /
    • 2010
  • Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

고온 및 저온하에서의 암석의 변형, 파괴 특성 (Failure and Deformation Characteristics of Rock at High and Low Temperatures)

  • 정재훈;김영근;이형원;이희근
    • 터널과지하공간
    • /
    • 제2권2호
    • /
    • pp.224-236
    • /
    • 1992
  • It is very important to determine the thermo-mechanical characteristics of the rock mass surrounding the repository of radioctive waste and the LPG storage cavern. In this study, Hwasoon-Shist. Dado-Tuff adn Chunan-Tonalite were the selected rock types. Temperature dependence of the mechanical properteis such as uniaxial compressive strength, tensile strength, Young's modulus was investigated by measuring the behaviour of these properties due to the variation of temperature. Also, the characteristics of strength and deformation of these rocks were examined through high-temperature triaxial compression tests with varing temperatures and confining pressures. Important results obtained are as follows: In high temperature tests, the uniaxial compressive strength and Yong's modulus of Tonalite showed a sligth increase at a temperature up to 300$^{\circ}C$ and a sharp decrease beyond 300$^{\circ}C$, and the tensile strength showed a linear decrease with increasing heating-temperature. In high-temperature triaxial compression test, both the failure stress and Young's modulus of Tonalite increased with the increase of confining pressure at constant heating-temperature, and the failure stress decreased at 100$^{\circ}C$ but increased at 200$^{\circ}C$ under a constant confining pressure. In low temperature tests, the uniaxial compressive and tensile strengths and Young's modulus of these rocks increased as the cooling-temperature is reduced. Also, the uniaxial compressive and tensile strengths of wet rock specimens are less than those of dry rock specimens.

  • PDF

Crack behavior of Surface Strengthened Zirconia-Alumina Composite During Indentation

  • Balakrishnan, A.;Chu, M.C.;Panigrahi, B.B.;Choi, Je-Woo;Kim, Taik-Nam;Park, J.K.;Cho, S.J.
    • 한국재료학회지
    • /
    • 제16권12호
    • /
    • pp.743-746
    • /
    • 2006
  • ZTA tubes were prepared by centrifugal casting and sintered at $1600^{\circ}C$ for 2 hrs. The ZTA tubes were machined into specimens of $3{\times}4{\times}40$ mm. Molten Soda lime glass (SLG) was penetrated into the surface of ZTA at an optimized condition of $1500^{\circ}C$ for the holding time of 5 h and furnace cooled. The extra glass on the surface was removed using a resin bonded diamond wheel. The glass penetrated samples were tested for their flexural strength using four point bend test. Vickers Indentation cracks were made on the glass penetrated surface at different loads of 9.8 N, 49 N, 98 N and 196 N. The residual compression on the surface enhanced the flexural strength and crack arrest behaviour remarkably. This was attributed to the thermoelastic mismatch between the glass and ZTA matrix during cooling.

수치해석을 이용한 구리기둥 범프 플립칩 패키지의 열압착 접합 공정 시 발생하는 휨 연구 (Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package)

  • 권오영;정훈선;이정훈;좌성훈
    • 대한기계학회논문집A
    • /
    • 제41권6호
    • /
    • pp.443-453
    • /
    • 2017
  • 반도체 플립칩 패키지에서 구리기둥 범프 기술은 미세 피치 및 높은 I/O 밀도로 인해 기존의 솔더 범프 접합 기술을 대체하는 중이다. 그러나 구리기둥 범프는 리플로우 접합 공정 사용 시, 구리 범프의 높은 강성으로 인해 패키지에 높은 응력을 초래한다. 따라서 최근에 플립칩 공정에서 발생하는 패키지의 높은 응력 및 휨을 감소시키기 위해 열압착 공정 기술이 시도되고 있다. 본 연구에서는 플립칩 패키지의 열압착 공정과 리플로우 공정에서 발생하는 휨에 대해 수치해석을 이용하여 분석하였다. 패키지의 휨 최소화를 위한 본딩 공정 조건 최적화를 위해 본딩 툴 및 스테이지의 온도, 본딩 압력에 대한 휨 영향을 검토하였다. 또한 칩과 기판의 면적 및 두께가 패키지의 휨에 주는 영향을 분석하였다. 이를 통해, 향후 미세피치 접합부 형성 시 휨 및 응력을 최소화하기 위한 가이드라인을 제시하고자 하였다.

Numerical analysis of simply supported one-way reinforced concrete slabs under fire condition

  • Ding, Fa-xing;Wang, Wenjun;Jiang, Binhui;Wang, Liping;Liu, Xuemei
    • Computers and Concrete
    • /
    • 제27권4호
    • /
    • pp.355-367
    • /
    • 2021
  • This paper investigates the mechanical response of simply supported one-way reinforced concrete slabs under fire through numerical analysis. The numerical model is constructed using the software ABAQUS, and verified by experimental results. Generally, mechanical response of the slab can be divided into four stages, accompanied with drastic stress redistribution. In the first stage, the bottom of the slab is under tension and the top is under compression. In the second stage, stress at bottom of the slab becomes compression due to thermal expansion, with the tension zone at the mid-span section moving up along the thickness of the slab. In the third stage, compression stress at bottom of the slab starts to decrease with the deflection of the slab increasing significantly. In the fourth stage, the bottom of the slab is under tension again, eventually leading to cracking of the slab. Parametric studies were further performed to investigate the effects of load ratio, thickness of protective layer, width-span ratio and slab thickness on the performance of the slab. Results show that increasing the thickness of the slab or reducing the load ratio can significantly postpone the time that deflection of the slab reaches span/20 under fire. It is also worth noting that slabs with the span ratio of 1:1 reached a deflection of span/20 22 min less than those of 1:3. The thickness of protective layer has little effect on performance of the slab until it reaches a deflection of span/20, but its effect becomes obvious in the late stages of fire.

스프레드 탄소섬유 직물 복합재료의 성형온도에 따른 기계적 특성에 관한 연구 (Effect of Fabricating Temperature on the Mechanical Properties of Spread Carbon Fiber Fabric Composites)

  • 은종현;곽재원;김기정;김민성;성선민;최보경;김동현;이준석
    • Composites Research
    • /
    • 제33권3호
    • /
    • pp.161-168
    • /
    • 2020
  • 본 연구에서는 스프레드 기술이 적용된 열가소성 탄소섬유 복합재료의 성형 온도에 따른 기계적 특성과 폴리프로필렌 필름의 열적 특성에 대해 조사하였다. 스프레드 기술이 적용된 탄소섬유 직물과 범용 탄소섬유 직물로 탄소섬유 강화 복합재료를 제작하였고, 시차 열량 주사계(DSC), 열 중량 분석법(TGA), 점도계를 사용하여 폴리프로필렌 필름의 열적 특성을 측정하였다. 인장, 굽힘, 층간 전단 실험을 통해 복합재료 성형 온도 조건에 따른 스프레드 탄소섬유 복합재료(SCFC)와 범용 탄소섬유 복합재료(CCFC)의 기계적 특성을 확인하였다. 폴리프로 필렌 수지의 융점 이상인 200~240℃ 구간에서 복합재료를 제작하였으며, 주사 전자 현미경(SEM) 분석을 통해 성형 온도 조건에 따른 열가소성수지의 함침성을 관찰하였다. 그 결과, 성형 온도가 증가함에 따라 폴리프로필렌 수지의 점도가 감소하여 함침성이 향상되었으며, 230℃ 성형 온도 조건에서 기계적 특성이 가장 우수한 것을 확인하였다.

Mechatronic V8 Engine Start Capabilities of an Automotive Starter/Generator System at the Super Cold Weather

  • Jang, Bong-Choon
    • Journal of Mechanical Science and Technology
    • /
    • 제16권7호
    • /
    • pp.942-949
    • /
    • 2002
  • The use of a combined starter/generator integrated into the drive train of an automobile offers several possibilities for improvement of fuel economy The use of such a starter/generator system is made feasible by a switch from a 14 volts electrical system to a 42 volts system, however, the sizing of the components is not a trivial problem. This study combines a dynamic electromechanical model of the starter, battery and power electronics with the nonlinear mechanics of the piston/crankshaft system and a thermofluid model of the compression and expansion processes to investigate the cold start problem. The example involves the start of an eight cylinder engine at -25 degrees Celsius. This paper shows how the mechatronic V8 engine of an automotive starter/generator system for the startability works well.

Pressure and temperature change in air cylinders in charged or discharged case

  • Takeuchi, Masaaki;Kagawa, Toshiharu;Nomura, Naoki
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국제학술편); Seoul National University, Seoul; 20-22 Oct. 1993
    • /
    • pp.298-301
    • /
    • 1993
  • In pneumatic systems the temperature changes during operation owing to air compression or expansion, friction of air movement and friction between solid interface. The temperature change usually ha undesirable influence on process. To attain higher quality of pneumatics, studies in thermo-fluid dynamics is needed. This paper presents experimental results anti theoretical analysis on the temperature change by air charge and discharge to cylinders, which has no piston yet. The temperature increase by charge shows a strong, dependence on axial location along the cylinder, which is proved in theoretical analysis. The temperature decreases by discharge shows rather uniform in the cylinder, which is also proved by theory.

  • PDF

고분자 미세입자의 전기분사와 다공성 박막 제작에의 응용 (Electrospraying of Polymeric Microparticles and its Application to Fabrication of Porous Membrane)

  • 정영훈;오하나
    • 한국기계가공학회지
    • /
    • 제14권5호
    • /
    • pp.126-133
    • /
    • 2015
  • Recently, there has been demand for polymeric porous membranes in various fields, such as environmental engineering, pharmaceutics, tissue engineering, drug delivery, biology, and fuel cells. In this study, it is proposed that a polymer particle-based porous membrane can be fabricated using electrospraying and sintering processes. Electrospraying can fabricate polymeric particles with diameters ranging from several micrometers to tens of nanometers without the cumbersome particle aggregation problem. Additionally, the particles can be sintered through thermo-compression under the glass transition temperature. In this study, a polymethyl methacrylate particle-based porous membrane with an average pore size of less than 500 nm is fabricated using the proposed method.

유리의 미세 가공을 위한 구리 전극군의 제작과 전기 화학 방전 가공 시험 (Fabrication of Copper Electrode Array and Test of Electrochemical Discharge Machining for Micro Machining of Glass)

  • 정주명;심우영;정옥찬;양상식
    • 대한전기학회논문지:전기물성ㆍ응용부문C
    • /
    • 제53권9호
    • /
    • pp.488-493
    • /
    • 2004
  • In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.