• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.211-217
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• 2006

The three-dimensional numerical analysis has been carried out to figure out the effect of the thermoelectric element thickness on the thermal performance of the thermo-electric micro-cooler. The small-size and column-type thermoelectric cooler is considered. It is known that tellurium compounds currently have the highest cooling performance around the room temperature. Thus, in the present study, $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ are selected as the n- and p-type thermoelectric materials, respectively. The thermoelectric leg considered is less than $20{\mu}m$ thick. The thickness of the leg may affect the thermal and electrical transport through the interfaces between the leg and metal conductors. The effect of the thermoelectric element thickness on the thermal performance of the cooler has been investigated with parameters such as the temperature difference, the current, and the cooling power.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 1999.11a
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• pp.543-551
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• 1999

본 연구는 광 전송 시스템에 레이저 다이오드의 안정되고 고정된 출력 파장의 광원을 제공하기 위한 것이다. 레이저 다이오드를 구동하기 위하여 안정된 정전류 회로를 설계하려 했으며, 레이저 다이오드 자체의 온도센서와 TEC(Thermo Electric Cooler)를 이용하여 레이저 다이오드 내부의 온도를 제어하는 온도 제어 회로를 구성하였다. 또한 광 출력에 Wavelength Locker를 이용하였다. 최종적으로 이들을 제어하기 위하여 A/D, D/A 컨버터와 마이크로 프로세서를 사용하였다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.4 s.19
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• pp.79-86
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• 2004

This paper has presented to the design results of the analog and digital signal processor for the 2nd generation thermal imaging system using $480\times6$ infrared focal plane array In order to correct non-uniformities of detector arrays, we have developed the 2-point correction method using the thermo electric cooler. Additionally, to enhance the image of low contrast and improve the detection capability, we developed the new technique of histogram processing being suitable for the characteristics of contrast distribution of thermal imagery. Through these image processing techniques, we obtained a high qualify thermal image and acquired good result.

• Journal of the Korea Institute of Military Science and Technology
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• v.10 no.4
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• pp.138-144
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• 2007

This paper introduces the design techniques of an IR module using the 2-D array un-cooled type infrared detector which is applied to the individual combat weapon. Considering the size and weight of the hand carried weapon system, we used a very small-sized detector and applied an adaptive temperature control algorithm so that the operation consumed with low power can be possible. We applied the AR(Auto Regressive) filter to improve the signal-to-noise ratio in a thermal image processing step. We also applied the plateau equalization and boundary enhancement techniques to improve the visibility for human visual system.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.5 no.3
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• pp.581-590
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• 2001

This paper has been studied about supply of optical source of laser diode with stable and uniform output wavelength in optical transmission system. The stabilized constant current circuit is designed. The temperature control circuit is constructed for the control of internal temperature of laser diode. Also, the wavelength locker is used in optical output. Finally, A/D, D/A converter and micro-processor are used for the control of temperature.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.104-107
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• 2008

고출력 레이저 다이오드는 소형화되면서 생산 단가가 낮아지는 것에 비해 출력은 점점 더 커지고 있기 때문에 많은 산업 응용 분야에 확대되고 있다. 본 논문에서는 고출력 레이저 다이오드의 안정성과 고정된 출력 파워의 광원을 제공하기 위한 설계의 목적이 있다. 안정된 정전류를 위하여 온도와 전류의 안정성이 중요하다. 이를 위하여 본 연구에서는 레이저 다이오드 내부의 온도센서와 TEC(Thermo Electric Cooler)를 이용한 온도제어 회로를 구성하였다. 이들을 제어하기 위하여 A/D, D/A 컨버터와 마이크로프로세서를 사용하였으며, 정전류 50A일 때 35W 출력과 온도 범위는 ${\pm}0.5^{\circ}$로 설계를 하였다.

• 한국가시화정보학회:학술대회논문집
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• 2002.11a
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• pp.55-58
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• 2002

To control the frost formation, a temperature variation of the cooling plate and characteristics on hydrophilic and hydrophobic surfaces was attempted. As a temperature variation of the cooling plate, being closely related to the frost layer density of frost layer is found to be affected by the melting process inside the frost layer during the heating period. At characteristics on surface, completely different structures of frost are appeared in the initial stage of frost formation due to the difference in surface conditions, while those effects are vanished with time. It is found that the frost thickness, density and heat flux characteristics are closely associated with the frost structure.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.7-12
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• 2010

We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.

• Journal of the Korea Society of Computer and Information
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• v.23 no.1
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• pp.67-74
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• 2018

In this paper, we propose an efficient scene based non-uniformity correction algorithm which performs the offset correction using the uniform obtained from input scenes for Infrared camera. In general, pixel outputs of a infrared detector can not be uniform. Therefore, the non-uniformity correction procedure need to be performed to make the image outputs uniform. A typical non-uniformity correction method uses a black body at the laboratory to obtain the output of the infrared detector's pixels for two temperatures, HOT and COLD, and calculates the non-uniformity correction parameters. However, output characteristics of the Infrared detector changes while the Infrared camera is operated, the fixed pattern noise of the Infrared detector and dead pixels are generated. To remove the noise, the offset correction is generally performed. The offset correction procedure usually need the additional device such as a thermo-electric cooler, shutter, or non-uniformity correction lens. Therefore, we introduce a general scene based non-uniformity correction technique without additional equipment, and then we propose an improved non-uniformity correction algorithm based on image to solve the problem of the existing technique.