• Title/Summary/Keyword: Thermal vacuum test

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Development and High Power RF Test of the Vacuum Feedthrough for KSTAR ICRF Antenna

  • Bae, Young-Dug;Hwang, Churl-Kew;Kwak, Jong-Gu
    • Nuclear Engineering and Technology
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    • v.34 no.3
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    • pp.211-217
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    • 2002
  • A 1-MW vacuum feedthrough for the KSTAR ICRF antenna is fabricated and high power RF test is performed. It is designed to have two alumina $(Al_2O_3)$ ceramic cylinders and O-ring seal instead of a brazed seal for good mechanical and thermal strength, which is important in long pulse or steady state operation. For cooling of the ceramics, dry air is circulated in a space between the two cylinders and the outer conductor. Independent cooling water channels are installed to cool the inner conductor of the feedthrough. RF high voltage test is performed using two kinds of ceramics with the purities of 99.7% and 97%. Stable operation is possible with the RF voltage of 30 kVp at long pulse of 300 sec without any severe damage.

Hafnium Carbide Protective Layer Coatings on Carbon/Carbon Composites Deposited with a Vacuum Plasma Spray Coating Method

  • Yu, Hui-Il;Kim, Ho-Seok;Hong, Bong-Geun;Sin, Ui-Seop;Mun, Se-Yeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.237.2-237.2
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    • 2016
  • A pure hafnium-carbide (HfC) coating layer was deposited onto carbon/carbon (C.C) composites using a vacuum plasma spray system. By adopting a SiC buffer layer, we successfully integrated C.C composites with a $100-{\mu}m-thick$ protective coating layer of HfC. Compared to the conventional chemical vapor deposition process, the HfC coating process by VPS showed increased growth rate, thickness, and hardness. The growth behavior and morphology of HfC coatings were investigated by FE-SEM, EDX, and XRD. From these results, it was shown that the addition of a SiC intermediate layer provided optimal surface conditions during the VPS procedure to enhance adhesion between C.C and HfC (without delamination). The thermal ablation test results shows that the HfC coating layer perfectly protected inner C.C layer from thermal ablation and oxidation. Consequently, we expect that this ultra-high temperature ceramic coating method, and the subsequent microstructure that it creates, can be widely applied to improve the thermal shock and oxidation resistance of materials under ultra-high temperature environments.

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Design and Performance Test of a Closed Loop Thermal Control System for Thermal Vacuum Chamber (열진공 챔버용 폐회로 열제어시스템 설계 및 성능평가)

  • Seo, Heejun;Cho, Hyokjin;Park, Sungwook;Moon, Gueewon;Jung, Sanghun;Huh, Hwanil
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.44 no.1
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    • pp.88-97
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    • 2016
  • A closed loop thermal control system simulates space thermal environment to verify the satellites' functionality in extremely cold/hot temperature. It is composed of a cryogenic blower, thermal shroud, heater, cryogenic valves. This paper presents an overview of closed loop thermal control system's design parameter and test results for control parameter. A capacity of blower is calculated through energy balance equation and an advantage/disadvantage for a shroud material and a type was analysed. The thermal control system is controlled by a constant density of fluid in the system. A requested performance of closed loop thermal control system was verified by measuring a homogeneity and stability of shroud through control parameter such as density and RPM of blower.

Fabrication and characterization of fe-Ni Invar alloy thin films (Fe-Ni Invar 합금 박막의 증착 및 박막 특성 평가)

  • 김상섭;고영호;최장현;김병일;박용범
    • Journal of the Korean Vacuum Society
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    • v.8 no.2
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    • pp.116-120
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    • 1999
  • Fe-Ni alloy thin films with about 3.5 $\mu\textrm{m}$ thickness were successfully grown on Al-killed steel substrates employing DC magnetron sputtering method, and then the4 film properties were characterized. The deposited film exhibited a fibre texture structure with the relationship of ${110}_\textrm{film}//{111}_\textrm{substrate}$. We found that the adhesion between the film and the substrate was fairly good considering no debonding behavior after the thermal cyclic test of 5,000 times from room temperature to $200^{\circ}C$. Also we found that the Fe-Ni alloy deposition induced a significant decrease of thermal expansion in the film processing, a new material system with much lower thermal expansion coefficient which can be applied more as shadow mask materials than an Al-killed steel sheet.

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Development and Performance Test of the KSLV-I KM Case (KSLV-I KM 케이스 개발 및 성능 시험)

  • Kil, Gyoung-Sub;Lee, Mu-Guen;Lee, Kyung-Won;Cho, In-Hyun
    • Aerospace Engineering and Technology
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    • v.6 no.2
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    • pp.188-196
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    • 2007
  • A composite case was designed to satisfy the required condition of KSLV-I kick motor system. we performed the structure and combustion tests to insure the reliability of the case before the production of the flight model. The hydraulic, vacuum and non destruction testes as the structure test were carried out to confirm the strength of the components of the case and the characteristics of the thermal and structure were investigated through the ground combustion test.

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Mechanical System Design and Development of the HAUSAT-1 Picosatellite (초소형위성 HAUSAT-1의 기계시스템 설계 및 개발)

  • Hwang, Ki-Lyong;Min, Myung-Il;Moon, Byoung-Young;Chang, Young-Keun
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.32 no.9
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    • pp.103-113
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    • 2004
  • The satellite is exposed to the severe vibration environments such as random vibration environments such as random vibration, acceleration, shock, and acoustics during launch ascent and transportation. It is also faced with various space environments such as thermal vacuum, radiation and microgravity during the mission life. The satellite should be designed, manufactured, assembled and tested to be able to endure in these harsh environments. This paper addresses the results of the structural and thermal design and analyses for the HAUSAT-1 picosatellite which is scheduled to launch in the first quarter of 2005 by Russian launch vehicle "Dnepr". The qualification vibration and thermal vacuum tests have been conducted and passed at the satellite level to ensure that the HAUSAT-1 mechanical system was designed to be stable with enough margin.

Research on the Architectural Applications of High-Performance Vacuum Insulation Panel (고성능 진공단열재의 건축적인 적용에 관한 연구)

  • Kwon, Young Cheol;Kim, Suk
    • Land and Housing Review
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    • v.10 no.3
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    • pp.23-32
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    • 2019
  • Vacuum Insulation Panel(VIP) has the lowest thermal conductivity among present insulations. It is composed of envelope, core material and getter. Aluminum film is usually used as the envelope of VIP, and it is important component to decide the useful life of VIP. In this research, the thermophysical properties of incombustible fiber glass core VIP were investigated with the possibility of its architectural applications. The results of this research can be summarized as follows: 1) The thermal conductivity of 20mm-thick fiber glass core VIP is resulted as 0.00177W/m·K, which means that 20mm-thick VIP can meet all the reinforced insulation guideline and it can be used in any envelope of any region in Korea. 2) As a result of the test of incombustion and gas toxicity, fiber glass core VIP was suitable for incombustible material. 3) As the test result for the long term thermal conductivity, fiber glass core VIP was found out that it would keep above 10 times insulating performance than polystyrene foam and glass fiber. 4) To meet the thermal transmittance of 0.12W/㎡K, limited-combustible insulation of expanded polystyrene foam and phenolic foam should be used respectively as thick as above 280mm and 170mm, incombustible VIP can meet the same insulation level with 20mm thickness. 5) The price competitiveness of incombustible VIP to meet the thermal transmittance of 0.12W/㎡·K was about 1,500won/㎡ higher than that of phenolic foam.

Thermal Performance Test of the On-Board Blackbody System in the orbital environment for Non-Uniformity Correction of an Infrared Sensor (적외선 센서 교정용 위성 탑재 흑체 시스템의 궤도 환경 열성능 평가 시험)

  • Pil-Gyeong, Choi;Hye-In, Kim;Hyun-Ung, Oh;Byung-Cheol, Yoo;Kyoung-Muk, Lee;Jin-Suk, Hong
    • Journal of Aerospace System Engineering
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    • v.16 no.6
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    • pp.90-98
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    • 2022
  • The output of an infrared (IR) sensor mounted on an EO/IR payload is known to change during a mission period in an orbital environment. As it is required to calibrate the output of the IR sensor periodically to obtain high-quality images, an on-board black body system is mounted on the payload. All systems operating in the space environment require performance tests on ground to verify the target performance in the orbital environment. Therefore, it is also required to test the black body system to verify the performance of the surface temperature uniformity and the estimated representative temperature error within the target temperature range in the operating environment. In this study, calibration of the estimated representative temperature error and verification of the thermal performance of the black body system were conducted by performed a performance test in the thermal vacuum chamber applying deep space radiation cooling effect of an orbital environment.

Experimental Verification of Heat Sink for FPGA Thermal Control (FPGA 열제어용 히트싱크 효과의 실험적 검증)

  • Park, Jin-Han;Kim, Hyeon-Soo;Ko, Hyun-Suk;Jin, Bong-Cheol;Seo, Hak-Keum
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.42 no.9
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    • pp.789-794
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    • 2014
  • The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.