• Journal of Ocean Engineering and Technology
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• v.8 no.2
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• pp.157-165
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• 1994

Effect of an accelerated iso-thermal aging (375 degree C x 66days, 375 degree C x 200days) on elastic-plastic fracture resistance curve were examined in SA533B low alloy steel. Fracture toughness test are conducted by unloading compliance method at room temperature. But the apparent negative crack growth phenomenon, usually arise in partial unloading compliance test. The phenomenon of negative crack growth may be eliminated by the offset technique. There is no effect of aging on J sub(IC) and dJ/da in iso-thermal aged (375 degree C x 66 days) specimen, but there is very little effect in iso-thermal aged (375 degree C x 200 days) specimen.

• Journal of the Korean Society of Visualization
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• v.17 no.1
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• pp.10-18
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• 2019

In this study, the temperature behavior of Pulsating Heat Pipe (PHP) according to the diameter change were studied by limiting the diameter change to only the evaporator. To investigate operation of PHP in various heat input, heat input power was increased from 10 to 120 W. The results show operation can be divided into 3 regimes by temperature behavior. Thermal resistance was increased before start-up and decreased with increasing heat input. At 110 W heat input, thermal conductivity of 2 mm PHP was 8 .times higher compare to thermal conductivity of copper. Further, to investigate details of temperature behavior in higher heat input, FFT analysis was conducted. Based on the results, when the deviation of peak frequency in each section is lowest, the thermal resistance has lowest value.

• Journal of the Korean Society of Industry Convergence
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• v.24 no.4_2
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• pp.509-515
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• 2021

In this study, a pressure vessel for a heat pipe was fabricated by bonding a metal thin film using a polymer compound sheet. In order to confirm the applicability of the experimentally manufactured copper material thin heat pipe of 0.6 mm or less, the pressure resistance and effective thermal conductivity for pressure generated according to the type of the working fluid of the heat pipe were evaluated to suggest the commercialization potential of the thin heat pipe. As a result of evaluating the pressure resistance and effective thermal conductivity performance of the thin heat pipe, the following conclusions were drawn. 1) Using a PEEK-based polymer compound sheet, it was possible to fabricate a pressure vessel for a thin heat pipe with a pressure resistance of up to 1.0 MPa by bonding a copper thin film, and the possibility of commercialization was confirmed at a temperature below 120 ℃. 2) In the case of the effective thermal conductivity performance evaluation test, the effective thermal conductivity of ethanol was higher than that of FC72 and Novec7000, and in the case of ethanol, the maximum effective thermal conductivity was 2,851 W/mK at 3.0 W of heating.

• Journal of Mechanical Science and Technology
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• v.19 no.2
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• pp.496-504
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• 2005

The thermal and mechanical properties of an electro-slag cast steel of a similar chemical composition with an AISI-6F2 steel are investigated and compared with a forged AISI-6F2 steel. AISI-6F2 is a hot-working tool steel. Electro-slag casting (ESC) is a method of producing ingots in a water-cooled metal mold by the heat generated in an electrically conductive slag when current passes through a consumable electrode. The ESC method provides the possibility of producing material for the high quality hot-working tools and ingots directly into a desirable shape. In the present study, the thermal and mechanical properties of yield strength, tensile strength, hardness, impact toughness, wear resistance, thermal fatigue resistance, and thermal shock resistance for electro-slag cast and forged steel are experimentally measured for both annealed and quenched and tempered heat treatment conditions. It has been found that the electro-slag cast steel has comparable thermal and mechanical properties to the forged steel.

• Korean Journal of Human Ecology
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• v.24 no.2
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• pp.285-295
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• 2015

To identify optimized thermal properties of mold brassiere cup for improved thermal comfort during summer, we compared the thermal resistance and the water vapor permeability of Polyurethane (PU) foam, 3D spacer fabric and the two combined materials of the PU foam and the 3D spacer fabric. Four experimental mold brassieres were made of the materials for wearing test. Six women in their twenties evaluated the wearing sensation in the hot and humid environment. The changes in microclimate temperature and humidity while wearing test brassiere cups were measured. Results indicate that thermal resistance increased as more PU foam were combined, while the water vapor permeability was higher as the content of the 3D spacer fabric increased at thickness of 18mm and over. However, in the wear test, the PU foam brassiere was the most preferred in all ambient conditions due to its soft, flexible and smooth texture, despite its high thermal resistance and low water vapor permeability. This indicates that the textures of mold foams are more dominant properties than thermal properties for mold foams in determining the wear comfort of mold brassieres.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2340-2345
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• 2008

Cylindrical stainless-steel/sodium heat pipe for a high-temperature application was manufactured and tested for transient and steady-state operations. Two layers of Stainless-steel screen mesh wick was inserted as a capillary structure. The outer diameter of the heat pipe was 12.7 mm and the total length was 250 mm. As thermal transport conditions, the effective transport length, the heat flux, the tilt angle and the operating temperature were varied. The heat was supplied by an electric furnace up to 1 kW and the cooling was performed by forced convection of air. The effective thermal conductivity and the thermal resistance were investigated as a function of heat flux, heat transport length, and vapor temperature. Typical range of the total thermal resistance was as low as $0.036^{\circ}C/W$ at $175.8\;kW/m^2$ of heat flux and $700^{\circ}C$ of operating temperature.

• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.185-192
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• 2012

p-n junction temperature and thermal resistance of Light Emitting Diode (LED) package are affected by the chip size due to the change of the thermal density and the external quantum efficiency considering the heat dissipation through conduction. In this study, forward voltage was measured for two different size LED chips, 24 mil and 40 mil, which consist constitute 16-chip package. p-n junction temperature and thermal resistance were determined by thermal transient analysis, which were discussed in connection with the electrical characteristics of the LED chip and the structure of the LED package.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.179-193
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• 2000

Aluminium titanate (Al₂TiO5) with an excellent thermal shock resistant and a low the expansion coefficient was obtained by solid solution with MgO, SiO₂, and ZrO₂ in the Al₂TiO5 lattice or in the grain boundary solution through electrofusion in an arc furnace. However, these materials have low mechanical strength due to the presence of microcracks developed by a large difference in thermal expansion coefficients along crystallographic axes. Pure Al₂TiO5 tends to decompose into α-Al₂O₃ and TiO₂-rutile in the temperature range of 750-1300℃ that rendered it apparently useless for industrial applications. Several thermal shock tests were performed: Long therm thermal annealing test at 1100℃ for 100h; and water quenching from 950 to room temperature (RT). Cyclic thermal expansion coefficients up to 1500℃ before and after decomposition tests was also measured using a dilatometer, changes in the microstructure, thermal expansion coefficients, Young's modulus and strengths were determined. The role of microcracks in relation to thermal shock resistance and thermal expansion coefficient is discussed.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.5 s.311
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• pp.60-67
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• 2006

Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.

• Journal of the Korean Geotechnical Society
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• v.29 no.10
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• pp.49-56
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• 2013

The use of geothermal energy has been increased for economic and environmental friendly utilization. Ground thermal conductivity and borehole thermal resistance are very important parameters in the design of geothermal heat pump system. This paper presents an experimental study of heat exchange rate of U and W type ground heat exchangers (GHEs) measured by thermal performance tests (TPTs). U and W type GHEs were installed in a partially saturated dredged soil deposit, and TPTs were conducted to evaluate heat exchange rates under 100-hr continuous operation condition. The heat exchange rates were also calculated by analytical models to estimate borehole thermal resistances and were compared with experimental results. It comes out that multi-pole and equivalent diameter (EQD) models resulted in more accurate agreement than shape factor (SF) model which is currently more often used.