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Thermal Analysis of Electronic Devices in an Onboard Unit Considering Thermal Conduction Environment  

Kim Joon-Yun (Korea Aerospace Research Institute)
Kim Bo-Gwan (Chungnam National University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SC / v.43, no.5, 2006 , pp. 60-67 More about this Journal
Abstract
Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.
Keywords
Thermal Analysis; Thermal Conduction; Thermal Resistance Matrix; Superposition;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 J. W. Sofia, 'Electrical Thermal Resistance Measurement for Hybrids and Multi-Chip Packages,' Analysis Tech Co.
2 Jing Lee. 'Thermal Placement Analogy Based on Heat Conduction,' IEEE Transactions On Components and Packaging Techniques, Vol. 26, no. 2, pp. 473-482, June 2003   DOI   ScienceOn
3 Allan D. Kraus and Avram Bar-Cohen, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Co., p573, 1983
4 Younes Shabany, 'Component Size and Effective thermal conductivity of Printed circuit boards,' in Proc. of ITHERM 2002, pp. 489-494, San Diego, USA, May 2002   DOI
5 K. Azar and J. E. Graebner, 'Experimental Determination of Thermal Conductivity of Printed Wiring Boards,' in Proc. of Twelfth IEEE SEMI-THERM Symposium, 1996, pp. 169-182, Austin, USA, March 1996
6 Pradeep Lall, 'Tutorial: Temperature As an Input to Microelectronics-Reliability Models,' IEEE Trans. on Reliability, Vol. 45, no. 1, pp. 3-9, March 1996   DOI   ScienceOn
7 Ching-Han Tsai and Sung-Mo Kang, 'Cell-Level Placement for Improving Substrate Thermal Distribution,' IEEE Trans. on Computer-Aided Design of IC and Systems, Vol. 19, no. 2, pp. 253-266, Feb. 2000   DOI   ScienceOn
8 Erik C. W. de Jong, Jan. A. Ferreira, and Pavol Bauer, 'Thermal Design Based on Surface Temperature Mapping,' IEEE Power Electronics Letters, Vol. 3, no. 4, pp 125-129, December 2005   DOI   ScienceOn
9 http://www.analysistech.com