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http://dx.doi.org/10.5757/JKVS.2012.21.4.185

Study on the Thermal Dissipation Characteristics of 16-chip LED Package with Chip Size  

Lee, Min-San (Department of Display Engineering, Hoseo University)
Moon, Cheol-Hee (Department of Display Engineering, Hoseo University)
Publication Information
Journal of the Korean Vacuum Society / v.21, no.4, 2012 , pp. 185-192 More about this Journal
Abstract
p-n junction temperature and thermal resistance of Light Emitting Diode (LED) package are affected by the chip size due to the change of the thermal density and the external quantum efficiency considering the heat dissipation through conduction. In this study, forward voltage was measured for two different size LED chips, 24 mil and 40 mil, which consist constitute 16-chip package. p-n junction temperature and thermal resistance were determined by thermal transient analysis, which were discussed in connection with the electrical characteristics of the LED chip and the structure of the LED package.
Keywords
Light emitting diode; Light emitting diode chip; Light emitting diode package; Heat dissipation; Thermal resistance; Thermal transient analysis;
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Times Cited By KSCI : 5  (Citation Analysis)
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