• Journal of the Korean institute of surface engineering
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• v.27 no.1
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• pp.12-18
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• 1994

The plasma spray process was used to deposit coatings of $ZrO_2$-8wt%Y2O3 powders on mild steel sub-strate, and the characteristics of as-deposited and heat treated coatings have been investigated. Particulary, the variations of porosity, wear resistance, thermal barrier and thermal shock resistance in $ZrO_2$-8wt% $Y_2O_3$coatings after heat treatment under vacuum circumstance have been investigated. The porosity of the coating layer was increased with increased spray distance. In the case of the arc current of 450A and at the spray distance of 50mm, it was obtained the lowest amount of porosity. After heat treatment, the amount of porosity was found to be decreased, and the wear resistance, microhardness and thermal shock resistance were im-proved. However, the thermal barrier was decreased.

• Journal of the Korean Solar Energy Society
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• v.28 no.4
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• pp.10-16
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• 2008

The fire resistance of thermal insulation and interior finishing materials is recently much emphasized after the fire accident at the Icheon Cold Store in January 2008. Three kinds of thermal insulation are used in buildings. They are Organic, Non-organic and cellulosic insulation. Organic insulation such as polystyrene foam board and urethane foam has high thermal resistance but it has no fire resistance. While non-organic insulation such as rockwool and glassfiber has high fire resistance, it has lower thermal resistance than organic insulation. Cellulose insulation is primarily manufactured from recycled newsprint or cardboard using shredders and fiberizers. Despite of its environmental friendliness and high thermal resistivity, its domestic use has not much increased because of the prejudice that paper can easily burn. However, the cellulose insulation as a product is about 80 wt.% cellulosic fiber and 20 wt.% chemicals, most of which are fire retardants such as boric acid and ammonium sulfate. It is required to secure its fire safety for more consumption as a building insulation in Korea. Therefore, this study investigates the fire resistance of Korean cellulose insulation according to the rate of fire retardant and finally presents the optimum rate of fire retardant in cellulose as building insulation. The fire safety test was conducted according to the ASTM C 1485-00. The test results indicate that above 18 wt% of fire retardant is necessary to secure the fire safety of cellulose insulation.

• Composites Research
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• v.32 no.5
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• pp.290-295
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• 2019

In the present study, composite insulation mat was reinforced over polyurethane foam (PUF) to improve the thermal performance and impact resistance of the PUF applied to the liquefied natural gas carrier insulation system. The composite insulation mat used Kevlar, aerogel, and cryogel composite mat that can be applied in a cryogenic environment. The thermal conductivity was measured at $20^{\circ}C$ to investigate the thermal performance, and the drop impact test was carried out under impact energy of 30 J at $20^{\circ}C$, $-163^{\circ}C$ to investigate the impact resistance. The measured thermal performance was compared with neat PUF through effective thermal conductivity theoretical value. The shock resistance was evaluated of contact force, contact time, and absorb energy. In experimental results, cryogel composite mat was the best performance in terms of thermal performance, and aerogel composite mat was the best performance in terms of impact resistance.

• Journal of the Korean Ceramic Society
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• v.50 no.2
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• pp.127-133
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• 2013

Porcelain with high thermal shock resistance was successfully fabricated by a lithium solution infiltration method with a lithium hydroxide solution. Lithium hydroxide solutions having various lithium concentrations were infiltrated into pre-sintered porcelain bodies. The porcelain sample infiltrated by the 9 wt% lithium solution and heat treated at $1250^{\circ}C$ for 1 h showed a low thermal expansion coefficient of $1.0{\times}10^{-6}/^{\circ}C$ with excellent thermal shock resistance. The highly thermally resistant porcelain had a well-developed ${\beta}$-spodumene phase with the general phases observed in porcelain. Furthermore, the porcelain showed a denser structure of $2.41g/cm^3$ sintering density and excellent whiteness in comparison with commercial thermally resistible porcelains. The lithium hydroxide in the samples readily reacted with moisture, and liquid phase reactants were formed during the fabrication process. In the case of an excess amount of lithium in the sample body, the lithium reactants were forced to the surface and re-crystallized at the surface, leaving large pores beneath the surface. These phenomena resulted in an irregular structure in the surface area and led to cracking in samples subjected to a thermal shock test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.234-239
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• 2011

In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1075-1080
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• 2006

Purpose of this study is proposal of estimating method about window thermal performance that based on KS F 2278 'Test method of thermal resistance for windows and doors' due to material composition of PVC frame window. First step of this study is research of present state about material composition of PVC frame window. Second is selection of main effective elements about window thermal resistance. For example, composition of Glazing, Frame area ratio of total window area, frame width, opening type, area of heat transfer and so on. Third is multiple regression analysis about thermal performance of PVC frame window due to main effective elements. It produces equations of multiple regression analysis due to opening type. Case of sliding window is $Y=0.149+0.034X_g+0.248X_{far}$, 4track sliding is $Y=0.584+0.175X_g+1.355X_{far}-0.008X_{fw}$, Tilt & Turn window is $Y=-0.161+0.076X_g+0.576X_{far}+0.0008X_{fw}$.

• Korean Journal of Materials Research
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• v.29 no.7
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• pp.443-450
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• 2019

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.11
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• pp.59-65
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• 2015

By harnessing the thermal hysteresis behavior of vanadium dioxide($VO_2$), we demonstrated multi-resistance states in a two-terminal electronic device based on a $VO_2$ thin film by using a 966nm infrared laser diode as an excitation light source for resistance modulation. Before stimulating the device using 966nm laser pulses, the thermal hysteresis behavior of the device resistance was measured by using a temperature chamber. After that, the $VO_2$ device was thermally biased at ${\sim}71.6^{\circ}C$ so that its temperature fell into the thermal hysteresis region of the device resistance. Six multi-states of the device resistance could be obtained in the fabricated $VO_2$ device by five successive laser pulses with equal 10ms duration and increasing power. Each resistance states were maintained while the temperature bias was applied. And, the resistance fluctuation level was within 2.2% of the stabilized resistance and decreased down to less than 0.9% of the stabilized resistance 5s after the illumination.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.30-34
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• 2002

In this Paper, Insulation of current lead in the conduction-cooled DC reactor for the 1.2kV class 3 high-Tc superconducting fault current limiter(SFCL) is studied. Thermal link which conducts heat energy but insulates electrical energy is selected as a insulating device for the current lead in the conduction-cooled Superconducting DC reactor. It consists of oxide free copper(OFC) sheets, Polyimide films, glass fiberglass reinforced Plastics (GFRP) plates and interfacing material such an indium or thermal compound. Through the test of dielectric strength in L$N_2$, polyimide film thickness of 125 ${\mu}{\textrm}{m}$ is selected as a insulating material. Electrical insulation and heat conduction are contrary to each other. Because of low heat conductivity of insulator and contact area between electrical insulator and heat conductor, thermal resistance of conduction-cooled system is increased. For the reducing of thermal resistance and the reliable contact between Polyimide and OFC, thermal compound or indium can be used As thermal compound layer is weak layer in electrical field, indium is finally selected for the reducing of thermal resistance. Thermal link is successfully passed the test. The testing voltage was AC 2.5kVrms and the testing time was 1 hour.