• Title/Summary/Keyword: Thermal reliability

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Power Line Detection of Arial Images Using Hough Transform (하프변환을 이용한 항공영상의 전력선 검출)

  • Kim, Dong-Wook;Kang, Jeong-Hyuck
    • The Journal of the Korea institute of electronic communication sciences
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    • v.5 no.2
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    • pp.171-179
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    • 2010
  • Effective monitoring and maintenance operation of towers, power lines and other defects to ensure high quality and reliability of electric power supplied to customers is becoming one of the most important tasks of today's power industry. One specific technology that has the potential to automate the entire surveillance process is unmanned aerial vehicles. In this paper, we propose a new power line extraction method using the directivity of a power line and Hough transform to detect efficiently power lines from thermal aerial images. In simulation results for several aerial images, the proposed method shows good performance in extracting power line detection.

Performance Test of Turbine Flowmeter According to Temperature Variation (온도변화에 따른 터빈유량계의 성능 시험)

  • Nam, Ki Han;Park, Jong Ho;Kim, Hong Jip
    • The KSFM Journal of Fluid Machinery
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    • v.20 no.2
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    • pp.47-52
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    • 2017
  • In general industry, TFM(turbine flow meters) as measuring instruments having high reliability are widely used in the trade of petroleum and in the measurement of tap water and hot water. The TFM is performed calibration for using in the field and is mainly calibrated at room temperature. Since accuracy of TFM depends on Reynolds number of fluid, TFM is calibrated at same Reynolds number by changing flow rate. Furthermore, the TFM using a fluid of high temperature should have considered for other factors such as the thermal expansion of the parts and characteristics change is unknown changes in the turbine flow meter accordingly. In this paper, two turbine flowmeter are experimentally studied about characteristics change using the facilities which can change fluid temperature from 6 degree celsius to 90 degree celsius. As a result, the turbine flow meter can be calibrated to minimize the error characteristic at a similar temperature and the actual temperature.

Study on Optimization of Dissimilar friction Welding of Nuclear Power Plant Materials (Cu Alloy/STS316L) and Its Real Time AE Evaluation (원자력 발전소용 이종재(Cu 합금/STS316L) 마찰용접의 최적화와 AE에 의한 실시간 평가에 관한 연구)

  • 유인종;권상우;황성필;공유식;오세규
    • Journal of Ocean Engineering and Technology
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    • v.15 no.2
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    • pp.88-93
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    • 2001
  • In this paper, joints of Cu-1Cr-0.1Zr alloy to STS316L were performed by friction welding method. Particularly, Cu-1Cr-0.1Zr alloy is attractive candidate as nuclear power plant material and exibit the best combination of high strength and good electrical and thermal conductivity of any copper alloy examined. The stainless steel is a structural material while copper alloy acts as a heat sink material for the surface heat flux in the first wall. So, in this paper, not only the development of optimizing of friction welding with more reliability and more applicability but also the development of in-process real-time weld quality (such as strength and toughness) evaluation technique by acoustic emission for friction welding of such nuclear reactor component of Cu-1Cr-0.1Zr alloy to STS316L steel sere performed.

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Synthesis of $\alpha$-Sialon Ceramics from an Alkoxide and Their Mechanical Properties(II) (알콕사이드로 부터 $\alpha$-Sialon 세라믹스의 제조 및 기계적 성질(II))

  • 이홍림;윤창현
    • Journal of the Korean Ceramic Society
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    • v.28 no.3
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    • pp.189-196
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    • 1991
  • Si(OC2H5)4, commercial AlN and Y2O3 powder were used as the precusor of Si3N4, AlN, Y2O3, respectively. After Si3N4 powder was synthesized by carbothermal reduction and nitridation at 135$0^{\circ}C$ for 13h in N2 atmosphere, characteristics of synthesized powder and the ceramics sintered at 178$0^{\circ}C$ for 1h under 30MPa were investigated. In order to evaluate the reliability of sintered body, Weibull modulus was investigated. Premixing of carbon black as a reduction agent had no effect on Si(OH)4 formation, and Si3N4 powder synthesized from Si(OC2H5)4 was $\alpha$-Si3N4 single phase. Mechanical properties of sintered body were measured as follows : flexural strength ; 750MPa, fracture toughness ; 3.71Mn/3/2, hardness : 17.4GPa, thermal shock resistence temperature ; $600^{\circ}C$. Flexural strength at room temperature was 750MPa and was retained up to 110$0^{\circ}C$. The Weibull modulus of sintered body was 10.7.

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Fabrication of Porous Reaction Bonded Silicon Carbide with Multi-Layered Pore Structures (다층 기공구조를 갖는 다공성 반응소결 탄화규소 다공체 제조)

  • Cho, Gyoung-Sun;Kim, Gyu-Mi;Park, Sang-Whan
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.534-539
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    • 2009
  • Reaction Bonded Silicon Carbide(RBSC) has been used for engineering ceramics due to low-temperature fabrication and near-net shape products with excellent structural properties such as thermal shock resistance, corrosion resistance and mechanical strength. Recently, attempts have been made to develop hot gas filter with gradient pore structure by RBSC to overcome weakness of commercial clay-bonded SiC filter such as low fracture toughness and low reliability. In this study a fabrication process of porous RBSC with multi-layer pore structure with gradient pore size was developed. The support layer of the RBSC with multi-layer pore structure was fabricated by conventional Si infiltration process. The intermediate and filter layers consisted of phenolic resin and fine SiC powder were prepared by dip-coating of the support RBSC in slurry of SiC and phenol resin. The temperature of $1550^{\circ}C$ to make Si left in RBSC support layer infiltrate into dip-coated layer to produce SiC by reacting with pyro-carbon from phenol resin.

Pressure Contact Interconnection for High Reliability Medium Power Integrated Power Electronic Modules

  • Yang, Xu;Chen, Wenjie;He, Xiaoyu;Zeng, Xiangjun;Wang, Zhaoan
    • Journal of Power Electronics
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    • v.9 no.4
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    • pp.544-552
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    • 2009
  • This paper presents a novel spring pressure contact interconnect technique for medium power integrated power electronics modules (IPEMs). The key technology of this interconnection is a spring which is made from Be-Cu alloy. By means of the string pressure contact, sufficient press-contact force and good electrical interconnection can be achieved. Another important advantage is that the spring exhibits excellent performance in enduring thermo-mechanical stress. In terms of manufacture procedure, it is also comparatively simple. A 4 kW half-bridge power inverter module is fabricated to demonstrate the performance of the proposed pressure contact technique. Electrical, thermal and mechanical test results of the packaged device are reported. The results of both the simulation and experiment have proven that a good performance can be achieved by the proposed pressure contact technique for the medium power IPEMs.

DEVELOPMENT OF INTERFACIAL AREA TRANSPORT EQUATION

  • ISHII MAMORU;KIM SEUNGJIN;KELLY JOSEPH
    • Nuclear Engineering and Technology
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    • v.37 no.6
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    • pp.525-536
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    • 2005
  • The interfacial area transport equation dynamically models the changes in interfacial structures along the flow field by mechanistically modeling the creation and destruction of dispersed phase. Hence, when employed in the numerical thermal-hydraulic system analysis codes, it eliminates artificial bifurcations stemming from the use of the static flow regime transition criteria. Accounting for the substantial differences in the transport mechanism for various sizes of bubbles, the transport equation is formulated for two characteristic groups of bubbles. The group 1 equation describes the transport of small-dispersed bubbles, whereas the group 2 equation describes the transport of large cap, slug or chum-turbulent bubbles. To evaluate the feasibility and reliability of interfacial area transport equation available at present, it is benchmarked by an extensive database established in various two-phase flow configurations spanning from bubbly to chum-turbulent flow regimes. The geometrical effect in interfacial area transport is examined by the data acquired in vertical fir-water two-phase flow through round pipes of various sizes and a confined flow duct, and by those acquired In vertical co-current downward air-water two-phase flow through round pipes of two different sizes.

2.22-inch qVGA a-Si TFT-LCD Using a 2.5 um Fine-Patterning Technology by Wet Etch Process

  • Lee, Jae-Bok;Park, Sun;Heo, Seong-Kweon;You, Chun-Ki;Min, Hoon-Kee;Kim, Chi-Woo
    • Journal of Information Display
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    • v.7 no.3
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    • pp.1-4
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    • 2006
  • 2.22-inch qVGA $(240{\times}320)$ amorphous silicon thin film transistor liquid active matrix crystal display (a-Si TFT-AMLCD) panel has been successfully demonstrated employing a 2.5 um fine-patterning technology by a wet etch process. Higher resolution 2.22-inch qVGA LCD panel with an aperture ratio of 58% can be fabricated as the 2.5 um fine pattern formation technique is integrated with high thermal photo-resist (PR) development. In addition, a novel concept of unique a-Si TFT process architecture, which is advantageous in terms of reliability, was proposed in the fabrication of 2.22-inch qVGA LCD panel. Overall results show that the 2.5 um fine-patterning is a considerably significant technology to obtain higher aperture ratio for higher resolution a-Si TFT-LCD panel realization.

Assessment of 23 kV Capacitive Coupler for On-line Partial Discharge Measurements

  • Jeong, J.Y.;Kang, D.S.;Sun, J.H.;Heo, J.C.;Park, C.H.
    • Journal of Electrical Engineering and Technology
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    • v.4 no.1
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    • pp.123-130
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    • 2009
  • The partial discharge (PD) measurement is a very effective method to assess the winding insulation condition of high-voltage machines, since most of the insulation failure processes are directly or indirectly caused by PD. On-line PD measurements, which can detect insulation defects of winding in the early stages on rotating machines in operation, have been accepted as the most important technique. The epoxy mica capacitive coupler is currently and extensively used for on-line detection of PD pulses of high-voltage rotating machines. To evaluate the feasibility of developing a capacitive coupler that is easier to manufacture at a lower cost compared to epoxy mica couplers, a 100pF capacitive coupler made of ceramic material is designed, fabricated and tested for on-line PD measurements of 23 kV electrical machines. A series of electrical tests and accelerated aging tests are performed on the ceramic coupler to evaluate the performance requirements, long-term reliability and thermal stability for in field application. The test results show that the newly developed ceramic coupler provides equal and improved performance at a lower cost compared to epoxy mica couplers, and estimated voltage life is anticipated to surpass 100 years.

Aging Characteristics of Solder bump Joint for High Reliability Optical module (광모듈 솔더 접합부의 시효 특성에 관한 연구)

  • Kim, Nam-Kyu;Kim, Kyung-Seob;Kim, Nam-Hoon;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.204-207
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    • 2003
  • The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

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