Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2003.05c
- /
- Pages.204-207
- /
- 2003
Aging Characteristics of Solder bump Joint for High Reliability Optical module
광모듈 솔더 접합부의 시효 특성에 관한 연구
- Kim, Nam-Kyu (ChungAng Uni.) ;
-
Kim, Kyung-Seob
(YeoJoo Uni.) ;
- Kim, Nam-Hoon (ChungAng Uni.) ;
-
Chang, Eui-Goo
(ChungAng Uni.)
- Published : 2003.05.16
Abstract
The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the