• 제목/요약/키워드: Thermal reliability

검색결과 1,063건 처리시간 0.024초

슬러리 펌프의 신뢰성 향상 (Reliability Evaluation of a Slurry Pump)

  • 정동수
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제16권4호
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    • pp.263-271
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    • 2016
  • Purpose: A slurry pump for flue gas desulfurization system performs a role that discharges the slurry of a plaster shape in a thermal power plant. Since a slurry pump transfers the slurry by the centrifugal force, it has the friction wear in the impeller and liner because of the slurry. Methods: In this study, failure analysis and test evaluation on the slurry pump have been proposed and the process that reliability of the product improves through design improvement has been presented. And failure cause of typical failure case has been investigated and improvement design has been presented. Results: Reliability improvement is established by analysis of the test results of before and after acceleration test. Conclusion: This study can be provided to improve the product reliability through failure analysis of a slurry pump.

열전도 환경을 고려한 전장탑재물의 소자 열 해석 (Thermal Analysis of Electronic Devices in an Onboard Unit Considering Thermal Conduction Environment)

  • 김주년;김보관
    • 전자공학회논문지SC
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    • 제43권5호
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    • pp.60-67
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    • 2006
  • 우주 비행체 전자장비의 신뢰도를 예측하고 최적화하기 위해 탑재장치 내 부품의 온도 예측이 필수적으로 요구된다. 본 논문에서는 전자장비 부품의 온도 예측방법에 관해 기술하고 있다. 본 예측 방법은 PCB 기판의 열전도도를 등방성모델로 설정하여 등가 열전도도를 계산하고 열력 모델을 이용하여 열 저항 행렬을 생성하였으며, 중첩의 원리를 이용하여 각 부품들의 온도를 예측하였다. 또한 본 논문의 온도 예측방법을 이용하여 전장품 소자의 열해석 결과와 상용 프로그램을 이용한 온도 계산 결과를 비교 분석하였다.

Solid Epoxy를 이용한 패키지 및 솔더 크랙 신뢰성 확보를 위한 실험 및 수치해석 연구 (Experimental and Numerical Analysis of Package and Solder Ball Crack Reliability using Solid Epoxy Material)

  • 조영민;좌성훈
    • 마이크로전자및패키징학회지
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    • 제27권1호
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    • pp.55-65
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    • 2020
  • 반도체 패키지에서 언더필의 사용은 패키지의 응력 완화 및 습기 방지에 중요할 뿐만 아니라, 충격, 진동 시에 패키지의 신뢰성을 향상시키는 중요한 소재이다. 그러나 최근 패키지의 크기가 커지고, 매우 얇아짐에 따라서 언더필의 사용이 오히려 패키지의 신뢰성을 저하하는 현상이 발견되고 있다. 이러한 이슈를 해결하기 위하여 본 연구에서는 언더필을 대신 할 소재로서 solid epoxy를 이용한 패키지를 개발하여 신뢰성을 향상시키고자 하였다. 개발된 solid epoxy를 스마트 폰의 AP 패키지에 적용하여 열사이클링 신뢰성 시험과 수치해석을 통하여 패키지의 신뢰성을 평가하였다. 신뢰성 향상을 위한 최적의 solid epoxy 소재 및 공정 조건을 찾기 위하여 solid epoxy 의 사용 개수, PCB 패드 타입 및 solid epoxy의 물성 등, 3 개의 인자가 패키지의 신뢰성에 미치는 영향을 고찰하였다. Solid epoxy를 AP 패키지에 적용한 결과 solid epoxy가 없는 경우 보다, solid epoxy를 적용한 경우가 신뢰성이 향상되었다. 또한 solid epoxy를 패키지의 외곽 4곳에 적용한 경우 보다는 6 곳에 적용한 경우가 더 신뢰성이 좋음을 알 수 있었다. 이는 solid epoxy가 패키지의 열팽창에 따른 응력을 완화 시키는 역할을 하여 패키지의 신뢰성이 향상되었음을 의미한다. 또한 PCB 패드 타입에 대한 신뢰성을 평가한 결과 NSMD (non-solder mask defined) 패드를 사용할 경우가 SMD (solder mask defined) 패드 보다 신뢰성이 더 향상됨을 알 수 있었다. NSMD 패드의 경우 솔더와 패드가 접합하는 면적이 더 크기 때문에 구조적으로 안정하여 신뢰성 측면에서 더 유리하기 때문이다. 또한 열팽창계수가 다른 solid epoxy를 적용하여 신뢰성 평가를 한 결과, 열팽창계수가 낮은 solid epoxy를 사용한 경우가 신뢰성이 더 향상됨을 알 수 있었다.

원자력 구조재 신뢰성 향상을 위한 열피로 균열 시험편 제작 기법 개발 (Development the Technique for Fabrication of the Thermal Fatigue Crack to Enhance the Reliability of Structural Component in NPPs)

  • 김용;김재성;이보영
    • Journal of Welding and Joining
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    • 제26권2호
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    • pp.43-49
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    • 2008
  • Fatigue cracks due to thermal stratification or corrosion in pipelines of nuclear power plants can cause serious problems on reactor cooling system. Therefore, the development of an integrated technology including fabrication of standard specimens and their practical usage is needed to enhance the reliability of nondestructive testing. The test material was austenitic STS 304, which is used as pipelines in the Reactor Coolant System of a nuclear power plants. The best condition for fabrication of thermal fatigue cracks at the notch plate was selected using the thermal stress analysis of ANSYS. The specimen was installed from the tensile tester and underwent continuos tension loads of 51,000N. Then, after the specimen was heated to $450^{\circ}C$ for 1 minute using HF induction heater, it was cooled to $20^{\circ}C$ in 1 minute using a mixture of dry ice and water. The initial crack was generated at 17,000 cycles, 560 hours later (1cycle/2min.) and the depth of the thermal fatigue crack reached about 40% of the thickness of the specimen at 22,000 cycles. As a results of optical microscope and SEM analysis, it is confirmed that fabricated thermal fatigue cracks have the same characteristics as real fatigue cracks in nuclear power plants. The crack shape and size were identified.

고압 커패시터의 고장분석과 신뢰성 평가 (Reliability Evaluation and failure Analysis for High Voltage Ceramic Capacitor)

  • 김진우;송옥병;신승우;이희진;신승훈;유동수
    • 한국신뢰성학회:학술대회논문집
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    • 한국신뢰성학회 2001년도 정기학술대회
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    • pp.337-337
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    • 2001
  • High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

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Sn-Cu-Ni계를 이용한 Pb-free Wave Soldering의 공정 적용 및 신뢰성에 관한 연구 (A Study on the Implementation of Wave Soldering Process and the Solder Joint Reliability Using Sn-Cu-Ni Lead-free Solder)

  • 유충식;정종만;김진수;김미진;이종연
    • 마이크로전자및패키징학회지
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    • 제8권4호
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    • pp.47-52
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    • 2001
  • Sn-Cu-Ni계 솔더를 이용한 AC Adapter의 Pb-Free Wave 솔더링 공정을 Six Sigma기법으로 개발하였다. 솔더 접합부의 외관, 미세조직, Lift-off현상 및 Crack발생 유.무를 관찰하여 접합기구를 규명하고자 하였으며 열 충격시험을 통하여 신뢰성평가를 수행하였다. 솔더 접합부의 Sn-Cu-Ni계 솔더와 Cu Land 사이에는 약 5 $\mu\textrm{m}$ 두께의 $(Cu,Ni)_6/Sn_5$ 형태의 금속간화합물이 발견되었고 열 충격후 750사이클까지는 Crack이 발견되지 않았다. 본 연구로 개발된 제품은 기존의 Sn-Pb솔더를 사용한 제품에 비해서 양산성 및 신뢰성 측면에서 우수한 특성을 나타내었다.

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The Reliability of Optical Fiber Assembly Using Glass Solder

  • Lee, Jong-Jing;Kang, Hyun-Seo;Koh, Jai-Sang
    • 한국신뢰성학회:학술대회논문집
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    • 한국신뢰성학회 2004년도 정기학술대회
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    • pp.147-151
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    • 2004
  • In this study, an optical fiber assembly directly coupled with a laser diode or a photo diode is designed to confirm high reliable optical coupling efficiency of optical transmitter(Tx) and receiver(Rx). The optical fiber assembly is fabricated by soldering an optical fiber and a Kovar ferrule using a glass solder after inserting an optical fiber through a Kovar ferrule. The Kovar which has good welding characteristics is applied to introduce laser welding technique. The glass solder has excellent thermal characteristics such as thermal shift delamination compared with PbSn, AuSn solder previously used usually. Furthermore, the glass solder doesn't need fiber metalization and this enables low cost fabrication. However, the glass soldering is high temperature process over 35$0^{\circ}C$ and the convex shape after solidification due to surface tension causes the stress concentration on optical fiber. The stress concentration on the optical fiber increases the optical insertion loss and possibility of crack formation. The shape of glass solder was designed referring to 2-D Axi-symmetric FEM simulation. To test the mechanical reliability, mechanical vibration test and shock test were done according to Telcorida GR-468-Core protocol. After each test, the optical loss of the stress distributed fiber assembly didn't exceed 0.5 dB, which passes the test.

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Reliability Evaluation of Power System Operations Considering Time-Varying Features of Components

  • Hu, Bo;Zheng, Ying;Yang, Hejun;Xia, Yun
    • Journal of Electrical Engineering and Technology
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    • 제10권4호
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    • pp.1422-1431
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    • 2015
  • The reliability of power system components can be affected by a numbers of factors such as the health level of components, external environment and operation environment of power systems. These factors also affect the electrical parameters of power system components for example the thermal capacity of a transmission element. The relationship of component reliability and power system is, therefore, a complex nonlinear function related to the above-mentioned factors. Traditional approaches for reliability assessment of power systems do not take the influence of these factors into account. The assessment results could not, therefore, reflect the short-term trend of the system reliability performance considering the influence of the key factors and provide the system dispatchers with enough information to make decent operational decisions. This paper discusses some of these important operational issues from the perspective of power system reliability. The discussions include operational reliability of power systems, reliability influence models for main performance parameters of components, time-varying reliability models of components, and a reliability assessment algorithm for power system operations considering the time-varying characteristic of various parameters. The significance of these discussions and applications of the proposed techniques are illustrated by case study results using the IEEE-RTS.

보일러-터빈 제어시스템의 측정기 고장검출 (A Sensor Fault Detection for Boiler-Turbine Control System)

  • 류석환
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제14권1호
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    • pp.37-43
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    • 2014
  • This paper deals with a design of observer based fault detection filter for a boiler-turbine control system. The goal is to present a method for rapid sensor fault detection in order to enhance the reliability of boiler-turbine operation in the thermal power plant. Our fault detection filter can be designed via solutions of linear matrix inequalities. In order to demonstrate the efficacy of our design method, numerical simulations are provided.

안료제조시 중화공정의 열안정성 평가 (Evaluation of Thermal Stability in Neutralization Process of Pigment Plant)

  • 이근원;한인수;박상현
    • 한국안전학회지
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    • 제22권4호
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    • pp.43-50
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    • 2007
  • Lack of understanding of the process chemistry and thermodynamics are the major reasons that can is lead to thermal runaway reaction in the chemical reaction process. The evaluation of reaction factors and thermal behavior in neutralization process of pigment plant are described in this paper. The experiments were performed in the C 80 calorimeter, and Thermal Screening Unit($TS^{u}$). The aim of the study was to evaluate the results of thermal stability in terms of safety reliability to be practical applications. It suggested that we be proposed safe operating conditions and securities for accident prevention through this study.