• Title/Summary/Keyword: Thermal output

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Fabriaction of bump bounded piezoresistive silicon accelerometer (범프 본딩된 압저항 실리콘 가속도센서의 제조)

  • 심준환;이상호;이종현
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.7
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    • pp.30-36
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    • 1997
  • Bump bonded piezoesistive silicon accelerometer was fabricated by the porous silicon micromachining and th eprocess technique of integrated circuit. The output voltage of the accelerometer fabricated on (111)-oreiented Si substrates with n/n$^{+}$n triple layers showed good linear characteristic of less than 1%. The measured sensitivity and the resonant frequency was about 743 .mu.V/g and 2.04 kHz, respectively. And the transverse sensitivity of 5.2% was measured from the accelerometer. Also, to investigate an influence on the output characteristics of the sensor due to bump bonding, the values of the piezoresistors were measured through thermal-cycling test in the temperature variation form -50 to 120.deg. C. Then, there was 0.014% resistance changes about 3.61 k.ohm., so sthe output charcteristics of the sensor was less affected by bump bonding.g.

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Multi-kilowatt Single-mode Ytterbium-doped Large-core Fiber Laser

  • Jeong, Yoon-Chan;Boyland, Alexander J.;Sahu, Jayanta K.;Chung, Seung-Hwan;Nilsson, Johan;Payne, David N.
    • Journal of the Optical Society of Korea
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    • v.13 no.4
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    • pp.416-422
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    • 2009
  • We have demonstrated a highly efficient cladding-pumped ytterbium-doped fiber laser, generating $>$2.1 kW of continuous-wave output power at 1.1 μm with 74% slope efficiency with respect to launched pump power. The beam quality factor ($M^2$) was better than 1.2. The maximum output power was only limited by available pump power, showing no evidence of roll-over even at the highest output power. We present data on how the beam quality depends on the fiber parameter, based on our current and past fiber laser developments. We also discuss the ultimate power-capability of our fiber in terms of thermal management, Raman nonlinear scattering, and material damage, and estimate it to 10 kW.

Adaptive Fuzzy Output Feedback Control based on Observer for Nonlinear Heating, Ventilating and Air Conditioning System

  • Baek, Jae-Ho;Hwang, Eun-Ju;Kim, Eun-Tai;Park, Mi-gnon
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.9 no.2
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    • pp.76-82
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    • 2009
  • A Heating, Ventilating and Air Conditioning (HVAC) system is a nonlinear multi-input multi-output (MIMO) system. This system is very difficult to control the temperature and the humidity ratio of a thermal space because of complex nonlinear characteristics. This paper proposes an adaptive fuzzy output feedback control based on observer for the nonlinear HVAC system. The nonlinear HVAC system is linearized through dynamic extension. State observers are designed for estimating state variables of the HVAC system. Fuzzy systems are employed to approximate uncertain nonlinear functions of the HVAC system with unavailable state variables. The obtained controller compares with an adaptive feedback controller. Simulation is given to demonstrate the effectiveness of our proposed adaptive fuzzy method.

Direct Power Control Scheme of Improved Command Tracking Capability for PMSG MV Wind turbines

  • Kwon, Gookmin;Suh, Yongsug
    • Proceedings of the KIPE Conference
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    • 2015.07a
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    • pp.361-362
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    • 2015
  • This paper proposes a Direct Power Control (DPC) scheme of improved command tracking capability for Permanent Magnet Synchronous Generator (PMSG) Medium Voltage (MV) Wind Turbines. Benchmarking is performed based on a neutral point clamped three-level back-to-back type voltage source converter. It is introduced to design the DPC modeling and propose DPC scheme of a three-level NPC (3L-NPC) converter. During the fault condition in wind farms, the proposed control scheme directly controls the generated output power to the command value from the hierarchical wind farm controller. The proposed control scheme is compared with conventional control scheme as respect to loss and thermal analysis. The DPC scheme of improved command tracking capability is confirmed through PLECS simulations. Simulation result shows that proposed control scheme achieves a much shorter transient time in a step response of generated output power. The proposed control scheme makes it possible to provide a good dynamic performance for PMSG MV wind turbine to generate a high quality output power under grid fault condition.

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Calculation of Required Coolant Flow Rate for Photovoltaic-thermal Module Using Standard Meteorological Data and Thermal Analysis (표준기상 데이터와 열해석을 이용한 태양광열 모듈의 필요 냉각수량 산출)

  • Lee, Cheonkyu;Jeong, Hyo Jae
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.4
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    • pp.18-22
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    • 2022
  • Photovoltaics (PV) power generation efficiency is affected by meteorological factors such as temperature and wind speed. In general, it is known that the power generation amount decreases because photovoltaics panel temperature rises and the power generation efficiency decreases in summer. Photovoltaics Thermal (PVT) power generation has the ad-vantage of being able to produce heat together with power, as well as preventing the reduction in power generation efficien-cy and output due to the temperature rise of the panel. In this study, the amount of heat collected by season and time was calculated for photovoltaics thermal modules using the International Weather for Energy Calculations (IWEC) data provided by the American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE). Based on this, we propose a method of predicting the temperature of the photovoltaics panel using thermal analysis and then calculating the flow rate of coolant to improve power generation efficiency. As the results, the photovoltaics efficiencies versus time on January, April, July, and October in Jeju of the Republic of Korea were calculated to the range of 15.06% to 17.83%, and the maxi-mum cooling load and flow rate for the photovoltaics thermal module were calculated to 121.16 W and 45 cc/min, respec-tively. Though this study, it could be concluded that the photovoltaics thermal system can be composed of up to 53 modules with targeting the Jeju, since the maximum capacity of the coolant circulation pump of the photovoltaics thermal system applied in this study is 2,400 cc/min.

Analyses of temperature change of a u-bolometer in Focal Plane Array with CTIA bias cancellation circuit (CTIA 바이어스 상쇄회로를 갖는 초점면 배열에서 마이크로 볼로미터의 온도변화 해석)

  • Park, Seung-Man
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.12
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    • pp.2311-2317
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    • 2011
  • In this paper, we study the temperature change of a ${\mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${\mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${\mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{\mu}m$ pitch $320{\times}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${\mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{\circ}C$, while the temperature increase by a pulsed bias as $7.1^{\circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${\mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.

Study on Chip on Chip Technology for Minimizing LED Driver ICs (LED Driver ICs칩의 소형화를 위한 Chip on Chip 기술에 관한 연구)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.3
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    • pp.131-134
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    • 2016
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.