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http://dx.doi.org/10.5370/KIEE.2011.60.12.2311

Analyses of temperature change of a u-bolometer in Focal Plane Array with CTIA bias cancellation circuit  

Park, Seung-Man (호서대학교 국방과학기술학과)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.60, no.12, 2011 , pp. 2311-2317 More about this Journal
Abstract
In this paper, we study the temperature change of a ${\mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${\mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${\mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{\mu}m$ pitch $320{\times}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${\mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{\circ}C$, while the temperature increase by a pulsed bias as $7.1^{\circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${\mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.
Keywords
${\mu}$-bolometer; FPA; Thermal analyses; CTIA bias cancellation circuit; High speed operation;
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