• Macromolecular Research
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• v.14 no.1
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• pp.1-33
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• 2006

Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical resistance properties due to their heterocyclic imide rings and aromatic rings on the backbone. Due to these advantageous properties, PIs have found diverse applications in industry. Most PIs are insoluble because of the nature of the high chemical resistance. Thus, they are generally used as a soluble precursor polymer, which forms complexes with solvent molecules, and then finally converts to the corresponding polyimides via imidization reaction. This complexation with solvent has caused severe difficulty in the characterization of the precursor polymers. However, significant progress has recently been made on the detailed characterization of PI precursors and their imidization reaction. On the other hand, much research effort has been exerted to reduce the dielectric constant of PIs, as demanded in the microelectronics industry, through chemical modifications, as well as to develop high performance, light-emitting PIs and liquid crystal (LC) alignment layer PIs with both rubbing and rubbing-free processibility, which are desired in the flat-panel display industry. This article reviews this recent research progresses in characterizing PIs and their precursors and in developing low dielectric constant, light-emitting, and LC alignment layer PIs.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.979-984
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• 1999

Aromatic soluble polyimides were synthesized from 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and various dianhydrides such as pyromelltic dianhydride(PMDA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride(BTDA), and 4,4'-(hexafluoroisopropylidene)-bis(phthalic anhydride)(6FDA). Polyimides prepared by thermal imidization were insoluble in common organic solvents (acetone, MNP, DMAc, DMSO, THF, and DMF) but those prepared by chemical imidization were soluble. The difference of solubility was explained by esterification between hydroxyl group and $CH_3COO^-$ from acetic anhydride used as a dehydration agent in chemical imidization. Glass transition temperatures of polyimides by thermal method were higher than those by chemical method. All of the polyimides are stable up to $300^{\circ}C$ regardless of the sample preparation. The x-ray diffraction patterns showed that all polyimides were amorphrous.

• Polymer(Korea)
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• v.30 no.2
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• pp.158-161
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• 2006

Recently the application of plastic optical fiber (POF) in automotives and planes demands the heat-resistant and high refractive index con materials. We synthesized polyglutarimides (PGIs) via imidization of PMMA with primary amines under high pressure and high temperature and investigated thermal and optical properties by varying the molar ratio of amines and the type of amines (ethyl amine vs. isopropyl mine). The degree of imidization was calculated based on the peak intensity in $^1H$ NMR and FTIR. We found that the glass transition temperature $(T_g)$ of PGIs increased over $30^{\circ}C$ compared to the traditional core materials in POF, PMMA, and they are stable up to $300\sim400^{\circ}C$. PGIs anthesized with ethyl mine show the better heat resistance than those with isopropyl amines. Additionally, they show the comparable transparency and higher refractive index than PMMA. It implies that they can be utilized as the excellent photo-efficient and heat-resistant core materials in POF.

• Applied Chemistry for Engineering
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• v.5 no.5
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• pp.756-763
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• 1994

Using 2,2-Bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, 2,2-bis-[4-(4-aminophenoxy)phenyl] hexafluoropropane and 4,4-diaminodiphenyl ether, the homopolyamic acids, copolyamic acids and blend of homopolyamic acids were prepared and converted to polyimide(PI)s by thermal imidization. In results, it has been found that a exchange reaction of polyamic acids can be occurred during thermal imidization. With measurement of mechanical properties, it was suggested that PI/PI molecular composite can be obtained by copolymerization or physical blending of homopolyamic acids.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.891-894
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• 2002

We studied characteristics of polyimide (PI) about Liquid Crystal on Silicon (LCOS) microdisplay. In order to compare two kinds of PI and choose one PI, we measured some items. First, we measured thermal imidization of SE-7492, SE-5291 (Nissan) PI using FT-IR. The results of thermal imidization are same 85%for SE-7492 and 86% for SE-5291. The second, we measured voltage-holding ratio (VHR) of LCOS imager using two kinds PI and one liquid crystal (LC) that is a mixture developed by Merck. The third, we measured contrast ratio (C/R) of LCOS imager using function generator from ov to 4V. The results of VHR and C/R are higher LCOS imager using SE-7492 than LCOS imager using SE-5291. And last we measured response time and the result is same two types LCOS Imagers. So, we choose PI of LCOS imager and concluded that LC is much better matched of PI using SE-7492.

• Textile Coloration and Finishing
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• v.8 no.2
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• pp.49-55
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• 1996

Poly(4, 4'-diphenyl ether pyromellitamic acid) was prepared from pyromellitic anhydride with 4, 4'-diamino diphenyl ether by means of low-temperature solution polymeriztion. The reation was exothermic and very fast when carried out at room temperature. The synthesized poly(4, 4'-diphenyl ether pyromellitamic acid) was converted to poly(4, 4'-diphenyl ether pyromellitimide) by thermal dehydrocyclization. FTIR analysis was widely used as a means of determining the course of imidization from intensity of characteristic bands of the imide ring at $1790cm^{-1}$ and $1490cm^{-1}$. The density of poly(4, 4'-diphenyl ether pyromellitimide) was higher than poly(4, 4'-diphenyl ether pyromellitamic acid) indicating the greater crystallinity, perhaps because of the reduction of molar volume of polymers

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.1
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• pp.75-79
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• 2000

In this study, we investigated the pretilt angle generation and liquid crystal (LC) alignment by ultravi-olet (UV) light irradiation during imidization of polymide. The generated pretilt angle of nematic (N) LC by using the in-situ photo-alignment method was smaller than that of the conventional UV photo-alignment method. Also, generated pretilt angle of NLC tends to increase by annealing. In case of using the polymer(AL-3046), we found that the in-situ Uv photo-alignment method has higher thermal stability of LC alignment, but it has a disadvantage to control pretilt angle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.533-536
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• 1999

In this study, we investigated pretilt angle generation and liquid crystal alignment by UV light irradiation during imidization of polyimide. Generated pretilt angle of NLC by using in-situ UV photo-alignment method was smaller than that of the conventional UV photo-alignment method. Also, generated pretilt angle of NLC tends to increase by annealing. We found that in-situ UV photo-alignment method has higher thermal stability of LC alignment, but it has a disadvantage to control pretilt angle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.05a
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• pp.99-102
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• 1994

The use of preformed polymers and their cross-linking have been a attempted in order to improve the intrinsic fraqility of monolayers and Langmuir-Blodgett (LB)films and to make their technological applications possible. It has shown that an imidization followed a polyion-complexation can stabilize the LB films against heat and solvents. And when the polymer structure was properly designed concurrent removal of the alkyl tails together with imide formation could be accomplished. In this paper we present a characteristic monolayer behavior of polymer with pendent polythers and carboxyls it’s polyion-complexed LB film with subphase polymer PAA and a possible skeletonization of the LB film by thermal imidization. Also deposition status of LB films are evaluated by using QCM

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.59-66
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• 1996

Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.