• Journal of Welding and Joining
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• 제21권3호
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 대한기계학회논문집
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• 제18권5호
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• pp.1192-1202
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• 1994

Fatigue behavior and life prediction were presented for thermal-mechanical and isothermal low cycle fatigue of 12Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test at 350 to 600.deg. C and isothermal low cycle fatigue test at 600.deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. Cyclic softening behavior was observed regardless of thermal-mechanical and isothermal fatigue tests. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. The difference in fatigue lives was dependent upon the magnitudes of inelastic strain ranges and mean stresses. Increase in inelastic strain range showed a tendency of intergranular cracking and decrease in fatigue life, especially for out-of-phase thermal-mechanical fatigue. Thermal-mechanical fatigue life prediction was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase thermal-mechanical fatigue lives, which was quite improved conservatively by a proposed strain range partitioning method.

• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• 한국정밀공학회지
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• 제11권4호
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• pp.114-125
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• 1994

Fatigue behavior and life prediction method were presented for themal-mechanical and isothermal low cycle fatigue of 12 Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test from 350 .deg. C to 600 .deg. C and isothermal low cycle fatigue test at 600 .deg. C, 475 .deg. C, 350 .deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. Thermal-mechanical fatigue life predication was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase range partitioning method in a conservative way. By the way life prediction of thermal-mechanical fatigue by Taira's equivalent temperature method and spanning fartor method showed good agreement within out-of-phase thermal-mechanical fatigue.

• 한국세라믹학회지
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• 제36권8호
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• pp.871-875
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• 1999

Theoretical equation to calculate thermal fatigue life was derived in which slow crack growth theory was adopted. The equation is function of crack growth exponent n. Cyclic thermal fatigue tests were performed at temperature difference of 175, 187 and 200$^{\circ}C$ respectively. At each temperature difference critical thermal fatigue life cycles of the alumina ceramics were 180,37 and 7 cycles. And theoretical thermal fatigue life cycles were calculated as 172, 35 and 7 cycles at the same temperature difference conditions. Therefore thermal fatigue behavior of alumina ceramics can be represented by derived equation. Also theoretical single cycle critical thermal shock temperature difference can be calculated by this equation and the result was consistent with the experimental result well.

• 한국세라믹학회지
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• 제30권3호
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• pp.229-235
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• 1993

Thermal history and thermal stress of alumina specimen, which occured from thermal shock process, were calculated by finite difference method. Stress intensity factor and crack growth in cyclic thermal fatigue were calculated from single thermal shock temperature history and thermal stress. Cyclic thermal life were estimated by bending strength after cyclic thermal shock under critical thermal shock temperature. Calculated stress intensity factor was compared with real experimental thermal fatigue life of specimen. Fatigue life until critical stress intensity factor and real experimental result were comparable.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.137-143
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• 2008

Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper describes the life prediction models for SnAgCu and SnPb solder joints, based upon non-linear finite element analysis (FEA). In case of analyses of the SnAgCu solder joints, two kinds of shapes are used. As a result, it is found that the SnAgCu solder has longer fatigue life than the SnPb solder in temperature cycling analyses.

• 한국생산제조학회지
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• 제19권2호
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• 한국신뢰성학회지:신뢰성응용연구
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• 제7권2호
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• pp.45-55
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• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.160-165
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• 2004

At this research, we examined probability of light bulb's life span value and prediction on purpose to inquire out the span of repeat velocity as fracture probability by executing the fatigue test, which is considered property of Tungsten filament's thermal fatigue used as an automobile bulb. As a result we can confirm what the most suitable solution is weibull distribution and log normal distribution. Tungsten filament's span gets longer as the fatigue repeat velocity gets shorter And, repeat span is about 15%~40% shorter than sequence life span.