한국공작기계학회논문집 (Transactions of the Korean Society of Machine Tool Engineers)

한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
권호 표지

BGA 형태 솔더 접합부의 피로 수명 예측에 관한 연구

Study on the Prediction of Fatigue Life of BGA Typed Solder Joints

  • 김성걸 (서울산업대학교 기계설계자동화공학부) ;
  • 김주영 (서울산업대학교 에너지 환경 대학원 나노 아이티 공학과)
  • 발행 : 2008.02.15
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초록

Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper describes the life prediction models for SnAgCu and SnPb solder joints, based upon non-linear finite element analysis (FEA). In case of analyses of the SnAgCu solder joints, two kinds of shapes are used. As a result, it is found that the SnAgCu solder has longer fatigue life than the SnPb solder in temperature cycling analyses.

키워드

참고문헌

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