• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.148-154
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• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

• Transactions on Electrical and Electronic Materials
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• 제9권4호
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• pp.137-142
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• 2008

The parasitic resistance is studied to silicon/metal contact junction for improving device performance and to lower contact/serial resistance silicide in natural sequence. In this paper constructs the stepwise Ni silicide process for parasitic resistance reduction for silicon/metal contact junction. We have investigated multi-step Ni silicide on SiGe substrate with stepwise annealing method as an alternative to compose more thermally reliable Ni silicide layer. Stepwise annealing for silicide formation is exposed to heating environment with $5^{\circ}C/sec$ for 10 seconds and a dwelling for both 10 and 30 seconds, and ramping-up and the dwelling was repeated until the final annealing temperature of $700\;^{\circ}C$ is achieved. Finally a direct comparison for single step and stepwise annealing process is obtained for 20 nm nickel silicide through stepwise annealing is $5.64\;{\Omega}/square$ at $600\;^{\circ}C$, and it is 42 % lower than that of as nickel sputtered. The proposed stepwise annealing for Ni silicidation can provide the least amount of NiSi at the interface of nickel silicide and silicon, and it provides lower resistance, higher thermal-stability, and superior morphology than other thermal treatment.

• 한국화재소방학회논문지
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• 제27권5호
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• pp.1-7
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• 2013

가연물의 증가는 건축물 화재의 발생 위험성과 재해발생 규모를 점차적으로 증대시키는 요인이 되고 있다. 따라서 강구조 건축물의 화재에 대비한 기술개발이 요구되었으며, 이 결과로 내화강재가 개발되었다. 본 연구에서는 FR 490강재의 고온 시 기계적, 열적 특성을 실험적으로 평가하고, 이 결과를 상온 시 구조적 내력이 동일한 용접구조용 강재인 SM 490과 상호 비교함으로써 고온 시의 내력유지 성능이 우수함을 확인하였다.

• Coupled systems mechanics
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• 제13권2호
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• pp.95-113
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• 2024

In this paper, we will analyse the thermo-elastic behavior of the plate element of a structure arranged in a climatically aggressive environment (extreme temperature), we use a refined four-variable thick plate theory to take the shear effect into consideration, the proposed theory less computationally expensive and more accurate so that it incorporates the shear effect into the formulation. The plate is assumed to be simply supported on its four edges, so exact (closed-form) solutions are found according to the Navier expansion, and the governing stability equations and associated boundary conditions of the problem are obtained via the virtual works principle. The plate studied ismade of laminated composite materials, so a parametric study is needed to see the effect of different types of parameters and coupling on the critical temperature value causing thermo-elastic instability of the plate and also on the natural frequency of free vibration, as well as for other parameters such as anisotropy, slenderness and aspect ratio of the plate and finally the lamination angle. Numerical results are obtained for specially orthotropic and antisymmetrical plates and are compared with those obtained by othertheoriesin the literature to validate the analysis approach used.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• 한국초전도ㆍ저온공학회논문지
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• 제8권3호
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

• Journal of Microbiology and Biotechnology
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• 제34권5호
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• pp.1119-1125
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• 2024

Phytase increases the availability of phosphate and trace elements by hydrolyzing the phosphomonoester bond in phytate present in animal feed. It is also an important enzyme from an environmental perspective because it not only promotes the growth of livestocks but also prevents phosphorus contamination released into the environment. Here we present a novel phytase derived from Turicimonas muris, TmPhy, which has distinctive structure and properties compared to other previously known phytases. TmPhy gene expressed in the Pichia system was confirmed to be 41 kDa in size and was used in purified form to evaluate optimal conditions for maximum activity. TmPhy has a dual optimum pH at pH3 and pH6.8 and exhibited the highest activity at 70℃. However, the heat tolerance of the wildtype was not satisfactory for feed application. Therefore, random mutation, disulfide bond introduction, and N-terminal mutation were performed to improve the thermostability of the TmPhy. Random mutation resulted in TmPhyM with about 45% improvement in stability at 60℃. Through further improvements, a total of three mutants were screened and their heat tolerance was evaluated. As a result, we obtained TmPhyMD1 with 46.5% residual activity, TmPhyMD2 with 74.1%, and TmPhyMD3 with 66.8% at 80℃ heat treatment without significant loss of or with increased activity.

• 한국재료학회지
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• 제26권12호
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• pp.733-740
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• 2016

$Al_2O_3$ nanosol dispersed under ethanol or N-Methyl-2-pyrrolidone(NMP) was studied and optimized with various dispersion factors and by utilizing the silane modification method. The two kinds of $Al_2O_3$ powders used were prepared by thermal decomposition method from aluminum ammonium sulfate$(AlNH_4(SO_4)_2)$ while controlling the calcination temperature. $Al_2O_3$ sol was prepared under ethanol solvent by using a batch-type bead mill. The dispersion properties of the $Al_2O_3$ sol have a close relationship to the dispersion factors such as the pH, the amount of acid additive(nitric acid, acetic acid), the milling time, and the size and combination of zirconia beads. Especially, $Al_2O_3$ sol added 4 wt% acetic acid was found to maintain the dispersion stability while its solid concentration increased to 15 wt%, this stability maintenance was the result of the electrostatic and steric repulsion of acetic acid molecules adsorbed on the surface of the $Al_2O_3$ particles. In order to observe the dispersion property of $Al_2O_3$ sol under NMP solvent, $Al_2O_3$ sol dispersed under ethanol solvent was modified and solvent-exchanged with N-Phenyl-(3-aminopropyl)trimethoxy silane(APTMS) through a binary solvent system. Characterization of the $Al_2O_3$ powder and the nanosol was observed by XRD, SEM, ICP, FT-IR, TGA, Particles size analysis, etc.

• 폴리머
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• 제30권6호
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• pp.519-524
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• 2006

나노피막을 형성하는 유기솔더 보존제의 주성분인 저분자 imidazole계 유기물을 대체할 수 있는 고분자 물질을 합성하였다. Cu와 같은 금속과의 접착성이 종은 비닐 피리딘을 주요 단량체로 하였고 물성 개질을 위한 공중합용 단량체로 아크릴아미드와 알릴아민을 사용하였다. 다양한 조성의 공중합체를 제조하여 코팅성, 용해도, 열적 특성, 산화방지 특성 등의 유기솔더 보존제로서의 특성을 평가하였다. 공중합체중 알릴아민을 함유한 공중합체의 경우 전반적으로 Cu pad에 대해 뛰어난 코팅능과 열적안정성을 보였고, 분자량 및 알릴아민 함유량에 따라 그 특성이 변화하였다. Oxygen induced temperature를 측정하여 시간에 따른 열 안정성을 확인해 본 결과 $230^{\circ}C$까지는 70분이상 동안 아무런 산화반응에 의한 열량 변화를 관찰할 수 없었고, 모든 알릴아민계 공증합체가 산소조건하에서 $200^{\circ}C$에서 1시간 동안 무게감량의 변화가 거의 없었으므로 충분한 열적 안정성을 갖고 있는 것으로 확인되었다.

• KIEAE Journal
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• 제14권2호
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• pp.29-36
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• 2014

The ground source heat pump (GSHP) system has attracted much of attention, because of its stability of heat production and the high efficiency of the system. Performance of the heat exchanger is dependent on the soil temperature, the ground thermal conductivity, the operation schedule, the pipe placement and the design temperature. However, in spite of the many variables of these systems, there have been few research on the effect of the systems on system performance. In this study, analysis of the heat exchange rate according to soil temperature and grout material was conducted by numerical simulation. Furthermore, the heat distribution around the ground heat exchanger was presented on the different conditions of grout and underground temperature by the simulation.