• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.515-516
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• 2010

• 대한전기학회:학술대회논문집
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• 대한전기학회 1988년도 추계학술대회 논문집 학회본부
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• pp.241-245
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• 1988

This paper reports the experiments regarding to diagnosis techniques for power transformers by measuring dissipation factor and moisture contents of mineral oils. Thermal aging environments of mineral oils were varied by the specially designed systems. Thermal aging of elevated temperature of $90^{\circ}C$ was performed for about 240 and 460 hours, respectively. Dissipation factor, permittivity, and water content were measured. Our test samples were not exposed to air. Dissipation factor increased while permittivity did not change. The level of dissipation factor determining the insulating quality of mineral oil was compared with the previous results of resistivity and several correction factor.

• 한국진공학회지
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• 제21권4호
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• pp.185-192
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• 2012

Light Emitting Diode (LED) 칩의 크기는 전도를 통한 열의 방출에 있어 면적의 확대로 인한 열 밀도의 감소와 칩의 외부양자효율 변화로 인하여 LED 칩의 p-n 정션 온도와 패키지의 열 저항에 영향을 미친다. 본 연구에서는 16칩 LED 패키지에서 칩의 크기가 0.6 mm와 1 mm인 두 가지 경우에 대하여 순전압(forward voltage)을 측정하였고, 순간열분석법(thermal transient analysis)을 이용하여 정션 온도와 열 저항을 평가하였으며, 이를 LED 칩의 전기적인 특성과 LED 패키지의 구조적인 특성과 연관하여 해석하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.195-196
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• 2008

• Corrosion Science and Technology
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• 제19권1호
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• pp.23-30
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• 2020

Heat sinks are most widely used in thermal management systems; however, the heat dissipation efficiency is usually limited. Therefore, in order to increase heat dissipation efficiency of the heat sink, the heat-dissipating paint using 2D materials (hexagonal boron nitride (h-BN) and graphene) as thermally conductive additive was designed and evaluated in the present study. The heat dissipation performance of the paint was calculated from temperature difference between the paint-coated and -uncoated specimens mounted on the heat source. The highest heat dissipation performance was obtained when the ratio of h-BN to resin was 1/10 in the paint. In addition, further reduction in the temperature of the test specimen by 6.5 ℃ was achieved. The highest heat dissipation performance of the paint prepared using graphene was achieved at a 1/50 ratio of graphene to the resin, and a 6.5 ℃ reduction was attained. In addition, graphene exhibited enhanced corrosion resistance property of heat-dissipating paint by inhibiting the growth of the paint blisters.

• 한국식품과학회지
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• 제29권1호
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• pp.72-76
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• 1997

압출성형기의 모터에너지는 자가발열 열에너지와 기계에너지로 전환되며 히터에너지는 열에너지로 공급되는데 각 에너지가 녹말의 호화에 미치는 영향을 분석하였다. 저온$({\leq}80^{\circ}C)$ 압출성형조건에서 자가발열 에너지는 낮은 수분함량의 분체 마찰에 의한 것과 높은 수분함량의 점성에 의한 것으로 구분할 수 있었으며 분체 마찰에 의한 열에너지가 호화에 더 효과적임을 알 수 있었다. 또한 모터에너지에서 자가발열되고 남은 순수한 기계에너지의 효과를 상대기계에너지로 평가한 결과, 높은 수분함량$({\geq}33%)$ 조건의 호화는 상대기계에너지의 변화에 크게 의존하며 낮은 수분함량$({\leq}30%)$의 경우는 거의 영향을 받지 않는 것으로 나타났다.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

• 대한설비공학회지:설비저널
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• 제17권4호
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• pp.489-498
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• 1988

An analysis has been given for the effect of viscous dissipation on the thermal instability of plane Couette flow between two parallel plates maintained at different constant temperatures. Under the assumption that the principle of the exchange of stabilities holds, stationary disturbance quantities in the form of longitudinal vortices are considered. The magnitudes of disturbance quantities are then represented as fast convergent power series so that the eigenvalue problem for determining the onset conditions of the thermal instability may be reduced to a simplified problem of finding the roots of a $4{\times}4$ determinant. It is shown that as the magnitude of the visucous dissipation increases the flow becomes more susceptible to instabilities, which is in very good agreement with previous results obtained in some related researches.

• 조명전기설비학회논문지
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• 제25권12호
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2004년도 한국우주과학회보 제13권2호
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• pp.270-273
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• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.