• 제목/요약/키워드: Thermal dissipation

검색결과 413건 처리시간 0.032초

The effect of gravity and hydrostatic initial stress with variable thermal conductivity on a magneto-fiber-reinforced

  • Said, Samia M.;Othman, Mohamed I.A.
    • Structural Engineering and Mechanics
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    • 제74권3호
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    • pp.425-434
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    • 2020
  • The present paper is concerned at investigating the effect of hydrostatic initial stress, gravity and magnetic field in fiber-reinforced thermoelastic solid, with variable thermal conductivity. The formulation of the problem applied in the context of the three-phase-lag model, Green-Naghdi theory with energy dissipation, as well as coupled theory. The exact expressions of the considered variables by using state-space approaches are obtained. Comparisons are performed in the absence and presence of the magnetic field as well as gravity. Also, a comparison was made in the three theories in the absence and presence of variable thermal conductivity as well as hydrostatic initial stress. The study finds applications in composite engineering, geology, seismology, control system and acoustics, exploration of valuable materials beneath the earth's surface.

Axisymmetric thermomechanical analysis of transversely isotropic magneto thermoelastic solid due to time-harmonic sources

  • Lata, Parveen;Kaur, Iqbal
    • Coupled systems mechanics
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    • 제8권5호
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    • pp.415-437
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    • 2019
  • The present research deals with two-dimensional axisymmetric deformation in transversely isotropic magneto thermoelastic solid with and without energy dissipation, with two temperature and time-harmonic source. The proposed model is helpful for finding the type of relations between mechanical and thermal fields as most of the structural elements of heavy industries are frequently related to mechanical and thermal stresses at a higher temperature. The Hankel transform has been used to find a solution to the problem. The displacement components, stress components, and temperature distribution with the horizontal distance in the physical domain are calculated numerically. The effect of time-harmonic source and two temperature is depicted graphically on the resulting quantities.

열매체 순환수 배관이 매설된 도로 포장체의 표면 온도 변화와 방열 성능 분석 (Analysis of Surface Temperature Change and Heat Dissipation Performance of Road Pavement with Buried Circulating Water Piping)

  • 손병후;우스만 무하마드;김용기
    • 한국지열·수열에너지학회논문집
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    • 제19권2호
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    • pp.8-19
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    • 2023
  • Hydronic heated road pavement (HHP) systems have well studied and documented by many researchers. However, most of the systems run on asphalt, only a few are tested with concrete, and there rarely is a comparison between those two common road materials in their heating and cooling performance. The aim of this study is to investigate the thermal performance of the HHP, such as heat dissipation performance in winter season while focusing on the surface temperature of the concrete and asphalt pavement. For preliminary study a small-scale experimental system was designed and installed to evaluate the heat transfer characteristics of the HHP in the test field. The system consists of concrete and asphalt slabs made of 1 m in width, 1 m in length, and 0.25 m in height. In two slabs, circulating water piping was embedded at a depth of 0.12 m at intervals of 0.16 m. Heating performance in winter season was tested with different inlet temperatures of 25℃, 30℃, 35℃ and 40℃ during the entire measurement period. The results indicated that concrete's heating performance is better than that of asphalt, showing higher surface temperatures for the whole experiment cases. However, the surface temperature of both concrete and asphalt pavement slabs remained above 0℃ for all experimental conditions. The heat dissipation performance of concrete and asphalt pavements was analyzed, and the heat dissipation of concrete pavement was greater than that of asphalt. In addition, the higher the set temperature of the circulating water, the higher the heat dissipation. On the other hand, the concrete pavement clearly showed a decrease in heat dissipation as the circulating water set temperature decreased, but the decrease was relatively small for the asphalt pavement. Based on this experiment, it is considered that a circulating water temperature of 20℃ or less is sufficient to prevent road ice. However, this needs to be verified by further experiments or computational fluid dynamic (CFD) analysis.

금속기판에 유전체 후막을 형성시켜 제조한 2층 층상재료에서 두께 방향의 열전도 특성 (Thermal Properties of Two-Layered Materials Composed of Dielectric Layer on Metallic Substrate along the Thickness Direction)

  • 김종구;정주영;주재훈;박상희;조영래
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.87-92
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    • 2016
  • 전자소자의 방열모듈에서 두께 방향의 열방출 특성에 대한 중요성이 증가하고 있다. 금속과 금속의 본딩 및 유전체와 금속의 본딩 구조를 갖는 2가지 종류의 2층 층상재료를 제조한 후 두께 방향으로 열확산계수를 측정하였다. 금속(STS439)과 금속(Al6061)으로 이루어진 2층 층상재료에서는 섬광법(LFA)으로 열확산계수를 측정했을 때, 열흐름의 방향을 반대로 변화시켜도 열확산계수의 변화가 없었다. 그런데, 유전체(AlN-Polymer)와 금속(Al6061)의 2층 층상재료에서는 열흐름의 방향을 반대로 인가하였을 때 열확산계수는 17.5% 정도 다르게 나타났다. 유전체와 금속의 단면구조를 갖는 2층 층상재료에서, 금속에서 유전체 방향으로 측정한 열확산계수가 유전체에서 금속 방향으로 측정한 열확산계수에 비해 17.5% 작게 나타난 이유는, 금속내의 전자가 갖고 있던 에너지가 유전체 쪽으로 전달되기 위해서는 계면 주변에서 포논의 에너지 형태로 변환될 때 저항이 생기기 때문이다.

전기자동차 배터리 하우징용 열전도성 고분자 복합재료 (Thermally Conductive Polymer Composites for Electric Vehicle Battery Housing)

  • 윤여성;장민혁;문동준;장은진;오미혜;박주일
    • 한국융합학회논문지
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    • 제13권4호
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    • pp.331-337
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    • 2022
  • 전기자동차용 배터리 하우징 소재로 사용되고 있는 금속 소재에서 경량소재로 대체하기 위한 열가소성복합재료를 제조하였다. 매트릭스 소재는 고분자 소재인 나일론 6를 사용 하였으며 방열 성능을 부여하기 위해 열전도도가 높은 Boron Nitrate(BN)를 사용하였다. 동일한 필러의 함량 및 입자 크기에 따른 열전도성 고분자 복합재료의 방열 특성을 분석하였다. 필러의 함량이 증가할수록 열전도도 값이 증가하였으며, 입자크기가 60~70㎛인 BN의 함량이 50%인 복합재료의 경우 1.4W/mK 이상 열전도도를 나타내었다. 입자 크기가 클수록 입자 간 계면 접촉면이 넓어져 Thermal path가 이루어짐을 확인하였다. 제조된 열전도성 고분자복합재료를 이용하여 배터리 하우징을 제작하였으며 셀의 충방전 동안 온도 변화를 관찰하여 배터리 하우징의 대체 소재로서의 가능성을 확인하였다.

탄소 복합재 기반 전자파 차폐 및 고방열 일체형 필름 연구동향 (Research Trends of Carbon Composite Film with Electromagnetic Interference Shielding and High Heat Dissipation)

  • 박성현;김명훈;김광석
    • 마이크로전자및패키징학회지
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    • 제28권4호
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    • pp.1-10
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    • 2021
  • 최근 전자 부품의 소형화, 고집적화가 진행되고 있으며, 소형화된 전자기기는 작은 면적과 얇은 두께로 전자파 간섭 및 발열문제를 해결해야 한다. 그래핀(Graphene) 복합재와 그라파이트(Graphite) 복합재는 가벼우면서도 우수한 전기 전도성과 열전도도로 전자파 차폐와 방열 문제를 해결할 수 있는 소재이다. 최근 합성 기술과 복합재 제조기술이 발전함에 따라 그래핀과 그라파이트 복합재를 다양한 분야에 적용하기 위한 연구들이 진행되고 있으며, 본 연구에서는 그래핀과 그라파이트를 이용하여 전자파 차폐 및 방열 특성을 동시에 가지는 복합재 필름을 제안한 최근 연구를 알아보고자 한다.

ESG를 위한 반도체 패키지 기술 트렌드 (Technology Trends of Semiconductor Package for ESG )

  • 서민석
    • 마이크로전자및패키징학회지
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    • 제30권3호
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    • pp.35-39
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    • 2023
  • ESG는 많은 기업에게 기업 가치를 향상시키고, 지속 경영이 가능하게 하는 큰 지침이 되고 있다. 그 중에서도 환경(Environment)은 기술적 관점의 접근이 필요하다. 환경 오염을 줄이거나 방지하고, 에너지를 절감하는 것은 기술적인 해법이 필요하기 때문이다. 반도체 패키지 기술은 반도체 패키지의 본연의 역할인 칩의 보호, 전기/기계적 연결, 열 방출 등을 잘 하기 위해 개발 및 발전해 왔는데, 이에 따라 열 방출 효과 향상, 전기적/기계적 특성 향상, 칩을 보호하는 신뢰성 향상, 적층 및 소형화, 그러면서 비용절감을 위한 기술들이 개발되고 발전해 왔다. 그 중에서도 열 방출 기술은 열효율을 높이고, 냉각을 위한 에너지 소모를 작게 하며, 전기적 특성 향상 기술도 저전력 사용과 에너지 소모를 줄이는 효과를 만들어서 환경에도 영향을 주었다. 또한 재사용이나 재료 소모를 줄이는 기술은 환경 오염을 줄이게 되며, 특히 환경에 유해한 물질들에 대해 대체하는 기술들은 환경 개선에 기여하게 된다. 본 논문에서는 이러한 환경 오염 방지 및 개선을 위한 반도체 패키지 기술들의 트렌드를 정리하였다.

Quantifying Architectural Impact of Liquid Cooling for 3D Multi-Core Processors

  • Jang, Hyung-Beom;Yoon, Ik-Roh;Kim, Cheol-Hong;Shin, Seung-Won;Chung, Sung-Woo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권3호
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    • pp.297-312
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    • 2012
  • For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

Mechanical Properties of Cement Material for Energy-Foundation (EF) Structures

  • Park, Yong-Boo;Choi, Hang-Seok;Sohn, Jeong-Rak;Sim, Young-Jong;Lee, Chul-Ho
    • 토지주택연구
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    • 제3권1호
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    • pp.83-88
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    • 2012
  • In this study, physical characteristics of cement and/or concrete materials that are typically used for energy-foundation (EF) structures have been studied. The thermal conductivity and structural integrity of the cement-based materials were examined, which are commonly encountered in backfilling a vertical ground heat exchangers, cast-in-place concrete piles and concrete lining in tunnel. For this purpose the thermal conductivity and unconfined compression strength of cement-based materials with various curing conditions were experimentally estimated and compared. Hydration heat generated from massive concrete in the cast-in-place concrete energy pile was observed for 4 weeks to estimate its dissipation time in the underground. The hydration heat may mask the in-situ thermal response test (TRT) result performed in the cast-in-place concrete energy pile. It is concluded that at least two weeks are needed to dissipate the hydration heat in this case. In addition, a series of numerical analysis was performed to compare the effect of thermal property of the concrete material on the cast-in-place pile.

CFD전산모사를 이용한 Al 6063 Heat Sink 최적화 설계와 열전도성 Polycarbonate와의 방열성능 비교 분석 (Optimization of Al 6063 Heat Sink using CFD Simulation and Comparative Analysis of Thermal Dissipation Properties with Thermal Conductive Polycarbonate)

  • 허인성;이세일;이아람;유영문
    • 조명전기설비학회논문지
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    • 제28권7호
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    • pp.19-25
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    • 2014
  • In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.