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http://dx.doi.org/10.6117/kmeps.2016.23.4.087

Thermal Properties of Two-Layered Materials Composed of Dielectric Layer on Metallic Substrate along the Thickness Direction  

Kim, Jong-Gu (Division of Materials Science and Engineering, Pusan National University)
Jeong, Ju-Young (Division of Materials Science and Engineering, Pusan National University)
Ju, Jae-Hoon (Department of Advanced Materials and Parts of Transportation Systems, Pusan National University)
Park, Sang-Hee (Department of Ophthalmic Optics, Kaya University)
Cho, Young-Rae (Division of Materials Science and Engineering, Pusan National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.23, no.4, 2016 , pp. 87-92 More about this Journal
Abstract
The importance of heat dissipation for the electric device modules along the thickness direction is increasing. Two types of two-layered materials, metal-metal bonding and dielectric-metal bonding, have been fabricated by roll bonding process and a thermal diffusivity of the specimens was measured along the thickness direction. The thermal diffusivity of specimens with metal-metal bonding measured by light flash analysis (LFA) showed a same value independent on the direction of heat flow. However, the thermal diffusivity of specimens with dielectric-metal bonding showed a big difference of 17.5% when the direction of heat flow changed oppositely in the LFA process. The measured thermal diffusivity of specimens when the heat flows from metal to dielectric direction showed smaller value of 17.5% compared to the value when the heat flow from dielectric to metal direction. The difference in thermal diffusivity of specimens with dielectric-metal bonding dependence on direction of heat flow is due to the electron-phonon resistance that occurred transfer process of electron energy to phonon energy near the interface.
Keywords
thermal diffusivity; layered material; heat sink; heat flow; heat dissipation;
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Times Cited By KSCI : 5  (Citation Analysis)
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