• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.633-637
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• 2023

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.4
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• pp.371-377
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• 2017

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.5
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• pp.105-110
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• 2020

The global battery market is rapidly growing due to the development of vehicles(EV) and wireless electronic products. In particular logistics robots, which hielp to produce EVs, have attracted much interest in research in Korea Because logistics sites and factories operate continuously for 24 hours, the technology that can dramatically increase the operation time of the logistics equipment is rapidly developing, and various high-level technologies are required for the batteries used in. for example, logistics robots. These required technologies include those that enable rapid battery charging as well wireless charging to charge batteries while moving. The development of these technologies, however, result in increasing explosions and topical accidents involving rapid charging batteries These accidents due to the thermal shock caused by the heat generated during the charging of the battery cell. In this study, a performance evaluation of a heat dissipation design using infrared thermal imaging was performed on an energy storage systrm(Ess) applied with an internal heat conduction cooling method using a heating plate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.673-677
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• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.335-338
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• 2009

In this study, in order to investigate the thermal and electrical properties of ZnO arrester block against 60[Hz] AC voltage, the changes in leakage current were measured. The temperature distribution appearing on the ZnO arrester blocks was observed using a forward looking infrared camera. In particular, the correlation between the thermal and electrical properties of a ZnO arrester block was analyzed experimentally. From this analysis, the thermal phenomena resulting from the heat generation and dissipation of the ZnO arrester block were interpreted. The degradation and thermal runaway phenomena of ZnO arrester block are closely related to the temperature limit of the ZnO arrester block. The installation of an additional metal electrode has resulted in the decrease of the leakage current due to the heat dissipation.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.26 no.2
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• pp.1-7
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• 2012

LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[$^{\circ}C$] when the mold height was 3~5[mm], but the thermal conductivity of the mold didn't affect the junction temperature significantly.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.3
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• pp.427-431
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• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.