• Proceedings of the KSR Conference
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• 2008.11b
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• pp.1096-1101
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• 2008

Concrete is shown the time dependent behavior after placing. The time dependent behavior of normal strength concrete that is used usually in present, were already examined closely lots of parameters by several investigators. however, high strength concrete is that the material characteristics are not definite and the experimental data are lacking. So, The goal of this study is to propose the material characteristics models, and to develop the routine of the time dependent behavior above 60 MPa. The thermal conductivity, the specific heat, the moisture diffusion coefficient, and the surface coefficient are proposed the suitable models through the parametric study. The structural element is used the 8-node solid element. The matrix equation is developed considering the transient heat transfer and moisture diffusion theory. The application of the time dependent behavior is used the finite differential method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.9
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• pp.532-540
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• 2019

PET microfibers with various diameters (0.5, 0.2, 0.06, and 0.01 dpf) were dyed with a dispersed dye (C.I. Disperse Blue 56) at various temperatures. The dyeing process was conducted under infinite dyebath conditions at constant temperatures. The effects of the dyeing temperature and diameter on the partition coefficient, affinity, and diffusion coefficient of disperse dyes were studied. The curve of isotherms was fitted well to Nernst-type model in a large range of initial dye concentrations. At the same temperature, the partition coefficient and affinity decreased with increasing sample diameter due to the increase in surface area. At all deniers, the partition coefficient and affinity decreased with increasing temperature because the dyeing process is an exothermic reaction. In addition, the decrease in radius of the sample gives rise to a decrease in the heat of dyeing. The fine diameter of the sample resulted in an increased surface area but decreased space between the microfibers. Consequently, decreasing the diameter of the microfibers leads to a decrease in the diffusion coefficient. At the same diameter, the diffusion coefficient increased with increasing temperature because of rapid dye movement and the large free volume of the sample inside. In addition, thermal dependence of the diffusion coefficient increased when the diameter of the sample increased.

• Bulletin of the Korean Chemical Society
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• v.28 no.10
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• pp.1689-1696
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• 2007

Equilibrium molecular dynamics (EMD) simulations are used to evaluate the transport coefficients of argonkrypton mixtures at two liquid states (state A: 94.4 K and 1 atm; state B: 135 K and 39.5 atm) via modified Green-Kubo formulas. The composition dependency of the volume at state A obeys close to the linear model for ideal liquid mixture, while that at state B differs from the linear model probably due to the high pressure. The radial distribution functions for the Ar-Kr mixture (x = 2/3) show a mixing effect: the first peak of g11 is higher than that of g(r) for pure Ar and the first peak of g22 is lower than that of g(r) for pure Kr. An exponential model of engineering correlation for diffusion coefficient (D) and shear viscosity (η) is superior to the simple linear model for ideal liquid mixtures. All three components of thermal conductivity (λpm, λtm, and λti) at state A and hence the total thermal conductivity decrease with the increase of x. At state B, the change in λtm is dominant over those in λpm and λti, and hence the total thermal conductivity decrease with the increase of x.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.4
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• pp.347-355
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• 2014

Thermal problems that are directly related to the lifetime of an electronic device are becoming increasingly important owing to the miniaturization of electronic devices. To solve thermal problems, it is essential to study thermal stability through thermal diffusion and insulation. A honeycomb sandwich plate has anisotropic thermal conductivity. To analyze the thermal deformation and temperature distribution of a system that employs a honeycomb sandwich plate, the thermal and elastic properties need to be determined. In this study, the thermal and elastic properties of a honeycomb sandwich plate, such as thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and shear modulus, are predicted. The properties of a honeycomb sandwich plate vary according to the hexagon size, thickness, and material properties.

• Nuclear Engineering and Technology
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• v.40 no.3
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• pp.233-238
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• 2008

This study investigates the surface modification of a Hastelloy X plate and diffusion bonding in the assembly of surface modified plates. These types of plates are involved in the key processes in the fabrication of a process heat exchanger (PHE) for a $SO_3$ decomposer. Strong adhesion of a SiC film deposited onto Hastelloy X can be achieved by a thin SiC film deposition and a subsequent N ion beam bombardment followed by an additional deposition of a thicker film that prevents the Hastelloy X surface from becoming exposed to a corrosive environment through the pores. This process not only produces higher corrosion resistance as proved by electrolytic etching but also exhibits higher endurance against thermal stress above 9$900^{\circ}C$. A process for a good bonding between Hastelloy X sheets, which is essential for a good heat exchanger, was developed by diffusion bonding. The diffusion bonding was done by mechanically clamping the sheets under a heat treatment at $900^{\circ}C$. When the clamping jig consisted of materials with a thermal expansion coefficient that was equal to or less than that of the Hastelloy X, sound bonding was achieved.

• Journal of Advanced Navigation Technology
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• v.16 no.4
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• pp.657-664
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• 2012

One of the methods to transmit solute through solvent is diffusion. Various particles or molecules including several charged ions in the body diffuse from high density region to low density due to density difference or external electric field. This kind of mechanism is due to thermal motion of each solute molecules. These situations can be deployed using Fick's first and second laws that govern diffusion phenomena in the body. I analysis these diffusion status of material in the body using above mentioned Fick's laws and then implement them through illustration.

• Journal of the Korean Ceramic Society
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• v.24 no.5
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• pp.484-490
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• 1987

Diffusion coupling experiment was done to study expansion of body and soild reaction in BaCO3-TiO2 system. Specimen of BaCO3 and TiO2 was formed with Pt-mark's method. Each specimen was fired at interval of 25℃ from 900℃ to 1000℃ for 2hrs. After that, specimen was fixed with resin and polished. Product layers of specimen were observed with SEM and EDS. The result were following; 1. Diffusion component is Ba2+, which diffuse toward TiO2. 2. Large crack between layer of BaCO3 and Ba2TiO4 was generated because of difference of thermal expansion coefficient. 3. Ba2TiO4 is formed to TiO2 body by the reaction of BaTiO3 and BaO and its structure is very porous. 4. BaTiO3 changes immediately to Ba2TiO4 by the reaction of BaO. But BaTiO3 which formed by the reaction of TiO2 and Ba2TiO4 exsists as layer because the diffusion distance of Ba2+ is far.

• Nuclear Engineering and Technology
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• v.54 no.8
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• pp.2801-2808
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• 2022

The synergistic effect of ZrC nanoparticle pining and Re solution in W matrix on the thermal stability of tungsten was studied by investigating the evolution of the microstructure, hardness and tensile properties after annealing in a temperature range of 1000-1700 ℃. The results of metallography, electron backscatter diffraction pattern and Vickers micro-hardness indicate that the rolled W-1wt%Re-0.5 wt% ZrC alloy has a higher recrystallization temperature (1600 ℃-1700 ℃) than that of the rolled pure W (1200 ℃), W-0.5 wt%ZrC (1300 ℃), W-0.5 wt%HfC (1400-1500 ℃) and W-K-3wt%Re alloy fabricated by the same technology. The molecular dynamics simulation results indicated that solution Re atoms in W matrix can slow down the self-diffusion of W atoms and form dragging effect to delay the growth of W grain, moreover, the diffusion coefficient decrease with increasing Re content. In addition, the ZrC nanoparticles can pin the grain boundaries and dislocations effectively, preventing the recrystallization. Therefore, synergistic effect of solid solution Re element and dispersed ZrC nanoparticles significantly increase recrystallization temperature.

• Bulletin of the Korean Chemical Society
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• v.12 no.3
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• pp.315-322
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• 1991

In a recent $paper^1$ we reported equilibrium (EMD) and non-equilibrium (NEMD) molecular dynamics simulations of liquid argon using the Green-Kubo relations and NEMD algorithms to calculate the thermal transport coefficients-the self-diffusion coefficient, shear viscosity, and thermal conductivity. The overall agreement with experimental data is quite good. In this paper the same technique is applied to calculate the thermal transport coefficients of liquid water at 298.15 K and 1 atm using TIP4P model for the interaction between water molecules. The EMD results show difficulty to apply the Green-Kubo relations since the time-correlation functions of liquid water are oscillating and not decaying rapidly enough except the velocity auto-correlation function. The NEMD results are found to be within approximately ${\pm}$30-40% error bars, which makes it possible to apply the NEMD technique to other molecular liquids.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.