• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Bulletin of the Korean Chemical Society
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• v.35 no.12
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• pp.3527-3531
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• 2014

In this paper, we report thermodynamic and transport properties (diffusion coefficient, viscosity, and thermal conductivity) of diatomic gases ($H_2$, $N_2$, $O_2$, and $Cl_2$) at 273.15 K and 1.00 atm by performing molecular dynamics simulations using Lennard-Jones intermolecular potential and modified Green-Kubo formulas. The results of self-diffusion coefficients of diatomic gases obtained from velocity auto-correlation functions by Green-Kubo relation are in good agreement with those obtained from mean square displacements by Einstein relation. While the results for viscosities of diatomic gases obtained from stress auto-correlation functions underestimate the experimental results, those for thermal conductivities obtained from heat flux auto-correlation functions overestimate the experimental data except $H_2$.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.2
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• pp.75-80
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• 2021

The crystal grains of polycrystalline diamond vary depending on deposition conditions and growth thickness. The diamond thin film deposited by the CVD method has a very rough growth surface. On average, the surface roughness of a diamond thin film deposited by CVD is in the range of 1-100 um. However, the high surface roughness of diamond is unsuitable for application in industrial applications, so the surface roughness must be lowered. As the surface roughness decreases, the scattering of incident light is reduced, the heat conduction is improved, the mechanical surface friction coefficient can be lowered, and the transmittance can also be improved. In addition, diamond-coated cutting tools have the advantage of enabling ultra-precise machining. In this study, the surface roughness of diamond was improved by thermal diffusion reaction between diamond carbon atoms and ferrous metals at high temperature for diamond thin films deposited by MPCVD.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1747-1755
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• 2002

A complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in semi-infinite solid materials. The influence of the parameters, such as radius and modulation frequency of the heating beam and the thermal diffusivity, was studied. Usually, thermal diffusivity was determined by the deformation angle and phase angle as the relative position between the heating and probe beams. In this study, we proposed the simple analysis method based on the real part of deformation gradient as the relative position between two beams. It is independent in the parameters such as power of heating beam, absorption coefficient, reflectivity, Poisson's ratio, and thermal expansion coefficient.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.5
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• pp.1042-1046
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• 2007

In this study, we investigated the mechanism responsible for the thermal stability of CoSi by addition of a foreign chemical element. Addition of W was found to increase the heat of formation of CoSi. This increase was claimed to inhibit the glass formation, which is preferred by silicide formation kinetics depicted by the maximum system energy degradation rate. In this case, there forms at the interface between CoSi and Si wafer a crystalline structure, the effective diffusion coefficient of which is much less than the self-diffusion rate provided by the glass. It was stated that the phase transition requires a higher thermal energy as the consequence, thereby enhancing the thermal stability of CoSi.

• Macromolecular Research
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• v.15 no.1
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• pp.10-16
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• 2007

In this work, we prepared epoxy/BMI composites by using N,N'-bismaleimide-4,4'-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4'-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravi-metrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

• Journal of Biosystems Engineering
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• v.9 no.2
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• pp.89-96
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• 1984

This study was intended to search the thermal properties of rice which are necessary in preventing qualitative and quantitative losses in the drying and milling processes. First, the coefficient of cubical thermal expansion of brown rice was measured, which is required for analyzing the internal stress of rice, and then theoretical thermal and moisture stresses were calculated. The results are summarized as follows: 1. The coefficient of cubical thermal expansion of brown rice was about $2.81{\times}10^{-4}/^{\circ}C$ in the temperature range of $10^{\circ}C-60^{\circ}C$. 2. When the shape of brown rice was assumed to be a sphere or a cylinder, maximum thermal stress due to temperature change of $20^{\circ}C-60^{\circ}C$ was in the range of $25-100kg/cm^2$. And maximum moisture stress was in the range of $450-650kg/cm^2$ when the drying temperature was $35^{\circ}C$, initial and final moisture contents of brown rice were 20% and 14% (w.b.), and the moisture diffusion coefficient was assumed to be $6.79{\times}10^{-4}cm^2/hr$. 3. Consequently, it was concluded that crack formation in a rice kernel is mainly caused by moisture stress.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.901-906
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• 2010

The first stage blade of a gas turbine was operated under a severe environment which included both $1300^{\circ}C$ hot gas and thermal stress. To obtain high efficiency, a thermal barrier coating (TBC) and an internal cooling system were used to increase the firing temperature. The TBC consists of multi-layer coatings of a ceramic outer layer (top coating) and a metallic inner layer (bond coat) between the ceramic and the substrate. The top and bond coating layer respectively act as a thermal barrier against hot gas and a buffer against the thermal stress caused by the difference in the thermal expansion coefficient between the ceramic and the substrate. Particularly, the bondcoating layer improves the resistance against oxidation and corrosion. An inter-diffusion layer is generated between the bond coat and the substrate due to the exposure at a high temperature and the diffusion phenomenon. A thickness measurement result showed that the bond coat of the suction side was thicker than that of the pressure side. The thickest inter-diffusion zone was noted at SS1 (Suction Side point 1). A chemical composition analysis of the bond coat showed aluminum depletion around the inter-diffusion layer. In this study, we evaluated the properties of the bond coat and the degradation of the coating layer used on a $1300^{\circ}C$-class gas turbine blade. Moreover, the operation temperature of the blade was estimated using the Arrhenius equation and this was compared with the result of a thermal analysis.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.26-35
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• 2003

This study explains the effects of lubricant and surface treatment on hot forging die life. The mechanical and thermal load, and thermal softening which is happened by the high temperature of die, in hot and warm forging, cause die wear, heat checking and plastic deformation, etc. This study is fur the effects of solid lubricants and surface treatment condition for hot forging die. Because cooling effect and low friction are essential to the long life of dies, optimal surface treatment and lubricant are very important to improve die life for hot forging process. The main factors, which affect die hardness and heat transfer, are surface treatments and lubricants, which are related to thermal diffusion coefficient and heat transfer coefficient, etc. For verifying these effects, experiments are performed for hot ring compression test and heat transfer coefficient in various conditions as like different initial billet temperatures and different loads. The effects of lubricant and surface treatment for hot forging die life are explained by their thermal characteristics. The new developed technique in this study for predicting tool life can give more feasible means to improve the tool life in hot forging process.

• Bulletin of the Korean Chemical Society
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• v.28 no.8
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• pp.1371-1374
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• 2007

The velocity auto-correlation (VAC) function of liquid argon in the Green-Kubo formula decays quickly within 5 ps to give a well-defined diffusion coefficient because the velocity is the property of each individual particle, whereas the stress (SAC) and heat-flux auto-correlation (HFAC) functions for shear viscosity and thermal conductivity have non-decaying, long-time tails because the stress and heat-flux appear as system properties. This problem can be overcome through N (number of particles)-fold improvement in the statistical accuracy, by considering the stress and the heat-flux of the system as properties of each particle and by deriving new Green-Kubo formulas for shear viscosity and thermal conductivity. The results obtained for the transport coefficients of liquid argon obtained are discussed.