Browse > Article
http://dx.doi.org/10.12656/jksht.2021.34.2.75

A Study on the Surface Polishing of Diamond Thin Films by Thermal Diffusion  

Bae, Mun Ki (Department of Nano Fusion Technology, Pusan National University)
Kim, Tae Gyu (Department of Nanomechatronics Engineering, Pusan National University)
Publication Information
Journal of the Korean Society for Heat Treatment / v.34, no.2, 2021 , pp. 75-80 More about this Journal
Abstract
The crystal grains of polycrystalline diamond vary depending on deposition conditions and growth thickness. The diamond thin film deposited by the CVD method has a very rough growth surface. On average, the surface roughness of a diamond thin film deposited by CVD is in the range of 1-100 um. However, the high surface roughness of diamond is unsuitable for application in industrial applications, so the surface roughness must be lowered. As the surface roughness decreases, the scattering of incident light is reduced, the heat conduction is improved, the mechanical surface friction coefficient can be lowered, and the transmittance can also be improved. In addition, diamond-coated cutting tools have the advantage of enabling ultra-precise machining. In this study, the surface roughness of diamond was improved by thermal diffusion reaction between diamond carbon atoms and ferrous metals at high temperature for diamond thin films deposited by MPCVD.
Keywords
Thermal Diffusion; Surface Polishing; Poly crystal diamond; Microwave plasma CVD;
Citations & Related Records
연도 인용수 순위
  • Reference
1 H. Liander : ASEA J. 28 (1955) 97-98.
2 W. G. Eversole : US Patent No 3,030,188 (1962).
3 A. P. Malshe, B. S. Park, W. D. Brown, and H. A. Naseem : Diamond Relat. Mater., 8 (1999) 1198.   DOI
4 J. Wilks, E. M. Wilks, and J. E. Field : Properties Diamond (1984) 351.
5 S. E. Grillo and J. E. Field : J. Phys. D: Appl, Phys., 30 (1997) 202.   DOI
6 S. E. Grillo, J. E. Field, and F. M. van Bouwelen : J. Phys. D: Appl. Phys., 33 (2000) 985.   DOI
7 S. Kiyohara, Y. Yagi, and K. Mori : Nanotechnology, 10 (1999) 385.   DOI
8 M. K. Bae, C. H. Kim, Y. M. Park, S. J. Yoon, and T. G. Kim : Modern Physics Letters B, 34 (2020) 4.
9 N. Yang, W. Huang, and D. Lei : Journal of Materials Processing Technology, 278 (2020) 6.
10 H. Luo, K. M. Ajmal, W. Liu, K. Yamamura, and J. Deng : International Journal of Extreame Manufacturing, 3 (2021) 43.