• 대한기계학회논문집A
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• 제37권5호
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• pp.657-664
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• 2013

에폭시 수지에 다중벽 탄소나노튜브를 첨가하여 초음파 처리와 전단혼합 방법으로 분산시켜 다중벽 탄소나노튜브로 강화된 에폭시 복합재료를 제조하였으며, 에폭시 수지 내 다중벽 탄소나노튜브의 분산 적정성을 판단하고 기계적 및 열적 물성을 고찰하였다. 충전재 분산에 대한 평가를 위해 정성적인 방법으로 주사전자현미경(scanning electron microscope, SEM) 이미지를 사용하였고, 정량적인 판단을 위해 인장실험을 실시하였다. 또한, 열적 특성을 평가하기 위해 열팽창계수(coefficient of thermal expansion, CTE)를 측정하였다. 주사전자현미경 사진 및 인장 강도와 영률(Young's modulus)의 작은 편차를 통해서 다중벽 탄소나노튜브가 에폭시 수지 내에 적절히 분산되었음을 확인하였다. 충전재 함량에 따라 인장 강도와 영률이 증가함을 보였고 열팽창계수 측정에서는 열안정성 개선을 고찰하였다.

• Nuclear Engineering and Technology
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• 제49권7호
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• pp.1388-1395
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• 2017

The Helically coiled tube Once-Through Steam Generator (H-OTSG) is a key piece of equipment for compact small reactors. The present study developed and verified a thermal-hydraulic design and performance analysis computer code for a countercurrent H-OTSG installed in a small pressurized water reactor. The H-OTSG is represented by one characteristic tube in the model. The secondary side of the H-OTSG is divided into single-phase liquid region, nucleate boiling region, postdryout region, and single-phase vapor region. Different heat transfer correlations and pressure drop correlations are reviewed and applied. To benchmark the developed physical models and the computer code, H-OTSGs developed in Marine Reactor X and System-integrated Modular Advanced ReacTor are simulated by the code, and the results are compared with the design data. The overall characteristics of heat transfer area, temperature distributions, and pressure drops calculated by the code showed general agreement with the published data. The thermal-hydraulic characteristics of a typical countercurrent H-OTSG are analyzed. It is demonstrated that the code can be utilized for design and performance analysis of an H-OTSG.

• 한국가스학회지
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• 제7권3호
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• pp.58-64
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• 2003

본 연구에서는 압력용기의 안전설계에 대한 해석결과를 제시하고 있다. 압력용기에 가스압력과 온도하중이 동시에 작용할 경우, 응력과 변위량에 대한 해석적 연구를 수행하였다. 용기에 대한 설계는 ASME Sec. VIII Div. 2 code를 따라 설계하였다. 이 결과를 사용하여 열적 하중과 기계적 하중을 받는 압력용기를 FEM 해석기법으로 설계 안.전성을 검증하고자 한다. 유한요소해석 결과에 의하면, ASME 설계코드로 압력과 온도하중을 동시에 받는 경우를 해석한 데이터는 압력용기의 설계 안전성을 보장을 할 수 없을 것으로 예상된다. 또한, 압력용기 설계에서 일정한 두께를 갖는 일체형이 보강테를 설치한 압력용기보다 안전하다는 결과를 제시하고 있다.

• 한국전산유체공학회지
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• 제21권2호
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• pp.90-98
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• 2016

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 추계 학술발표회
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• pp.813-824
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• 2010

Thermal conductivity of soils is one of the most important parameters to design horizontal ground heat exchangers. It is well known that the thermal conductivity of soil is strongly influenced by its density and water content because of soil's particulate structure. This paper reviewed and evaluated some of the commonly used prediction models for thermal conductivity of soils with the experimental data available in the literature. Semi-theoretical models for two-component materials were found inappropriate to estimate the thermal conductivity of dry state sands. It came out that the model developed by Cote and Konrad gave the best overall prediction for unsaturated sands available in the literature. Also, a parametric analysis is conducted to investigate the effect of thermal conductivity and water content, soil type on the horizontal ground heat exchanger design. The analysis shows that a required pipe length for the horizontal ground heat exchanger is reduced with the increase of soil thermal conductivity and water content. The calculation results also show that the dimension of the horizontal ground heat exchanger can be reduced to a certain extent by using backfilling material with a higher thermal conductivity of solid particles.

• 한국초전도ㆍ저온공학회논문지
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• 제14권4호
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• pp.24-27
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• 2012

The measurement of the coefficient of thermal expansion (CTE) of polypropylene laminated paper (PPLP) as electric insulating material is important for its practical superconducting device application. The thermal strain induced to HTS tapes and its insulating material during cooling from room temperature might largely affect the critical current ($I_c$) of HTS tapes. In this study, the thermal contraction of PPLP material was measured during cooling from 300 K to 77 K using double extensometers. Initially, the CTE of a brass tape was measured and it was compared with a reference data. It was found that the measured thermal expansion data of the brass material approaches that of the reference one. Based on the results, it was then confirmed that the measurement technique could be applied to thin and flexible samples. Therefore, the same measurement procedure was applied to PPLP material using double extensometers. As a result, the linear CTE of the PPLP at 77 K has been measured to be ${\sim}15.3{\times}10^{-6}/K$. Also, it was found that the thermal contraction characteristics of PPLP was dominated by polypropylene on the cross direction (higher thermal contraction) while it was dominated by Kraft paper on the machine direction (lower thermal contraction). Overall, this measurement procedure could be adopted for the determination of CTE of flexible materials such as PPLP.

• KIEAE Journal
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• 제17권3호
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• pp.15-21
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• 2017

Purpose: "Building energy design standard" is used to limit the thermal transmittance of building in Korea. However, it only covers the insulation standard for each appropriate elements of a building, not the thermal performance of Junction thermal bridge of windows and doors installed in wall. Therefore in this study, we have evaluated the thermal performance of Junction thermal bridge depending on installation method and position of windows and provide it as design data. Method: We analyzed heat transfer of 4-Track sliding window and tilt & turn triple glazed window that are placed in the first class category on window energy efficiency rating using Window 7.4 and Therm 7.4. Result : First, linear thermal transmittance of 4-Track sliding window differs by 2.2 times or more depending of installation method and location. It is higher than the linear thermal transmittance, 0.01W/mK, proposed by Passivhaus. Second, linear thermal transmittance of Tilt & turn triple glazed window differs by 7.7 times or more depending of installation method and location. The average linear thermal transmittance was less than 0.01W /mK when windows were installed on the internal wall insulation by the fixed hardware attachment method. Third, the thermal losses of a window caused by a junction thermal bridge are inversely proportional to the window area and converge gradually as the area increased.

• 한국항공우주학회지
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• 제39권11호
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• pp.1069-1076
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• 2011

인공위성이 궤도상에서 임무를 수행하는 동안 모든 위성 부품이 허용 온도 범위 내에서 존재하도록 하기 위하여 검증된 열모델을 개발하고, 궤도 열해석을 통하여 열적 안정성을 확보하기 위한 열설계를 수행한다. 본 연구에서는 저궤도 위성 광학탑재체의 열진공/열평형 시험 결과를 이용하여 열해석 모델을 보정하고 flight heater의 작동주기를 맞추어 줌으로써 검증된 열모델을 확보하였다. 또한 위성의 열적 안정성을 확보하기 위하여 보정이 완료된 모델을 이용하여 궤도 열해석을 수행함으로써 모든 부품이 허용온도 범위내에 존재하는 것을 확인하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.