Journal of computational fluids engineering (한국전산유체공학회지)

Korean Society of Computational Fluids Engineering (한국전산유체공학회)
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A NUMERICAL STUDY ON THERMAL DESIGN OF A LARGE-AREA HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY

나노임프린트 장비용 대면적 열판 열설계를 위한 수치 연구

  • Park, G.J. (Dept. of Mechanical Engineering, Graduate School, Kumoh National Institute of Technology) ;
  • Lee, J.J. (Research Division for Nano Convergence Mechanical Systems, Korea Institute of Machinery and Materials) ;
  • Kwak, H.S. (Dept. of Mechanical System Engineering, Kumoh National Institute of Technology)
  • 박규진 (금오공과대학교 대학원 기계공학과) ;
  • 이재종 (한국기계연구원, 나노융합기계연구본부) ;
  • 곽호상 (금오공과대학교 기계시스템공학과)
  • Received : 2016.05.23
  • Accepted : 2016.06.28
  • Published : 2016.06.30
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Abstract

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

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References

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