1 |
2003, Gary, S.M. and Simon, M.S., Fundamentals of Semiconductor Fabrication, John Wily & Sons, New York.
|
2 |
1996, Chou, S.Y., Krauss, P.R. and Renstrom, P.J., "Nanoimprint Lithography," J. Vac. Sci. Technol., Vol.14, No.6, pp.4129-4133.
DOI
|
3 |
2000, Becker, H. and Heim, U., "Hot Embossing as a Method for the Fabrication of Polymer High Aspect Ratio Structures," Sensors and Actuators A, Physical, Vol.84, pp.130-135.
|
4 |
1998, Pang, S.W., Tamamura, T., Nakao, M., Ozawa, A. and Masuda, H., "Direct Nano-Printing on Al Substrate Using a SiC Mold," J. Vac. Sci. Technol., Vol.16, pp.1145-1149.
|
5 |
2001, Hirai, Y., Fujiwara, M., Okuno, T., Tanaka, Y., Endo, M., Irie, S., Nakagawa, K. and Sasago, M., "Study of the Resist Deformation in Nanoimprint Lithography," J. Vac. Sci. Technol., Vol.19, pp.2811-2815.
DOI
|
6 |
2002, Beck, M., Graczyk, M., Maximov, I., Sarwe, E.L., Ling, T.G.I., Keil, M. and Motelius, L., "Improving Stamps for 10 nm Level Wafer Scale Nanoimprint Lithography," Microelectron. Eng., Vol.61-2, pp.441-448.
DOI
|
7 |
2004, Khang, D.Y., Kang, H., Kim, T. and Lee, H.H., "Low-Pressure Nanoimprint Lithography," Nano Lett., Vol.4, pp.633-637.
DOI
|
8 |
2006, Kwak, H.S., Park, G.J., Son, B.C., Lee, J.J. and Park, H.C., "Design of a Hot plate with Rapid Cooling Capability for Thermal Nanoimprint Lithography," Proc. SICE-ICASE Int. Joint Conf., Busan, pp.4897-4901.
|
9 |
2007, Park, G.J., Kwak, H.S., Shin, D.W. and Lee, J.J. "Numerical Simulation of Thermal Control of a Hot Plate for Thermal Nanoimprint Lithography Machines," Proc. 3rd Int. Conf. on Heating Cooling Technol., pp.321-327.
|
10 |
2008, Yang, J.H., "An Experimental Study on the Thermal Performance of a Hot Plate for Thermal Nanoimprint Lithography," Master Thesis, Kumoh National Institute of Technology.
|
11 |
1995, Faghri, A., Heatpipe Science and Technology, Taylor & Francis.
|
12 |
2012, Wallin, P., "Heat Pipe, selection of working fluid," Heat and Mass Trasfer Project Report, MVK160, pp.1-7.
|
13 |
2012, Y.A. Cengel, Heat and Mass transfer, McGraw-Hill, Chapter 9, pp.521-527.
|