• 대한기계학회논문집
• /
• 제16권2호
• /
• pp.348-355
• /
• 1992

Casting structures and properties are determined by the solidification speed in the metal mold. The heat transfer characteristics of the interface between the mold and the casting is one of the major factors that control the solidification speed. According to Sully's research, the thermal resistance exists due to the air-gap formation at the mold-casting interface during the freezing process and the interface heat transfer coefficient is used to describe the degree of it. In this study, one-dimensional Stefan problem with air-gap resistance in the cylindrical geometry is considered and heat transfer characteristics is numerically examined. The temperature distribution and solidification speed are obtained by using the modified variable time step method. And the effects of the major parameters such as mold geometry, thermal conductivity, heat transfer coefficient and initial temperature of casting on the thermal characteristics are investigated.

• 한국전기전자재료학회논문지
• /
• 제20권7호
• /
• pp.587-593
• /
• 2007

Oil-based nanofluids were prepared by dispersing spherical and fiber shaped $Al_2O_3$ and AlN nanoparticles in transformer oil. Two hydrophobic surface modification processes using oleic acid (OA) and polyoxyethylene alkyl acid ester (PAAE) were compared in this study. The dispersion stability, viscosity and breakdown voltage of the nanofluids were also characterized. $(Al_2O_3+AlN)$ mixed nanofluid was prepared to take an advantage of the excellent thermal conductivity of AlN and a good convective heat transfer property of fiber shaped $Al_2O_3$. For $(Al_2O_3+AlN)$ particles with 1 % volume fraction in oil, the enhancement of thermal conductivity and convective heat transfer coefficient was nearly 11 % and 30 %, respectively, compared to pure transformer oil. The nanofluid, containing $Al_2O_3+AlN$, successfully lowered the temperature of the heating element and oil itself during a natural convection test using a prototype transformer.

• 대한기계학회논문집A
• /
• 제20권11호
• /
• pp.3538-3548
• /
• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• 마이크로전자및패키징학회지
• /
• 제30권1호
• /
• pp.63-70
• /
• 2023

오늘날 심각한 환경 오염과 에너지의 중요성으로 전력 반도체의 중요도가 지속적으로 높아지고 있다. 특히 wide band gap(WBG)소자 중 하나인 SiC-MOSFET은 우수한 고전압 특성을 가지고 있어 그 중요도가 매우 높다. 하지만 SiC-MOSFET의 전기적 특성이 열에 민감하기 때문에 패키지를 통한 열 관리가 필요하다. 본 논문에서는 기존 전력 반도체에서 사용하는 direct bonded copper(DBC) 기판 방식이 아닌 insulated metal substrate(IMS) 방식을 제안한다. IMS는 DBC에 비해 공정이 쉬우며 coefficient of thermal expansion (CTE)가 높아서 비용과 신뢰성 측면에서 우수하다. IMS의 절연층인 dielectric film의 열전도도가 낮은 문제가 있지만 매우 얇은 두께로 공정이 가능하기 때문에 낮은 열 전도도를 충분히 극복할 수 있다. 이를 확인하기 위해서 이번 연구에서는 electric-thermal co-simulation을 수행하였으며 검증을 위해 DBC 기판과 IMS를 제작하여 실험하였다.

• 한국재료학회지
• /
• 제19권12호
• /
• pp.686-691
• /
• 2009

The effects of thermal properties on the crystallization behavior of $CaMgSi_2O_6$ glass-ceramics were investigated as a function of sintering temperature from 800$^{\circ}C$ to 900$^{\circ}C$. The crystallization behavior of the specimens depended on the sintering temperature, which could be evaluated from the differential thermal analysis, X-ray diffraction and Fourier transform infrared spectroscopy. With increasing sintering temperature, the thermal conductivity of the sintered specimens increased, while the coefficient of thermal expansion (CTE) of the sintered specimens decreased. These results could be attributed to the increase of crystallization, confirmed from the estimation by density measurements. Also, the thermal diffusivity and specific heat capacity of the sintered specimens were discussed with relation to the sintering temperature. Typically, a thermal conductivity of 3.084 $W/m^{\circ}C$, CTE of 8.049 $ppm/^{\circ}C$, thermal diffusivity of 1.389 $mm^2/s$ and specific heat capacity of 0.752 $J/g^{\circ}C$ were obtained for $CaMgSi_2O_6$ specimens sintered at 900$^{\circ}C$ for 5 h.

• 한국소음진동공학회논문집
• /
• 제24권7호
• /
• pp.562-568
• /
• 2014

This study aimed to identify changes in the physical properties of artificial mineral-fiber materials used as building insulation that had been installed in the outer walls of buildings for a long time. To achieve this goal, glass fiber and rock wool were collected from outer walls in actual buildings and their acoustic and thermal performances were measured. These were compared with measurements from similar products manufactured recently. The results showed that old, used samples had a lower sound absorption coefficient compared to recently manufactured materials. The old samples also displayed increased compressibility compared to new materials. For example, the compressibility difference for glass wool was 7.32 mm. Old samples had a dynamic stiffness $1.28MN/m^3$ higher than new material samples. The thermal conductivity of both old and new samples increased within creasing temperature. They showed similar results at temperatures between 0 and $20^{\circ}C$.

• 대한기계학회논문집B
• /
• 제21권4호
• /
• pp.570-578
• /
• 1997

At design stage of new motor or when taking remedial action of old motor, a lot of information can be obtained from thermal parameters analysis. This study focused on the temperature rise of TEFC induction motor with respect to various thermal parameters. Frame heat transfer had the most important effect on coil temperature rise. But those of air gap and rotor fan had no effect. This fact shows fan action is more important than fin action in the case of rotor fan. Coil temperature can be more decreased by cooling near the heat sources than any other parts from the results of thermal conductivity and loss tests. Variation of cooling air flow rate and motor volume effects on coil temperature were also tested. These tests suggest that improvement of cooling fan performance is important in reducing the coil temperature rise. Thermal equivalent program was verified by comparison of some experimental results.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
• /
• pp.131-134
• /
• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• Food Science and Biotechnology
• /
• 제14권3호
• /
• pp.328-333
• /
• 2005

Finite difference model and dynamic thermal property evaluation system were developed to estimate convection heat transfer coefficient by modeling temperature-time profile of beef cube in continuous flow sterilizing system. As input parameters of the model, specific heat and thermal conductivity values of beef frankfurter meat were independently measured from 20 to $80^{\circ}C$. Convection heat transfer coefficient was estimated by comparing simulated and measured temperature-time profiles. Actual temperature-time profiles of meat cube were measured at flow rates of 15, 30, and 45 L/min and viscosities from 0 to 15 cp, and mean values of convection heat transfer coefficients ranged from 792 to $2107\;W/m^2{\cdot}K$. Convection heat transfer coefficient increased with increase in flow rate and decreased as viscosity increased.

• Bulletin of the Korean Chemical Society
• /
• 제35권12호
• /
• pp.3527-3531
• /
• 2014

In this paper, we report thermodynamic and transport properties (diffusion coefficient, viscosity, and thermal conductivity) of diatomic gases ($H_2$, $N_2$, $O_2$, and $Cl_2$) at 273.15 K and 1.00 atm by performing molecular dynamics simulations using Lennard-Jones intermolecular potential and modified Green-Kubo formulas. The results of self-diffusion coefficients of diatomic gases obtained from velocity auto-correlation functions by Green-Kubo relation are in good agreement with those obtained from mean square displacements by Einstein relation. While the results for viscosities of diatomic gases obtained from stress auto-correlation functions underestimate the experimental results, those for thermal conductivities obtained from heat flux auto-correlation functions overestimate the experimental data except $H_2$.