• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.380-384
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• 2012

This paper deals with the recent developments of high thermal conductivity silicon nitride ceramics. First, the factors that reduce the thermal conductivity of silicon nitride are clarified and the potential approaches to realize high thermal conductivity are described. Then, the recent achievements on the silicon nitride fabricated through the reaction bonding and post sintering technique are presented. Because of a smaller amount of impurity oxygen, the obtained thermal conductivity is substantially higher, compared to that of the conventional gas-pressure sintered silicon nitride, while the microstructures and bending strengths are similar to each other between these two samples. Moreover, further improvement of the thermal conductivity is possible by increasing ${\beta}/{\alpha}$ phase ratio of the nitrided sample, resulting in a very high thermal conductivity of 177 W/($m{\cdot}K$) as well as a high fracture toughness of 11.2 $MPa{\cdot}m^{1/2}$.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.1 no.2
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• pp.162-172
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• 1989

The steady one dimensional heat flow method was used for the measurement of thermal conductivity of kaolin. The effects of the classification, density and moisture content on the thermal conductivity were studied experimentally for the 9 classes of kaolin in Korea. As the results of this study, it was found that the classification did not effect the thermal conductivity, and the conductivity increased as the density and moisture content increased. The correlation equation of the thermal conductivity as a function of the density increase rate was found and the values for the thermal conductivity as a function of moisture content were recommended.

• Journal of Ceramic Processing Research
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• v.19 no.6
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• pp.450-454
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• 2018

In recent years, thermal insulation coating technology for automotive engine parts has received significant attention as a means of improving the thermal efficiency of automotive engines. One of the characteristics of thermal insulation coatings is their low thermal conductivity, and, materials such as YSZ (Yttria-stabilized zirconia), which have low thermal conductivity, are used for this purpose. This research presents a study of the changes in the microstructure and thermal conductivity of $8YSZ/SiO_2$ multi compositional thermal insulation coating for different compositions, and particle size distributions of suspension, when it is subjected to suspension plasma spraying. To obtain a porous coating structure, the mixing ratio of 8YSZ and $SiO_2$ particles and the particle sizes of the $SiO_2$ were changed. The microstructure, phase formation behavior, porosity and thermal conductivity of the coatings were analyzed. The porosities were found to be 1.2-32.1%, and the thermal conductivities of the coatings were 0.797-0.369 W/mK. The results of the study showed that the microstructures of the coatings were strongly influenced by the particle size distributions, and that the thermal conductivities of the coatings were greatly impacted by the microstructures of the coatings.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.8
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• pp.1141-1151
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• 1998

An effective thermal conductivity measurement for suspensions of microparticles in oil mixture is conducted in order to evaluate the shear rate-dependence of the thermal conductivity of suspensions. Measurements are made for rotating Couette flows between two concentric cylinders. The rotating outer cylinder is immersed into a constant temperature water bath while the stationary inner cylinder is subject to a uniform heat fluff. Test fluids are made to be homogeneous suspensions, in which neutrally buoyant microparticles ($d=25{\sim}300{\mu}m$) are uniformly dispersed. The present measurements show strong shear-rate dependent thermal conductivities for the suspensions, which are higher than those at zero shear rate. The shear rate dependent thermal conductivity increases with the particle size and volume concentration.4 new model for shear rate-dependent thermal conductivity of microparticle suspensions is proposed; the correlation covers from zero shear rate value to asymptotic plateau value at moderately high shear rates.

• Journal of Biosystems Engineering
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• v.22 no.1
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• pp.59-67
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• 1997

An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

• 연구논문집
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• s.33
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• pp.147-155
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• 2003

In order to fabricate porous materials having an anisotropic thermal conductivity by aligning plate-shaped pores structure, alumina powder (AM-21, mean particle size $4\mum$) and flake crystalline graphite was used. The aligned pore structure was realized using multi-pressing process. Degree of pore orientation increased with the number of pressing and thermal conductivity, parallel to the pressing direction, decreased with the number of pressing. Thermal conductivity decreased significantly to the addition of 30vol% crystalline graphite, however, in the case of 60vol%, thermal conductivity did not decrease significantly due to the breakage of crystalline graphite. An anisotropy of the thermal conductivity increased with the content of crystalline graphite up to 30vol%. Graded pore structure was fabricated by controlling the content and size of crystalline graphite, which provides, possibly, the enhancement in mechanical strength and thermal insulation properties of the insulating bricks.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.163-166
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2\;and\;Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability

• Proceedings of the KIEE Conference
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• 2005.07b
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• pp.1237-1239
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• 2005

In this study, we estimate the thermal conductivity of stainless steel reinforced Bi-2223/Ag tape which was made from American Superconductor. The equipments for thermal conductivity measurement was set up using conduction cooled cryocooler. Two direction of thermal conductivity was measured. The one is the direction of cut length, and the other is direction of transverse of wounded coil with insulation material. It was observed that the thermal conductivity of transverse direction of coil was extremely lower than that of cut length direction. It was mainly seems that superconducting filaments and insulation material were effected on thermal conductivity in thermal conductivity of transverse direction.

• Carbon letters
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• v.22
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• pp.25-35
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• 2017

The aim of the work was to investigate the thermo-electrical properties of low cost and rapidly produced randomly oriented carbon/carbon (C/C) composite. The composite body was fabricated by combining the high-pressure hot-pressing (HP) method with the low-pressure impregnation thermosetting carbonization (ITC) method. After the ITC method step selected samples were graphitized at $3000^{\circ}C$. Detailed characterization of the samples' physical properties and thermal properties, including thermal diffusivity, thermal conductivity, specific heat and coefficient of thermal expansion, was carried out. Additionally, direct current (DC) electrical conductivity in both the in-plane and through-plane directions was evaluated. The results indicated that after graphitization the specimens had excellent carbon purity (99.9 %) as compared to that after carbonization (98.1). The results further showed an increasing trend in thermal conductivity with temperature for the carbonized samples and a decreasing trend in thermal conductivity with temperature for graphitized samples. The influence of the thickness of the test specimen on the thermal conductivity was found to be negligible. Further, all of the specimens after graphitization displayed an enormous increase in electrical conductivity (from 190 to 565 and 595 to 1180 S/cm in the through-plane and in-plane directions, respectively).

• Progress in Superconductivity
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• v.4 no.2
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• pp.180-183
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• 2003

We evaluated the effect of alloying-element additions to Ag sheath on thermal conductivity of Bi-2223 superconductor tapes. In order to evaluate the effect of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as inner and outer sheath. Thermal conductivity of the tapes was measured by using thermal integral method at 10∼120 K. It is observed that the presence of alloying-elements such as Mg, Sb, and Au in Ag sheath results in decreased thermal conductivity at low temperature. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectively, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their values of constituent sheath materials.