• 한국재료학회지
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• 제12권10호
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• pp.820-824
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• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• 한국전기전자재료학회논문지
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• 제35권1호
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• pp.50-57
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• 2022

Reliability of CMOS has been severed under aggressive device scaling. Conventional technologies such as lightly doped drain (LDD) and forming gas annealing (FGA) have been applied for better device reliability, but further advances are modest. Alternatively, electro-thermal annealing (ETA) which utilizes Joule heat produced by electrodes in a MOSFET, has been newly introduced for gate dielectric curing. However, concerns about mechanical stability during the electro-thermal annealing, have not been discussed, yet. In this context, this paper demonstrates the mechanical stability of nanosheet FET during the electro-thermal annealing. The effect of mechanical stresses during the electro-thermal annealing was investigated with respect to device design parameters.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1571-1572
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• 2009

Polymer solar cells were fabricated with gravure printing process and the effect of thermal annealing of gravure printed organic layer was investigated. The layer structure of polymer solar cells is glass / ITO / hole transfer layer / active layer / Al structure was fabricated. For the active layer, 1:1 ratio of poly-3-hexylthiophene (P3HT) and [6,6]-phenyl C61-butyric acid methyl ester (PCBM) mixture was applied. The P3HT/PCBM blend was gravure printed onto the substrates. The effect of thermal annealing was investigated by changing annealing time and the number of printing. Maximum 3.6% of power conversion efficiency was achieved with gravure printing of organic layer and thermal annealing in this work.

• 한국인터넷방송통신학회논문지
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• 제10권1호
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• pp.7-13
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• 2010

질소 분위기하에서 분자선 에피탁시 장치로 성장한 GaN 에피층을 고온 열처리 하였다. 시료는 적절한 조건하에서 급속 열처리 후 구조적인 특성의 향상을 나타내었다. 시료의 결정성의 향상은 에피층의 격자 관련 요소들의 흐트러짐의 감소에 기인한다. 에피층의 열처리는 950도의 급속 열처리로를 이용하여 수행하였다. 고온 급속 열처리가 GaN 에피층의 구조적인 특성들에 미치는 효과는 x선 회절을 통하여 연구하였다. x선 회절 스펙트럼에 있어서 Bragg 피크는 열처리 시간이 증가할수록 각도가 큰 쪽으로 이동하였다. 또한 피크의 FWHM은 열처리 시간이 증가함에 따라 약간의 증가 후 감소하였으며 이후 다시 증가하였다. 이와 같은 결과는 급속 고온 열처리된 GaN 에피층에서 격자 상수에 영향을 미치는 인자들이 에피층의 품질을 좋게 하는 방향으로 일률적으로 변화하는 것이 아니라 에피 품질을 나쁘게 하는 방향으로도 변화한다는 것을 의미한다. 적절한 조건 하에서의 급속 열처리는 에피층의 격자 상수에 관여하는 인자들의 흐트러짐을 감소시켜 에피 결정의 질을 향상시킨다.

• Journal of information and communication convergence engineering
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• 제3권3호
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• pp.137-141
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• 2005

The paper presents some methods to improve characteristics of film bulk acoustic resonator (FBAR) devices. The FBAR devices were fabricated on Bragg reflectors. Thermal treatments were done by sintering and/or annealing processes. The measurement showed a considerable improvement of return loss $(S_{11})$ and quality factor $(Q_{s/p}).$ These thermal treatment techniques seem very promising for enhancing FBAR resonance performance.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권3호
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• pp.239-243
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• 2008

In this study, Bi-Sb thin film structure was prepared by thermal evaporation method. The electrical, optical transmission and structural characteristics of the prepared samples were introduced before and after thermal annealing process. At temperature of $500^{\circ}C$, the absorption of the structure was improved to reach 97% at near-infrared region. As well, the thermal annealing caused to reduce the bulk resistance of the Bi-Sb thin film structure. The morphology of Bi-Sb structure was also improved by thermal annealing as characteristic islands of the structure appear clearly in form hexagonal areas distinct from each other. This study is aiming to examine such structures if they are employed as photonic devices such as photodetectors, LED's and optical switches.

• 한국인터넷방송통신학회논문지
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• 제8권6호
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• pp.105-110
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• 2008

질소 분위기 하에서 GaN 에피층의 고온 급속 열처리 효과를 조사하였다. 열처리는 950도의 급속 열처리로를 이용하여 수행하였다. 급속 열처리에 따른 효과는 x선 회절을 통하여 연구하였다. 열처리 시간이 증가할수록 Bragg 피크는 각도가 큰 쪽으로 이동하였다. 피크의 FWHM은 열처리 시간이 증가함에 따라 약간의 증가 후 감소하였다가 다시 증가하였다. 시료는 적절한 조건 하에서 급속 열처리 후 구조적인 특성의 개선이 관측되었다. 시료의 결정성의 향상은 에피층의 격자 관련 요소들의 흐트러짐의 감소에 기인한다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2003년도 추계종합학술대회
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• pp.633-636
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• 2003

본 논문에서는 ZnO를 사용한 다층 박막 SMR 소자의 공진 특성을 개선하기 위해서 실리콘 기판 상부에 형성된 W/SiO$_2$의 Bragg reflector를 thermal annealing한다. SMR 소자의 공진 특성은 Bragg reflector에 적응된 annealing 조건에 의존함을 관찰할 수 있었다. annealing을 하지 않은 Bragg reflector를 갖는 SMR 소자와 비교했을 경우, 40$0^{\circ}C$/30min의 조건으로 annealing된 Bragg reflector를 갖는 SMR 소자가 가장 훌륭한 공진특성을 나타내었다. 새롭게 제안된 annealing 공정은 W/SiO$_2$ 다층 박막 Bragg reflector를 갖는 SMR 소자의 공진 특성을 효과적으로 개선시키는데 있어 매우 유용할 것으로 보인다.

• 한국전기전자재료학회논문지
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• 제36권1호
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• pp.23-28
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• 2023

This paper demonstrates a novel NAND flash memory structure and annealing configuration including through-silicon via (TSV) inside the silicon substrate to improve annealing efficiency using an electro-thermal annealing (ETA) technique. Compared with the conventional ETA which utilizes WL-to-WL current flow, the proposed annealing method has a higher annealing temperature as well as more uniform heat distribution, because of thermal isolation on the silicon substrate. In addition, it was found that the annealing temperature is related to the electrical and thermal conductivity of the TSV materials. As a result, it is possible to improve the reliability of NAND flash memory. All the results are discussed based on 3-dimensional (3-D) simulations with the aid of the COMSOL simulator.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.473-474
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• 2006

We report on the rapid thermal annealing effect on the electrical, optical, and structural properties of IZO transparent conducting oxide films grown by box cathode sputtering (BCS). To investigate structural properties of rapid thermal annealed IZO films in $N_2$ atmosphere as a function of annealing temperature, syncrotron x-ray scattering experiment was carried out. It was shown that the amorphous structure of the IZO films was maintained until $400^{\circ}C$ because ZnO and $In_2O_3$ are immiscible and must undergo phase separation to allow crystallization. In addition, the IZO films grown at different Ar/$O_2$ ratio of 30/1.5 and 30/0 showed different preferred (222) and (440) orientation, respectively, with increase of rapid thermal annealing temperature. The electrical properties of the OLED with rapid thermal annealed IZO anode was degraded as rapid thermal annealing temperature of IZO increased. This indicates the amorphous IZO anode is more beneficial to make high-quality OLEDs.