• Journal of Aerospace System Engineering
• /
• v.13 no.2
• /
• pp.34-42
• /
• 2019

The existence of different thermodynamic properties results in various undesirable effects, such as thermal deformation and residual stress, in heat-welding processes. The solid-state junction, by using explosive or electromagnetic forces, i.e., high-velocity impact welding without employing heat is advantageous in joining materials with different thermodynamic properties. In the solid-state junction, the joining is performed within a short time, a high velocity and large deformations are accompanied by interfacial surfaces. The numerical analysis models play an important role in the understanding of the mechanism of high-velocity impact welding. However, in the analysis of high velocity and large deformations, the conventional Lagrangian method has low reliability due to the occurrence of entanglements. In this study, high-velocity impact welding between Cu and CP-Ti with different thermodynamic properties was performed using a un-gridded numerical method, SPH (Smoothed Particle Hydrodynamics), and interfacial morphology occurred. As a result of the analysis, the interfacial morphology was confirmed and the compared degree of shape (straight, vortex), period, length, and so on appeared differently depending on the relationship between the parameters (impact angle and speed).

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.6
• /
• pp.455-467
• /
• 2017

In this study, a finite element analysis of a cylindrical multi-pass weldment for dissimilar metals was performed. The effects of the heat input method and weld bead generation method were considered. We compared two heat input methods: the heat flux method and the temperature method. We also compared two weld bead generation methods: the element birth method and the quiet element method. Although the results of the thermal analysis show deviations between the two heat input methods, the welding residual stresses were similar. Because the areas exposed to high temperature were similar and the strength of the material was very low in high temperature (above the $1000^{\circ}C$), the effects of the weld bead temperature were insignificant. The distributions of the welding residual stress were similar to each other. However, gaps and overlaps occurred on the welding boundary surfaces when the element birth method was applied. The quiet element method is more suitable for a large deformation model in order to simulate a more accurate weld shape.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.37-42
• /
• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.7-15
• /
• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Composites Research
• /
• v.18 no.2
• /
• pp.20-29
• /
• 2005

To evaluate the flexural deformation and strength of composite motor case above the glass transition temperature$(T_g),\;170^{\circ}C$, of resin material, a finite element analysis(FEA) model in which material non-linearity and progressive failure mode were considered was proposed. The laminated flexural specimens which have the same lay-up and thickness as the composite motor case were tested by 4-point bending test to verify the validity of FEA model. Also. mechanical properties in high temperature were evaluated to obtain the input values for FEA. Because the material properties related to resin material were highly deteriorated in the temperature range beyond $T_g$, the flexural stiffness and strength of laminated flexural specimen in $200^{\circ}C$ were degraded by also $70\%\;and\;80\%$ in comparison with normal temperature results. Above $T_g$, the failure mode was changed from progressive failure mode initiated by matrix cracking at $90^{\circ}$ ply in bottom side and terminated by delamination at the center line of specimen to fiber compressive breakage mode at top side. From stress analysis, the progressive failure mechanism was well verified and the predicted bending stiffness and strength showed a good agreement with the test results.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.16 no.5
• /
• pp.112-120
• /
• 2012

A numerical model considering the internal vaporization and the creep effect, in the form of a analytical program, for tracing the behavior of high strength concrete(HSC) members exposed to fire is presented. The two stages, i.e., spalling procedure and fire resistance time, associated with the thermal, moisture flow, creep and structural analysis, for the prediction of fire resistance behavior are explained. The use of the analytical program for tracing the response of HSC member from the initial pre-loading stage to collapse, due to fire, is demonstrated. Moisture evaporates, when concrete is exposed to fire, not only at concrete surface but also at inside the concrete to adjust the equilibrium and transfer properties of moisture. Finite element method is employed to facilitate the moisture diffusion analysis for any position of member, so that the prediction method of the moisture distribution inside the concrete members at fire is developed. The validity of the numerical model used in this program is established by comparing the predictions from this program with results from others fire resistance tests. The analytical program can be used to predict the fire resistance of HSC members for any value of the significant parameters, such as load, sectional dimensions, member length, and concrete strength.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.75-82
• /
• 2019

Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.1
• /
• pp.31-39
• /
• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Korean Journal of Materials Research
• /
• v.9 no.12
• /
• pp.1245-1251
• /
• 1999

Phase-change optical disk very rapid recording, high densification of data, resulting in high feedback rate and good C/N(carrier to noise) ratio of a feedback signal. However, repetitive thermal energy may cause the deformation of a disk or the lowering of an eliminability and a cyclability of the recording. The lowering of the cyclability can be reduced by insertion of thin layer of ZnS-$SiO_2$ dielectric thin film in appropriate disk structure between the upper and lower part of the recording film. Using the Taguchi method, optimum conditions satisfying both the optimized quality characteristic values and the scattering values for film formation were found to be the target R.F. power of 200W, the substrate R.F. power of 20W, the Ar pressure of 6mTorr, and the electrode distance of 6cm. From the refractive index data, the existence of the strong interaction between the electrode distance and Ar pressure was confirmed, and so was the large effect of the electrode distance on transmittance. According to the analysis of TEM and XRD, the closer the electrode distance was, the finer was the grain size due to the high deposition rate. However, the closer electrode distance brought the negative effect on the morphology of the film and caused the reduction of transmittance. AFM and SEM analyses showed that the closer the electrode distance was, the worse was the morphology due to the high rate of the deposition. Under optimum condition, the deposited thin film showed a good morphology and dense microstructure with less defects.

• Journal of Acupuncture Research
• /
• v.30 no.5
• /
• pp.51-64
• /
• 2013

Objectives : This study is performed to develop the oriental medical rating scale of knee pain and to assess its validity. Methods : 250 knee pain patients completed the previously accepted rating scale of knee pain(VAS, WOMAC(pain, function, stiffness), 6 minute walk test(number of steps, distance)) and oriental medical rating scale of knee pain which was developed by Hwang et al at 2012, before and after the 6 weeks acupuncture treatment. Comparing these results, we assessed the validity of oriental medical rating scale. Results : Comparing oriental medical rating scale of knee pain before acupuncture treatment with VAS, WOMAC(pain, function, stiffness) and 6 minute walk test(number of steps, distance), oriental medical rating scale showed correlation with VAS, WOMAC(pain, function, stiffness) and showed the highest correlation with WOMAC(function). Comparing the change of oriental medical rating scale of knee pain after 6 weeks of acupuncture treatment with the change of VAS, WOMAC(pain, function, stiffness) and 6 minute walk test(number of steps, distance) after 6 weeks, change of oriental medical rating scale showed correlation with the change of VAS, WOMAC(pain, function, stiffness) and showed the highest correlation with the change of WOMAC(function). Through factor analysis of oriental medical rating scale items, 4 factors(pain, swelling, deformation of the knee, thermal sense of the knee), 17 items were extracted. Conclusions : Oriental medical rating scale of knee pain reflected the patient's pain, functional limitation and stiffness well. And oriental medical rating scale reflected the patient's functional improvement after the treatment well.