• Design & Manufacturing
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• v.6 no.1
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Design & Manufacturing
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• v.8 no.2
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.1
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• pp.1-7
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• 2015

This paper predicts the spring-in effect of curved laminated composite structure for various stacking sequence using finite element analysis(ABAQUS). In composite manufacturing process, large temperature difference, different coefficient of thermal expansion and chemical shrinkage effect cause distortion of composite parts such as spring-in and warpage. Distortion of composite structure is important issue on quality of product, and it should be considered in manufacturing process. In finite element analysis, a CHILE(Cure Hardening Instantaneously Linear Elastic) model and chemical shrinkage effects are considered developing user subroutine in ABAQUS and some cases are simulated.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.486-491
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• 2008

This paper describes a model identification method that has been applied to a commercial 12-inch RTP (rapid thermal processing) equipment with an ultimate aim to develop a high-performance advanced controller. Seven thermocouples are attached on the wafer surface and twelve tungsten-halogen lamp groups are used to heat up the wafer. To obtain a MIMO balanced state space model, multiple SIMO (single-input multiple-output) identification with highorder ARX models have been conducted and the resulting models have been combined, transformed and reduced to a MIMO balanced state space model through a balanced truncation technique. The identification experiments were designed to minimize the wafer warpage and an output linearization block has been proposed for compensation of the nonlinearity from the radiation-dominant heat transfer. As a result from the identification at around 600, 700, and $800^{\circ}C$, respectively, it was found that $y=T(K)^2$ and the state dimension of 80-100 are most desirable. With this choice the root-mean-square value of the one-step-ahead temperature prediction error was found to be in the range of 0.125-0.135 K.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.6
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• pp.63-68
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• 2017

The purpose of this study is to improve the whitening phenomenon around the PET preform gate for blow molding. CAE analysis of plastic injection molding has been applied to design of preform shape and select the injection molding conditions. A ceramic insulation gate with lower thermal conductivity than metal is applied to improve the whitening phenomenon created around the gate in the injection molding process. According to the results of CAE analysis, the warpage deformation at the square corner was estimated to be about 0.34 mm at the bottom. From the results of the temperature history analysis, it was confirmed that the resin near the gate cooled more rapidly than the cavity. Ceramic insulated gates were fabricated to reduce the cooling rate and experiments were conducted to confirm the effectiveness of the whitening phenomenon improvement. As a result of the ceramic insulation gate experiment, it was confirmed that the whitening phenomenon was significantly reduced around the gate.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.43-49
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• 2016

Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.3815-3821
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• 2012

The LCD frame is an important part which supports the BLU of medium/large sized TFT-LCD. To produce it efficiently, it is necessary to achieve the molding process improvement from 1 cavity to 2 cavity system. Because 2 cavity mold is compact and its hot-runner zone is broadened, it is difficult to control the temperature on the mold. In this study, injection molding analysis on the frame in 2 cavity process with FEA(Finite Element Analysis) software is carried out to estimate its quality. The calculated injection molding pressures and maximum deflection in 1 and 2 cavity processes are 41.13 MPa and 1.62 mm, 40.49 MPa and 1.66 mm respectively. The measured maximum flexure load and surface roughness of the left and right frame of 2 cavities are 209 N and 0.08 ${\mu}m$, 193 N and 0.10 ${\mu}m$ while those in 1 cavity are 140 N and 0.13 ${\mu}m$. Thermal image shows that the maximum standard deviation of the temperature on left and right side of 2 cavity mold is $1.23^{\circ}C$. The simulation and measurement results show that the quality of the frame in 2 cavity injection molding process as a whole is not worse than that of 1 cavity system. But maximum flexure loads of the frame in 2 cavity process are far greater than that in 1 cavity process.