• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.57-62
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• 2014

Using flexible bismaleimide-triazine co-polymer as a substrate, inkjet-printed Cu films were also investigated for low-cost and process feasibility of flexible electronics. After annealing at $200^{\circ}C$ for 1 h under various reducing ambient, surface color was changed to red and electrical resistivity was decreased to the level of conductor under formic acid ambient. However, its resistivity was much higher than conventional copper films due to surface crack. In order to reduce the residual film stress after annealing, additional isothermal treatment was inserted before anneal hiring the stress relaxation applied in processes of amorphous materials. As a result, no surface crack was observed and electrical resistivity of $3.4{\mu}{\Omega}cm$ was measured after annealing at $230^{\circ}C$ with stress relaxation while electrical resistivity of $7.4{\mu}{\Omega}cm$ was observed after normal annealing without relaxation. The effect of stress relaxation was also confirmed by observing surface crack after decreasing the relaxation time to 0 min.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.389-396
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• 2008

The effect of thermal cycling on bond strength and residual stress at the interface between benzocyclobutene (BCB) and plasma enhanced chemical vapor deposited (PECVD) silicon dioxide ($SiO_2$) coated silicon wafers were evaluated by four point bending and wafer curvature techniques. Wafers were bonded using a pre-established baseline process. Thermal cycling was done between room temperature and a maximum peak temperature. In thermal cycling performed with 350 and $400^{\circ}C$ peak temperature, the bond strength increased substantially during the first thermal cycle. The increase in bond strength is attributed to the relaxation in residual stress by the condensation reaction of the PECVD $SiO_2$: this relaxation leads to increases in deformation energy due to residual stress and bond strength.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1996.11a
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• pp.17-17
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• 1996

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.16-22
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• 1998

This paper addresses a method which can be used for analyzing thermal stresses of a functionally graded material(FGM) using semi-analytical approach. FGM is a nonhomogeneous material whose composition is changed continuously from a metal surface to a ceramic surface. An infinite one dimensional FGM plate is considered. The temperature distribution in the FGM is obtained by approximate Green's function solution. To expedite the convergence of the solutions, alternative Green's function solution is derived and shows good agreement with results from finite difference method. Thermal stresses are calculated using temperature distribution of the plate.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.28 no.1
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• pp.71-78
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• 1992

Zr-4 used for a cladding and an end plug of reactor component has creep deformation under operation at high temperature. Creep is regarded as the time dependent deformation of a material under constant applied stress. Although the major source of the deformation of zirconium component in water-cooled reactors is irradiation creep, the thermal creep may give a rise to significant deformation in reactor component especially at relatively high temperatures and at various constant stresses, and therefore it must be predicted accurately. Stress relaxation is the time dependent change of stress at constant strain and it is a process related intimately to creep. In this paper, the creep behavior and stress relaxation of Zr-4 is examined at the temperature of 50$0^{\circ}C$ that is 40% of the absolute melting temperature of Zr-4 under the stress below yield stress and under the various constant strains. The results obtained are summarized as follows: 1) With an increase of stress, the steady state creep rate increases and the creep rupture time decreases. 2) The steady state creep rate $\varepsilon$(%/s) for the stress $\sigma$sub(c) (kgf/mm super(2)) of Zr-4 increases outstandingly. All the empirical equations computed for Zr-4 increases outstandingly. All the empirical equations computed for Zr-4 are in accord with Norton's model equation($\varepsilon$=K$\sigma$ sub(c) super (n)). The constants of materials computed are as follows: K=3.9881$\times$10 super(-5), n=1.9608 3) The rupture time T sub(r) (hr) decreases linearly with the increase of stress on the log-log scaled graph. The empirical equations computed for Zr-4 are in accord with Bailey's model equation (T sub(r)=K sub(1)$\sigma$sub(c) super(m)). The constants of materials computed are as follows: K sub(1)=1.2875$\times$10 super(16), m=-3.467 4) It seems clear that the strain could be quantitatively dependent on the high temperature creep properties such as creep stress, rupture time, steady state creep rate and total creep rate. It is found that these relationships are linear on the log-log graph. 5) In stress relaxation test, as the critical constant strain that can be allowed to the specimen is larger, stress relaxation becomes more rapid, and as the constant strain is smaller, the stress relaxation becomes slower.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.1
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• pp.50-56
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• 2007

Exhaust manifold is generally subjected to thermal cycle loadings ; at hot condition, large compressive plastic deformations are generated, and at cold condition, tensile stresses are remained in highly deformed critical zones. These phenomena originate from the fact that thermal expansions of the runners are restricted by inlet flange clamped to the cylinder head, because the former is less stiff than the latter and, the temperature of the inlet flange is lower than that of the runners. Since the failure of an exhaust manifold is mainly caused by geometric constraints between the cylinder head and the manifold, the thermal stress can be controlled by geometric factors. The generic geometric factors include the inter distance (2R), the distance from the head to the outlet (L), the tube diameter(d) and the tube thickness (t). This criteria based on elastic analysis up to onset of yield apparently indicate that the pre-stress also reduces the factor; however, high temperature relaxation may reduce this effect at later operation stage.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.95-100
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• 2004

An analysis using FEM simulation was conducted to predict residual stresses and birefringence in simple compressed cylindrical glass as a preliminary part of the optimum design determination of optical lenses. The FEM simulation with the Maxwell viscoelastic constitutive model was used to predict thermal induced residual stresses and birefringence during the compression test considering stress relaxation. Also the linear photoelastic theory was introduced to calculate birefringence from the residual stress state. The simulation results were in good agreement with deformation and birefringence distribution in the existing experimental result.

• Transactions of Materials Processing
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• v.13 no.6 s.70
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• pp.509-514
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• 2004

An analysis using FEM simulation was conducted to predict residual stresses and birefringence in simple compressed cylindrical glass as a preliminary part of the optimum design determination of optical lenses. The FEM simulation with the Maxwell viscoelastic constitutive model was used to predict thermal induced residual stresses and birefringence during the compression test considering stress relaxation. Also the linear photoelastic theory was introduced to calculate birefringence from the residual stress state. The error of simulation results between experimental results in the birefringence value at the center of glass specimen is $4.2\%$, and the error in the maximum radius of deformed glass specimen is $1.2\%$. The simulation results were in good agreement with deformation and birefringence distribution in the existing experimental result.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2342-2354
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• 2002

The present study has numerically predicted both the flow -induced and thermally-induced residual stresses and birefringence in injection o. injection/compression molded center -gated disks. Analysis system for entire molding process was developed based on an ap propriate physical modeling including a nonlinear viscoelastic fluid model, stress-optical law, a linear viscoelastic solid model, free volume theory for density relaxation phenomena and a photoviscoelasticity and so on. Part I presents physical modeling a nd typical numerical analysis results of residual stresses and birefringence in the injection molded center-gated disk. Thermal residual stress was found to be extensional near the center, compressive near the surface and tend to become toward tensional at the surface. A double-hump profile was obtained across the thickness in birefringence distribution: nonzero birefringence is found to be thermally induced, the outer peak is due to the shear flow and subsequent stress relaxation during the filling stage a nd the inner peak is due to the additional shear flow and stress relaxation during the packing stage. Predicted birefringence including both the flow -induced and thermally-induced one becomes quite similar to the experimental one.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.612-618
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• 1998

Monolithic SiC and SiC/C FGM layers were deposited on the graphite substrates by the CVD method and their thermal properties of the two specimens were investigated by thermal shock test for comparison. Temperature profiles and thermal stress distributions on thermal shock test were calculated by a commercially used computer program to see the thermal stress differences inside of two specimens. The specimens coated with FGM were expected to show a efficient relaxation of thermal stresses at the interface and they were not cracked under the actual $\Delta$T=1600 K experimental condition. This result proved that the experimental results were well accorded with the expectation from the theoretical calculations.