• Structural Engineering and Mechanics
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• v.82 no.4
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• pp.469-476
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• 2022

A mathematical model of Lord-Shulman photo-thermal theorem induced by pulse heat flux is presented to study the propagations waves for plasma, thermal and elastic in two-dimensional semiconductor materials. The medium is assumed initially quiescent. By using Laplace-Fourier transforms with the eigenvalue method, the variables are obtained analytically. A semiconductor medium such as silicon is investigated. The displacements, stresses, the carrier density and temperature distributions are calculated numerically and clarified graphically. The outcomes show that thermal relaxation time has varying degrees of effects on the studying fields.

• Transactions of Materials Processing
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• v.17 no.7
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• pp.496-500
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• 2008

Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behavior of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.288-292
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• 2008

Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behaviour of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.12
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• pp.1494-1500
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• 2004

A zero-dimensional direct simulation Monte Carlo(DSMC) model is developed for simulating diatomic gas including vibrational kinetics. The method is applied to the simulation of two systems: vibrational relaxation of a simple harmonic oscillator and translational-rotational-vibrational energy exchange process under heating and cooling. In the present DSMC method, the variable hard sphere molecular model and no time counter technique are used to simulate the molecular collision kinetics. For simulation of diatomic gas flows, the Borgnakke-Larsen phenomenological model is adopted to redistribute the translational and internal energies.

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.273-281
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• 2016

This review examines computational simulations of thermoelectric properties, such as electrical conductivity, Seebeck coefficient, and thermal conductivity. With increasing computing power and the development of several efficient simulation codes for electronic structure and transport properties calculations, we can evaluate all the thermoelectric properties within the first-principles calculations with the relaxation time approximation. This review presents the basic principles of electrical and thermal transport equations and how they evaluate properties from the first-principles calculations. As a model case, this review presents results on $Bi_2Te_3$ and Si. Even though there is still an unsolved parameter such as the relaxation time, the effectiveness of the computational simulations on the transport properties will provide much help to experimental scientist researching novel thermoelectric materials.

• Steel and Composite Structures
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• v.20 no.5
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• pp.1103-1117
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• 2016

The present investigation is to study the plane problem in initially stressed thermoelastic half-space with voids due to thermal source. Lord-Shulman (Lord and Shulman 1967) theory of thermoelasticity with one relaxation time has been used to investigate the problem. A particular type of thermal source has been taken as an application of the approach. Finite element technique has been used to solve the problem. The components of displacement, stress, temperature change and volume fraction field are computed numerically. The resulting quantities are depicted graphically for different values of initial stress parameter. The relaxation time and the initial stress parameter have a significant effect on all distributions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1065-1073
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• 2009

In this paper, the estimation method of C(t)-integral for combined mechanical and thermal loads is proposed for elastic-plastic-creep material via 3-dimensional FE analyses. Plasticity induced by initial loading makes relaxation rate different from those produced elastically. Moreover, the interactions between mechanical and thermal loads make the relaxation rate different from those produced under mechanical load alone. To quantify C(t)-integral for combined mechanical and thermal loads, the simplified formula are developed by modifying redistribution time in existing work done by Ainsworth et al..

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.273-276
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• 2008

Thermoplastic resin takes place stress relaxation and creep according to temperature and time. In room temperature, time dependent deformation (TDD) of polymer was carried out at previous study. In this study, it evaluates time dependent deformation to relate temperature. Nanoscale indents can be used as cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. Therefore, it is important to control pattern depth for change of indent depth by creep when using Nanoindenter. For evaluating TDD at high temperature, it is occurred thermal-nanoindentation test by changing hold time at maximum load. Temperature is putted at $90^{\circ}C$, hold time at maximum loads are putted at 1, 10, 50, 100, 200, 300 and 500s.

• Journal of the Korean Ceramic Society
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• v.36 no.9
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• pp.923-929
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• 1999

The cause of optical nonlinearity induced in thermally poled silica glass is believed to be the space charge polarization. Since the second order optical nonlinearity (electro-optic effect) can be used in optical switches the optical nonlinearity in silica glass has drawn a large attention. Space charge polarization occurs when an ionic conducting material is subjected to dc electric field by the blocking electrode. Thermal poling performed to induce the optical nonlinearity in silica glass is basically identical to the process generating space charge polarization. As a first step to understand the mechanism of space charge polarization in silica glass hence the induced optical nonlinearity the absorption currents as functions of time were measured for various types of silica glasses and analyzed by the theory of space charge polarization. It was found that the electrical relaxation exhibited a step by the space charge polarization in the relatively long time range and dielectric loss peak showed a maximum at a specific temperature which is depending on type of silica glass. It was turned out that this relaxation might be a cause of nonlinearity in electrical conductivity of silica glass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.87-87
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• 2010

Epoxy/mica has been used as the material of high-voltage rotator stator winding due to its high insulation performance, mechanical strength, and thermal stability. In recent years, however, it shows frequent changes in the load of generators and frequent automatic stops due to the significant increase in peak loads from the increase in the applied load of power facilities according to the introduction of advanced and high-technology equipments. Thus, it is necessary to develop new materials that highly develop the conventional insulation materials. Nanotechnology introduced in the present time has become an alternative plan that overcomes such technical limitations. In addition, the nano-scaled intercalation composite has been known as the material that represent excellent electrical, mechanical, and thermal characteristics compared to the conventional materials. This study investigated the dielectric dispersion and relaxation characteristics of the nanocomposite, which was fabricated by mixing epoxy matrix with nano-scaled intercalation mica and clay, according to changes in frequencies and temperatures.