• 한국콘텐츠학회논문지
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• 제20권11호
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• pp.333-341
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• 2020

감열지는 편의점 영수증, 로또, ATM 영수증 등 일상생활에 널리 이용되어 범죄와 관련된 현장에서 쉽게 발견될 수 있기 때문에 감열지에서 지문을 현출하는 일은 매우 중요하다. 본 연구에서는 일부 문헌에서 감열지에서의 지문 현출이 효과적이라고 주장하는 vacuum metal deposition(VMD) 기법의 효과성을 알아보기 위해 감열지의 잠재지문 현출용 시약인 1,2-indanedione(SOON-100)과 VMD 기법 간의 지문 현출력을 비교하였다. 지문을 유류한 검체를 직사광선이 없는 평균온도 20 ℃의 환경에서 1, 3, 6, 12, 24 시간동안 보관하였다. SOON-100과 VMD 기법을 적용한 결과, SOON-100의 경우 신선한 지문의 융선은 흐리게 나타났지만 유류한 지 1시간이 지난 후부터는 개인 식별이 가능할 정도의 선명한 지문이 관찰되었다. VMD의 경우 유류한지 6시간이 경과한 이후부터는 지문이 점차 번져 융선의 품질이 급격히 떨어지는 것을 관찰할 수 있었다. 이 결과는 VMD의 지문 현출 원리에 부합하는 것으로 볼 수 있다. VMD의 현출 원리와 감열지 표면의 특성을 고려해보면 VMD가 감열지 잠재지문 현출 기법으로는 적절하지 못하다는 것을 알 수 있다.

• 한국CDE학회논문집
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• 제9권4호
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Journal of Electrical Engineering and Technology
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• 제13권6호
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• pp.2276-2283
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• 2018

A 50kW-4000rpm interior permanent magnet synchronous machine (IPMSM) applied to the high-performance electric vehicle (EV) is introduced in this paper. The main work of this paper is that a 2-D T-type lumped-parameter thermal network (LPTN) model is presented for IPMSM temperature rise calculation. Thermal conductance matrix equation is generated based on calculated thermal resistance and loss. Thus the temperature of each node is obtained by solving thermal conductance matrix. Then a 3-D liquid-solid coupling model is built to compare with the 2-D T-type LPTN model. Finally, an experimental platform is established to verify the above-mentioned methods, which obtains the measured efficiency map and current wave at rated load case and overload case. Thermocouple PTC100 is used to measure the temperature of the stator winding and iron core, and the FLUKE infrared-thermal-imager is applied to measure the surface temperature of IPMSM and controller. Test results show that the 2-D T-type LPTN model have a high accuracy to predict each part temperature.

• Journal of Ceramic Processing Research
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• 제13권spc2호
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• pp.308-311
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• 2012

A wide range of possible hazards existing in thermal batteries are mainly caused by thermal runaway, which results in overheating or explosion in extreme case. Battery separators ensure the separation between two electrodes and the retention of ion-conductive electrolytes. Thermal runaways in thermal batteries can be significantly reduced by the adoption of these separators. The high operating temperature and the violent reactivity in thermal batteries, however, have limited the introduction of conventional separators. As a substitute for separators, MgO powders have been mostly used as a binder to hold molten salt electrolyte. During recent decades the fabrication technology of ceramic fiber, which has excellent mechanical strength and chemical stability, has undergone significant improvement. In this study we adopted wet-laid nonwoven paper making method instead of the electrospinning method which is costly and troublesome to produce in volume. Polymeric precursor can readily be coated on the surface of wet-laid ceramic paper, and be formed into ceramic film after heat treatment. The mechanical strength and the thermo-chemical stability as well as the wetting behaviors of ceramic separators with various molten salts were investigated to be applicable to thermal batteries. Due to their excellent chemical, mechanical, and electrical properties, wet-laid nonwoven separators made from ceramic fibers have revealed positive possibility as new separators for thermal batteries which operate at high temperature with no conspicuous sign of a short circuit and corrosion.

• 전기학회논문지
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• 제61권4호
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• pp.555-566
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• 2012

This paper presents a thermal analysis of an interior PM synchronous machine with concentrated winding for electric vehicle. The conventional thermal equivalent network model has been used for a long time for calculation of the temperature rises in electrical machines. In spite of being popular, this method can not be applied correctly for elements with complicated cooling structure like liquid cooled housing. To overcome this drawbacks, in this paper, a hybrid thermal model using the result of CFD analysis partly. Using this method, to improve a thermal performance of PMSM with concentrated winding, the effects of two design parameters are analysed. Finally, the accuracy of this model has been verified by experiments for the developed 21kW motor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집B
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• pp.367-372
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• 2000

By the means of microcellular (earning, we can make polymers with $10{\mu}m$ sized gas bubbles. After the $CO_2$ gas bubbles solve, diffuse and leave the polymer matrix, the thermal properties of polymer matrix are changed. Expecially, thermal conductivity becomes low. So, the polymer matrixes with gas bubbles can be used as insulator In this paper, we make model after microcellular foamed polymer matrix to know the change of thermal properties. Most of all, the purpose of this paper is the mlcrocellular foamed polymer matrix's availability as a insulator Beside of thermal properties the surface of microcellular foamed polymer is polished and easy to be colored. Above all the mechanical properties are better than the other insulator. So, microcellular foamed polymer can be used as exterior of building or it can be replaced as a tile.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.168-168
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• 2000

In this paper, a boiler control system for thermal power plant is configured. The boiler control system for thermal power plant is largely composed of an ABC(Automatic Boiler Control) system and a MBC(Mill Burner Control) system. ABC system controls analog process values, so almost all analog control logic is dealt with in ABC system. On the other hand, MBC system relates to sequence control logic such as MFT logic, Furnace Purge, Safety related logic. Advanced control systems made from advanced countries deal with an ABC system and MBC system in a distributed control system. In this paper, we adopt a DCS as an ABC system and adopt a PLC system as a MBC system to configure a boiler control system for thermal power plant using domestic control system. Finally the validity of the configured boiler control system is shown via simulation using digital simulator for boiler system in thermal power plant.

• 대한의용생체공학회:의공학회지
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• 제17권1호
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• pp.129-138
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• 1996

This paper describes design techniques of general purpose thermal array printer, especially easily applicable to medical measurement equipment. The'general'means that the proposed thermal array printer can be applied to not only medical field but other industrial field by establishing the eligible protocol. The thermal array printer is composed of i)MPU and its peripherals ii)printer head control, iii)diverse protection circuits, and iv)serial communication. In this paper the performance of the proposed thermal array printer was evaluated by applying to an 3 channel electrocardiogram recorder. The propped system can support'Hangul'text as well as alphanumeric characters and any bitmap image.

• Nuclear Engineering and Technology
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• 제53권3호
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• pp.1041-1048
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• 2021

An engineered barrier system (EBS) for the disposal of high-level radioactive waste (HLW) is composed of a disposal canister with spent fuel, a buffer material, a gap-filling material, and a backfill material. As the buffer is located in the empty space between the disposal canisters and the surrounding rock mass, it prevents the inflow of groundwater and retards the spill of radionuclides from the disposal canister. Due to the fact that the buffer gradually becomes saturated over a long time period, it is especially important to investigate its thermal-hydro-mechanical-chemical (THMC) properties considering variations of saturated condition. Therefore, this paper suggests a new method of measuring thermal conductivity and water suction for single compacted bentonite at various levels of saturation. This paper also highlights a convenient method of saturating compacted bentonite. The proposed method was verified with a previous method by comparing thermal conductivity and water suction with respect to water content. The relative error between the thermal conductivity and water suction values obtained through the proposed method and the previous method was determined as within 5% for compacted bentonite with a given water content.