• Nuclear Engineering and Technology
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• 제56권1호
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• pp.1-8
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• 2024

In this study, the influence of thermal aging on structural integrity is investigated for Gr. 91 steel. A commercial grade Gr. 91 steel is used for the virgin material, and service-exposed Gr. 91 steel is sampled from a steam pipe of a super critical plant. Time versus creep strain curves are obtained through creep tests with various stress levels at 600 ℃ for the virgin and service-exposed Gr. 91 steels, respectively. Based on the creep test results, the improved Omega model is characterized for describing the total creep strain curve for both Gr. 91 steels. The proposed parameters for creep deformation model are used for predicting the steady-state creep strain rate, creep rupture curve, and stress relaxation. Creep-fatigue damage is evaluated for the intermediate heat exchanger (IHX) in a large-scale sodium test facility of STELLA-2 by using creep deformation model with proposed creep parameters and creep rupture curve for both Gr. 91 steels. Based on the comparison results of creep fatigue damage for the virgin and service-exposed Gr. 91 steels, the thermal aging effect has been shown to be significant.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• Journal of Advanced Marine Engineering and Technology
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• 제37권7호
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• pp.694-700
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• 2013

The design of the exhaust manifold for the pulse converters of a 4 strokes high power medium-speed diesel engine is presented in terms of fatigue analysis. The said system undergoes thermal expansion due to high temperature of exhaust gas and is exposed to intrinsic vibration of the internal combustion engine. Moreover, the exhaust pulse generates pressure pulsating along the runner inside manifold. Under such circumstances, the design and construction of exhaust manifold must be carried out in a way to prevent early failure due to fracture. To validate the design concept, a test rig was developed to simulate the combination of thermal and vibrational movements, simultaneously. Experimental results showed that a certain sense of reliability can be achieved by considering a field factor obtained from the results of engine bench tests.

• 전자공학회논문지A
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• 제31A권12호
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• pp.44-55
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• 1994

This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 대한기계학회논문집A
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• 제24권9호
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• pp.2183-2190
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• 2000

A thermal aging is observed in a primary reactor cooling system(RCS) made of a casting stainless steel when the RCS is exposed for long period at the reactor operating temperature, 290~3300C An investigation of effects of thermal aging on a low cycle fatigue characteristics included a stress variations caused by a reactor operation and trip, is required. The purpose of the present investigation is to find an effect of a thermal aging of the CF8M on a low cycle fatigue life. The specimen of CF8M are prepared by an artificially accelerated aging technique holding 300 and 1800hr at 4300C respectively. The low cycle fatigue tests for the virgin and two aged specimens are performed at the room temperature for various strain amplitudes($\varepsilon$ta), 0.3, 0.5, 0.8, 1.0, 1.2 and 1.5% strain. Through the experiment, it is found that the fatigue life is rapidly reduced with an creasing of the aging time. The experimental fatigue life estimation formulas between the virgin and two aged specimen are obtained and are proposed to a analysis purpose.

• 대한기계학회논문집A
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• 제21권1호
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• pp.173-179
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• 1997

The high temperature fatigue tests were performed using the specimens taken from Cr-Mo-V steel, widely used as thermal power plant turbine materials for examination fatigue behavior of materials in power plants which have been operated for long periods. The fatigue tests at high temperature were performed at the various temperature and applied stress. The results obtained are summarized as follows : The fatigue crack length increases and the fatigue life decreases with temperature and applied stress according to the same number of stress cycle. The fatigue crack propagation and the fatigue life were much influenced by temperature and applied stress.

• International Journal of Automotive Technology
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• 제1권2호
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• pp.71-77
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• 2000

High temperature materials in service are subjected to mechanical damage due to operating load and metallurgical damage due to operating temperature. Therefore, when designing or assessing life of high temperature components, both factors must be considered. In this paper, the effect of tensile hold time on high temperature fatigue crack growth and long term prior thermal aging heat treatment on creep rupture behavior were investigated using STS 316L and STS 316 austenitic stainless steels, which are widely used for high temperature components like in automotive exhaust and piping systems. In high temperature fatigue crack growth tests using STS 316L, as tensile hold time increased, crack growth rate decreased in relatively short tensile hold time region. In long term aged specimens, cavity type microcracks have been observed at the interface of grain boundary and coarsened carbide.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.137-143
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• 2008

Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper describes the life prediction models for SnAgCu and SnPb solder joints, based upon non-linear finite element analysis (FEA). In case of analyses of the SnAgCu solder joints, two kinds of shapes are used. As a result, it is found that the SnAgCu solder has longer fatigue life than the SnPb solder in temperature cycling analyses.

• Journal of Welding and Joining
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• 제31권2호
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• pp.43-48
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• 2013

This paper Investigated the characteristics of residual stress in weld is composed of typical specimens, are investigated by using three dimensional thermal elasto-plastic FEM analysis. Numerically calculated residual stresses in the gas welds were then compared with experimental results obtained by the hole-drilling method. Using the stress amplitude (${\sigma}a$)R at the hot spot point of gas weld, the relations obtained as the fatigue test results for typical specimens having various dimensions and shapes were systematically rearranged to obtain the (${\sigma}a$)R-Nf relationship. It was found that more systematic and accurate evaluation of the fatigue strength of plug- and ring-type gas-welded joints can be achieved by using (${\sigma}a$)R.