• ETRI Journal
• /
• v.42 no.1
• /
• pp.118-128
• /
• 2020

A semitransparent photovoltaic-thermal (PV/T) air collector can produce electricity and heat simultaneously. To maximize the thermal and overall efficiency of the semitransparent PV/T air collector, its availability should be maximum; this can be determined through a Markov analysis. In this paper, a Markov model is developed to select an optimized number of semitransparent PV modules in service with five states and two states by considering two parameters, namely failure rate (λ) and repair rate (μ). Three artificial neural network (ANN) models are developed to obtain the minimum cost, minimum temperature, and maximum thermal efficiency of the semitransparent PV/T air collector by setting its type appropriately and optimizing the number of photovoltaic modules and cost. An attempt is also made to achieve maximum thermal and overall efficiency for the semitransparent PV/T air collector by using ANN after obtaining its minimum temperature and available solar radiation.

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.562-566
• /
• 2004

Thermal shock is a physical phenomenon that occurs in the condition of the exposure of a rapidly large temperature and pressure change of in the quenching condition of material. The rocket nozzle is exposed to high temperature combustion gas, it may have failure and erosion deformation. So, it is important to select a suitable material having excellent thermal shock properties and evaluate these materials in rocket design. In this study, the temperature gradient and crack initiation of rocket nozzle material is investigated using by FEM under thermal shock condition. This is very important information in the design process of thermal structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1993.11a
• /
• pp.49-54
• /
• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.844-845
• /
• 2006

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.

• Structural Engineering and Mechanics
• /
• v.58 no.4
• /
• pp.627-639
• /
• 2016

The analysis of thermally induced stresses in engineering structures is a very important and necessary task with respect to design and modeling of pressurized containers, heat exchangers, aircrafts segments, etc. to prevent them from failure and improve working conditions. So, the purpose of this study is to investigate elasto-plastic thermal stresses and deformations in a thin annular plate embedded into rigid container. To this end, analytical research devoted to mathematically and physically rigorous stress/strain analysis is performed. In order to evaluate the effect of logarithmic thermal gradients, commonly applied to structures which incorporate thin plate geometries, different thermal parameters such as temperature mismatch and varying constraint temperature were introduced into the model of elastic perfectly-plastic annular plate obeying the von Mises yield criterion with its associated flow rule. The results obtained may be used in sensitive to temperature differences aircraft structures where the thermal effects on equipment must be kept in mind.

• Nuclear Engineering and Technology
• /
• v.54 no.10
• /
• pp.3732-3744
• /
• 2022

To investigate the effects of ocean conditions on the thermal stress and deformation caused by thermal stratification of a pressurizer surge line in a floating nuclear power plant (FNPP), the finite element simulation platform ANSYS Workbench is utilized to conduct the fluid-solid-thermal coupling transient analysis of the surge line under normal "wave-out" condition (no motion) and under ocean conditions (rolling and pitching), generating the transient response characteristics of temperature distribution, thermal stress and thermal deformation inside the surge line. By comparing the calculated results for the three motion conditions, it is found that ocean conditions can significantly improve the thermal stratification phenomenon within the surge line, but may also result in periodic oscillations in the temperature, thermal stress, and thermal deformation of the surge line. Parts of the surge line that are more susceptible to thermal fatigue damage or failure are determined. According to calculation results, the improvements are recommended for pipeline structure to reduce the effects of thermal oscillation caused by ocean conditions. The analysis method used in this study is beneficial for designing and optimizing the pipeline structure of a floating nuclear power plant, as well as for increasing its safety.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.19 no.7
• /
• pp.252-257
• /
• 2018

In this paper, we propose a mean time to failure (MTTF) to improve the solution for a cryogenic cooler, which is an important part of a cooled thermal device. Common electronic devices have a high possibility of failure due to various environmental factors, such as temperature and humidity. But some special devices (such as thermal devices) are designed to overcome environmental factors. The most affected part of a cooled thermal device's MTTF is the cryogenic cooler. The MTTF of a cryogenic cooler is affected by the device's internal heat. Therefore, if the device's internal heat is reduced, the cryogenic cooler's MTTF increases. From the present device's internal heat simulation, we analyze the improvement method of the device. The proposed improvement method's effectiveness is verified by simulation and MTTF calculation.

• Korean Journal of Materials Research
• /
• v.17 no.3
• /
• pp.152-159
• /
• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.21 no.1
• /
• pp.717-724
• /
• 2020

In general, the factors affecting the heat transfer of asphalt pavement are divided into weather factors and pavement materials. Among them, material factors include the thermophysical and surface properties. An experiment was conducted on the thermal-physical factors of asphalt, which are the basis for the pavement failure model. The thermal conductivity, specific heat capacity, thermal diffusivity, and thermal emissivity were evaluated as the thermo-physical properties of asphalt. The specimens (WC-2 & PA-13) used in the experiment were compacted with a Gyratory Compactor. The experimental results of WC-2 and PA-13 showed a thermal conductivity of 1.18W/m·K and 0.9W/m·K, specific heat capacity of 970.8J/kg·K and 960.1J/kg·K, thermal emissivity of 0.9 and 0.91, and thermal diffusivity of 5.15㎡/s and 4.66㎡/s, respectively. Experiments on the heat transfer characteristics (thermo-physical properties) of asphalt pavement that can be used for thermal failure modeling of asphalt were conducted.

• Journal of Mechanical Science and Technology
• /
• v.19 no.5
• /
• pp.1206-1215
• /
• 2005

The thermal stratification phenomena, frequently occurring in the component of nuclear power plant system such as pressurizer surge line, steam generator inlet nozzle, safety injection system (SIS), and chemical and volume control system (CVCS), can cause through-wall cracks, thermal fatigue, unexpected piping displacement and dislocation, and pipe support damage. The phenomenon is one of the unaccounted load in the design stage. However, the load have been found to be serious as nuclear power plant operation experience accumulates. In particular, the thermal stratification by the turbulent penetration or valve leak in the SIS and SCS pipe line can lead these safety systems to failure by the thermal fatigue. Therefore in this study an 1/10 scaledowned experimental rig had been designed and installed. And a series of experimental works had been executed to measure the temperature distribution (thermal stratification) in these systems by the turbulent penetration, valve leak, and heat transfer through valve. The results provide very valuable informations such as turbulent penetration depth, the possibility of thermal stratification by the heat transfer through valve, etc. Also the results are expected to be useful to understand the thermal stratification in these systems, establish the thermal strati­fication criteria and validate the calculation results by CFD Codes such as Fluent, Phenix, CFX.