• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.221-226
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• 2004

The thermal stresses induced by difference in Coefficient of Thermal Expansion between FR-4 board and 63Sn-37Pb solder joint directly affect the reliability of 63Sn-37Pb solder joint. This research, thus, focuses to investigate the crack initiation and propagation behavior around solder joint by imposing a designed Acceleration Life Test Procedure on solder joint by using a newly manufactured Thermal Impact Experimental Apparatus. The fracture mechanism of the solder joint was found to be highly influenced by thermal stresses. The reliability of solder joint was evaluated by using a failure probability model in terms of varying parameters such as frequency and temperature. The relationship between failure probability and safety factor was also studied.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1157-1164
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• 2007

Ceramic honeycomb structures have performed successfully as catalyst supports for meeting hydrocarbon, carbon monoxide and nitrous emissions standards for gasoline-powered vehicles. Three-way catalyst converter has to withstand high temperature and thermal stress due to pressure fluctuations and vibrations. Thermal stress constitutes a major portion of the total stress which the ceramic catalyst support experiences in service. In this study, temperature distribution was measured at ceramic catalyst supports. Thermal durability was evaluated by power series dynamic fatigue damage model. Radial temperature gradient was higher than axial temperature gradient. Thermal stresses depended on direction of elastic modulus. Axial stresses are higher than tangential stresses. Tangential and axial stresses remained below thermal fatigue threshold in all engine operation ranges.

• Composites Research
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• v.33 no.4
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• pp.220-227
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• 2020

When curing the composite, the fibers have little thermal deformation, but the resin changes its properties with time and temperature, which leads to residual stress in the product. Residual stress is caused by the difference in the coefficient of thermal expansion of the fibers and resin during the curing process and the chemical shrinkage of the resin. This difference causes thermal deformation such as spring-in and warpage. Thermal deformation of composite structure is important issue on quality of product, and it should be considered in manufacturing process. In this study, a subroutine was developed to predict thermal deformation by applying 3-D viscoelastic model. The finite element analysis was verified by comparing the results of the plate analysis of the 2-D viscoelastic model. Spring-in of L-shaped structure was predicted and analyzed by applying the 3-D viscoelastic model.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.67-73
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• 2020

In this paper, we used FEM technique to perform warpage and von Mises stress analysis on PCB according to the cavity structures of embedded PCB for FCCSP and the types of prepreg material. One-half substrate model and static analysis are applied to the FEM. According to the analysis results of the warpage, as the gap between the cavity and the chip increased, warpage increased and warpage increased when prepreg material with higher modularity and thermal expansion coefficient was applied. The analysis results of the von Mises stress show that the effect of the gap between the cavity and the chip varies depending on prepreg material. In other words, when material whose coefficient of thermal expansion is significantly higher than that of core material, the stress increased as the gap between the cavity and the chip increased. When the prepreg with the coefficient of thermal expansion lower than the core material is applied, the result of stress is opposite. These results indicate that from a reliability perspective, there is a correlation between the structure of the cavity where embedded chips are loaded and prepreg material.

• International Journal of Air-Conditioning and Refrigeration
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• v.10 no.4
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• pp.220-228
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• 2002

The cool-down performance after soaking is very important in an automotive air-conditioning system and is considered as a key design variable. Therefore, transient characteristics of each system component are essential to the preliminary design as well as steady-state performance. The objective of this study is to develop a computer simulation model and ostinato theoretically the transient performance of an automotive air-conditioning system. To do that, the mathematical modelling of each component, such as compressor, condenser, receiver/drier, expansion valve, and evaporator, is presented first of all. The basic balance equations about mass and energy are used in modelling. For detailed calculation, condenser and evaporator are divided into many sub-sections. Each sub-section is an elemental volume for modelling. In models of expansion valve and compressor, dynamic behaviors are not considered in this analysis, but the quasisteady state ones are just considered, such as the relation between mass flow rate and pressure drop in expansion device, polytropic process in compressor, etc. Also it is assumed that there are no heat loss and no pressure drop in discharge, liquid, and suction lines. The developed simulation model is validated by comparing with the laboratory test data of an automotive air-conditioning system. The overall time-tracing properties of each component agreed well with those of test data in this case.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.11
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• pp.1089-1096
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• 2001

The cool-down performance after soaking is very important in an automotive air-conditioning system and is considered as the key design variable. Therefore, understanding of the overall transient characteristics of the system is essential to the preliminary design as well as steady-state characteristics. The objective of this study is to develop a computer simulation model and estimate theoretical1y the transient performance of an automotive air-conditioning system. To accomplish this, a mathematical modelling of each component, such as compressor, condenser, expansion valve, and evaporator, is presented first of all. For a detailed calculation, condenser and evaporator are divided into many subsections. Each sub-section is an elemental volume for modelling. In models of expansion valve and compressor, dynamic behaviors are not considered in an attempt to simplify the ana1ysis, but the quasi-static ones are just considered, such as the relation between mass flow rate and pressure drop in expansion device, polytropic process in compressor, etc. The developed simulation model is validated with a comparison to laboratory test data of an automotive air-conditioning system. The overall time-tracing properties of each component agreed fairly well wish those of test data in this case.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.124-138
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• 1998

Particles reinforced MMCs have many advantages over monolithic metals including a higher specific modulus, higher specific strength, better properties at elevated temperatures and better wear resistance. SiC$_p$/A16061 composites have good results in its mechanical properties. This work investigates SiC$_p$/A16061 composites in the microscopic view and compares the analytical results with the experimental ones. The discrepancy of the material properties between the reinforced particle, SiC$_p$, and the matrix material, A16061 appears to be so significant. Especially the coefficient of thermal expansion(CTE) of A16061 is 5 times larger than that of SiC$_p$. Thermal residual stress in MMCs is induced at high temperatures. The shape of particle is various but the theoretical model is not able to consider the nonuniform shape. Particle distribution is not homogeneous in experimental specimen. However, it is assumed to be homogeneous in simulation model. The shapes of particles are assumed to be not only perfect global but hexahedral shapes. The types of particle distribution are two - simple cubic array(SC array) and face-centered cubic array(FCC array).

• Transactions of Materials Processing
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• v.33 no.3
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• pp.200-207
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• 2024

In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.1
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• pp.37-52
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• 1990

In this study, the characteristics of cooling and rolling during strip casting process is obtained in comparison with the experimental and analytical results. The prupose of this study is to effectively analyze the thermal and mechanical deformation of roller applying the results of the heat transfer and the pressure distribution to boundary conditions. And then the relation between strip thickness and roll deformation is shown. The second purpose is to obtain the proper condition of the continuous casting for stainless steel. The summary and conclusions can be made on the basis of the results obtained by the theories and experiments. a) The strip casting condition for the fine surface quality of tin-alloy as-cast material was obtained in accordance with the velocity of roll rotation and initial roll gap. b) The experimental condition that the dimension of the cast strip thickness coincide with that of the initial roll gap was according to the experimental result of continuous casting by twin-roll type. c) The thermoelastic finite element model to calculate the roll deformation is represented. Thermoelastic model prediction for the roll deformation are in good agreement with the experimental results considering the thermal expansion of the roll. d) The higher cooling rates were obtained by a twin-roller quenching technique. Also quenched microstructure of the rapidly solidified shell was verified. e) The magnitude of roll deformation due to the thermal expansion and roll separating force is quantit- atively represented in the analysis of continuous casting for stainless steel.