• Proceedings of the Korea Society for Industrial Systems Conference
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• 1997.11a
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• pp.451-462
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• 1997

A 2-dimensional numerical analysis is presented for thermal-electron heat conduction effects upon the electron transport and the drain current-voltage characteristics of submicron GaAs MESFETs, based on the use of a nonstationary hydrodynamic transport model. It is shown that for submicron GaAs MESFETs, electron heat conduction effects are significant on their internal electronic properties and also drain current-voltage characteristics. Due to electron heat conduction effects, the electron energy is greatly one-djmensionalized over the entire device region. Also, the drain current decreases continuously with increasing thermal conductivity in the saturation region of large drain voltages above 1 V. However, the opposite trend is observed in the linear region of small drain voltages below 1 V. Accordingly, for a large thermal conductivity, negative differential resistance drain current characteristics are observed with a pronounced peak of current at the drain voltage of 1 V. On the contrary, for zero thermal conductivity, a Gunn oscillation characteristic is observed at drain voltages above 2 V under a zero gate bias condition.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.3
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• pp.354-363
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• 1997

The purpose of the present work is to show the best thermal storage material and the sensitivity of the parameters on the thermal performance by experimentally investigating the effects of the parameters on the thermal performance of the spherical capsule system using paraffins superior to the commercial one. The paraffins were n-Tetradecane and the mixture of n-Tetradecane 40% and n-Hexadecane 60%. The experimental parameters were the Reynolds number of 8, 12, and 16 and the inlet temperature of-7, -4, -1, and $2^{\circ}C$. The charging and the discharing time, the dimensionless thermal storage amount, and the averge heat transfer coefficient in the tank were obtained by utilizing the local temperature variation in the tank. The local charging and discharging time in the tank was axially and radially different a lot. The effects of the inlet temperature on the charging and the discharging time were larger during the charging process than during the discharging process, but the effects of the Reynolds number on the charging and the discharging time were in reverse order. The paraffins were better by 11~72% than the water with the inorganic material in the charging time aspect, but no difference in the discharging time aspect. The effects of the Reynolds number on the dimensionless thermal storage amount were smaller than the effects of the inlet temperature during the charging process, but in reverse order during the discharging process within the working range of the experimental parameters. The effects of the inlet temperature and the Reynolds number on the average heat transfer coefficient were larger during the discharging process than during the charging process. The average heat transfer coefficient for the paraffins was larger by 40% maximum than that for the commercial material during the charing and the discharging process.

• Tribology and Lubricants
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• v.17 no.2
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• pp.130-137
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• 2001

In this paper, the thermal effects on the performance of floating ring journal bearing are investigated theoretically. The numerical analyses include pressure drop at inner film due to a centrifugal force, fluid momentum effects of supply oil into inner film and thermal effects in lubricating films. All performance data are presented as the rotating speed of journal from 10,000 rpm to 70,000 rpm.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.223-225
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• 2004

Based on the principle of complementary energy an analytical method is developed for determining thermal stress distribution in an thermal barrier coating. This method gives the stress distributions which satisfy the stress-free boundary conditions at the edge. Numerical examples are given in order to verify the method and to investigate the thickness effects of the ZrO$_2$-8wt%Y$_2$O$_3$ top coat on the integrity of thermal barrier coating consisted of IN738LC substrate and MCrAlY bond coat.

• Journal of the Korean Home Economics Association
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• v.37 no.11
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• pp.157-165
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• 1999

This study was carried out to examine the effect of clothing materials and multi-layered textiles on thermal resistance value. Cotton, polyester, wool, silk, rayon and acetate were selected for the specimens. Thermal resistance value was tested with 2 kinds of methods(thermo labo II and BK type tester). The results were as follows; 1. The effects of clothing materials for thermal resistance value were decreased by adding layers. 2. When the fabrics are measured with multiple layers, the fabric of the lowest thermal resistance value at single layer was showed the highest increasing tendency for all test methods.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.389-392
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• 1997

Glutaronitrile(GN) was introduced to diglycidyl ether of bisphenol A(DGEBA)/ 4,4'-methylene dianiline(MDA) system to improve toughness. Effects of GN contents on thermal decomposition of epoxy resin system were investigated. To study the characteristics of thermal decomposition, thermo-gravimetric analysis(TGA) and Kissinger equation were used. Thermal degradation temperatures were about 365$^{\circ}C$ regardless of GN contents. Activation energies of thermal decomposition in epoxy resin system were almost constant below 10 phr and decreased above 15 phr.

• Earthquakes and Structures
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• v.16 no.1
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• pp.11-28
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• 2019

This article investigates the response of Integral Abutment Bridges (IAB) when subjected to a sequence of seasonal thermal loading of the deck followed by ground seismic shaking in the longitudinal direction. Particular emphasis is placed on the effect of pre-seismic thermal Soil-Structure Interaction (SSI) on the seismic performance of the IAB, as well as on the ability of various backfills configurations, to minimize the unfavorable SSI effects. A series of two-dimensional numerical analyses were performed for this purpose, on a complete backfill-integral bridge-foundation soil system, subjected to seasonal cyclic thermal loading of the deck, followed by ground seismic shaking, employing ABAQUS. Various backfill configurations were investigated, including conventional dense cohesionless backfills, mechanically stabilized backfills and backfills isolated by means of compressive inclusions. The responses of the investigated configurations, in terms of backfill deformations and earth pressures, and bridge resultants and displacements, were compared with each other, as well as with relevant predictions from analyses, where the pre-seismic thermal SSI effects were neglected. The effects of pre-seismic thermal SSI on the seismic response of the coupled IAB-soil system were more evident in cases of conventional backfills, while they were almost negligible in case of IAB with mechanically stabilized backfills and isolated abutments. Along these lines, reasonable assumptions should be made in the seismic analysis of IAB with conventional sand backfills, to account for pre-seismic thermal SSI effects. On the contrary, the analysis of the SSI effects, caused by thermal and seismic loading, can be disaggregated in cases of IAB with isolated backfills.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.88-92
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• 2020

Thermal effects in bulk and SOI FinFETs are briefly reviewed herein. Different techniques to measure these thermal effects are studied in detail. Self-heating effects show a strong dependency on geometrical parameters of the device, thereby affecting the reliability and performance of FinFETs. Mobility degradation leads to 7% higher current in bulk FinFETs than in SOI FinFETs. The lower thermal conductivity of SiO₂ and higher current densities due to a reduction in device dimensions are the potential reasons behind this degradation. A comparison of both bulk and SOI FinFETs shows that the thermal effects are more dominant in bulk FinFETs as they dissipate more heat because of their lower lattice temperature. However, these thermal effects can be minimized by integrating 2D materials along with high thermal conductive dielectrics into the FinFET device structure.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.4
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• pp.697-705
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• 1997

The purpose of this study was to evaluate the effects of two metal adhesive primers on the shear bond strengths of self-curing resin to Ni-Cr a]toy and the effects of 1000 thermal cycling on the durability of the bond. The two selected metal adhesive primers were Metal Primer II(G-C corp., Japan) and MR Bond(Tokuyama corp., Japan) and no treatment groups were used as control. All specimens were divided into two groups according to thermal cycling. In the group without thermal cycling, the specimens were stored in water for 24 hours. In the group with thermal cycling, the specimens were thermocycled 1000 times at temperature of $5^{\circ}C\;and\;55^{\circ}C$. Shear bond strengths were measured using the Universal testing machine(Zwick 145641, Germany) with a crosshead speed of 0.5 mm/min. The results were as follows: 1. MR Bond significantly improved the shear bond strength of resin to Ni-Cr alloy before and after thermal cycling. 2. There were no difference in the shear bond strength of resin to Ni-Cr alloy between Metal Primer II treated group and no treatment group. 3. Regardless of the type and the use of adhesive primers, there were tendency of decrease in shear bond strength with 1000 thermal cycling.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.