• Title/Summary/Keyword: Thermal Density

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Spatiotemporal Distribution of Macrobenthic Communities in the Coastal Area of Uljin and Its Relation to Environmental Variables (울진 주변 해역 대형저서동물 군집의 시·공간 분포와 환경요인과의 관계)

  • Yu, Ok-Hwan;Paik, Sang-Gyu;Lee, Hyung-Gon;Lee, Jae-Hac
    • Ocean and Polar Research
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    • v.33 no.4
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    • pp.421-434
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    • 2011
  • Although thermal effluent from coastal power plants affects marine ecosystems, few studies have examined the spatiotemporal distribution of macrobenthic communities in a coastal area of Korea with thermal discharge. This study analyzed the species composition and abundance of a macrobenthic community in relation to environmental variables for a period of 1 year. In total 334 macrobenthic faunal species were collected; the mean density was 3,221 ind/$m^2$. The number of species and the density of macrobenthic fauna increased with distance from the thermal discharge site. Cluster analysis indicated that the macrobenthic community could be divided into two groups: group I in shallow (< 30 m deep) and group II in the outer areas (> 30 m deep). Group I showed the lowest species density and diversity. Four polychaetes, including Magelona japonica, Spiophanes bombyx, Scolotoma longifolia and Chaetozone setosa, all of which have been dominant species since 1987, exhibited higher mean densities in the area distant from the thermal discharge (the outer and north areas). Conversely, the warm-adapted and opportunistic species, such as the amphipods Urothoe convexa and Mandibulophoxus mai, the bivalve Felaniella sowerbyi, and the polychaete Rhynchospio sp., were more abundant in the thermal discharge region. The results of this study indicate that thermal effluent influences macrobenthic communities in the shallow area, while other environmental variables, such as depth, sediment grain size, and TOC, are more important determinants of the macrobenthic communities in deeper regions (> 30 m deep).

Effect of Thermal Aging on Electrical Properties of Low Density Polyethylene

  • Wang, Can;Xie, Yaoheng;Pan, Hua;Wang, Youyuan
    • Journal of Electrical Engineering and Technology
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    • v.13 no.6
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    • pp.2412-2420
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    • 2018
  • The thermal degradation of low density polyethylene (LDPE) will accelerate the production of carbonyl groups (C=O), which can act as the induced dipoles under high voltage. In this paper, we researched the dielectric properties and space charge behavior of LDPE after thermal aging, which can help us to understand the correlation between carbonyl groups (C=O) and electrical properties of LDPE. The spectra results show that LDPE exhibit obvious thermooxidative reactions when the aging time is 35 days and the productions mainly contain carboxylic acid, carboxylic eater and carboxylic anhydride, whose amount increase with the increasing of aging time. The dielectric properties show that the real permittivity of LDPE is inversely proportional to temperature before aging and subsequently become proportional to temperature after thermal aging. Furthermore, both the real and imaginary permittivity increase sharply with the increasing of aging time. The fitting results of imaginary permittivity show that DC conductivity become more sensitive about temperature after thermal aging. On this basis, the active energies of materials calculated from DC conductivity increase first and then decrease with the increasing of aging time. In addition, the space charge results show that the heterocharges accumulated near electrodes in LDPE change to the homocharges after thermal aging and the mean volume charge density increase with the increasing of aging time. It is considered that the overlaps caused by electrical potential area is the main reason for the increase of DC conductivity.

P-type transport characteristics of copper-oxide thin films deposited by vacuum thermal evaporation (진공열증착으로 성막된 산화구리 박막의 p-형 전도특성)

  • Lee, Ho-Nyeon;Song, Byeong-Jun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.5
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    • pp.2267-2271
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    • 2011
  • This study was focused on getting p-type copper-oxide thin-film semiconductors suitable for p-channel thin-film transistors. Vacuum thermal evaporation and thermal annealing were used to get copper-oxide thin-film semiconductor having properties adoptable as an active layer of thin-film transistors. n-type thin films having electron carrier density of about $10^{22}\;cm^{-3}$ before thermal annealing was converted to p-type thin films having hole carrier density of about $10^{16}\;cm^{-3}$ as the thermal annealing conditions were optimized.

Error Rate Performance of FH/MFSK Signal with Thermal Noise in the Partial Band Jamming Environments (부분대역 재밍 환경하에서 열잡음을 고려한 FH/MFSK 신호의 오솔특성)

  • 강찬석;안중수
    • The Journal of the Acoustical Society of Korea
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    • v.12 no.1
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    • pp.47-54
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    • 1993
  • Performance analysis is very important to transmit the high quality information and to construct the optimal system for the minimze the noise from the channel of spread spectrum system. In this paper the error rate performance is analyzed with computer simulation in noncoherent frequency hopping M-qry frequency shift keying(FH/MFSk) systems with regard to thermal noise under the partial band jamming environments. AS a result, in case the thermal noise is disregarded, bit error probability of system in jamming fraction ρ and Eb/Nj(bit energy to jamming power density) is reduced with the increase of K and in worst case 32FSK system is better than 2FSK system by 3.23dB with the variatio of Eb/Nj. In case thermal noise is considered, bit error probability of system by 3.23dB with the variation of Eb/Nj. In case thermal noise is considered, bit error probability of system are reduced with the increase of K and Eb/No(bit energy to thermal noise density). Bit error probability in connection with worst case ρ is not largely influenced form over the 14dB to K=1 and 8dB to K=5 accordingly thermal noise disregarding. These results may be useful for avoiding the common vulnerabilities when the spread spectrum system is designed.

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Physical Properties of Microencapsulated Phase Change Material Slurries (미립잠열슬러리의 물성에 관한 실험적 연구)

  • 이효진;홍재창;이재구
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.12 no.9
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    • pp.860-869
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    • 2000
  • The thermal conductivity and density of slurries entrained with the particles of Micro-PCM are measured with respect to its temperatures as well as concentrations. For the thermal conductivity of slurries, a device made from P.A. Hilton (Model No. H470) is adopted. There is a well-scaled 0.3 mm gap between shells into which the slurry is injected. The temperatures of the slurry are changed to $5~25^{\circ}C$ , for which it is controled by the supplied voltage and cooling water circulated around the outer shell. The concentrations of Micro-PCM slurries are varied from 5 wt% to 50 wt%. Some general equations such as Maxwell's equation, are evaluated for their applicability with Micro-PCM slurry. As a result, it happens to be some 20% discrepancy between the experiment and the applied equations. The density measurements of Micro-PCM slurry to its temperature and concentration are peformed by hydrometer. For the experiment, tetradecane encapsulated slurry (($t_m≒6^{\circ}C$) and a mixed wax ($t_m≒50^{\circ}C$) are tested. The temperature changes of tetradecane are applied for $0^{\circ}C\;to\;$20^{\circ}C$and a mixed wax for $20^{\circ}C\;to\;$60^{\circ}C$ and its concentrations are changed from 5 wt% to 30 wt%. The results are compared with a general equation and the referenced data. For the conclusion, the experimental result and a general equation are well agreed.

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Chlorine Effect on Thermal Aging Behaviors of BR and CR Composites

  • Choi, Sung-Seen;Kim, Jong-Chul
    • Bulletin of the Korean Chemical Society
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    • v.31 no.9
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    • pp.2613-2617
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    • 2010
  • Chloroprene is a chlorine substituent of 1,3-butadiene. Butadiene rubber (BR) and chloroprene rubber (CR) composites were thermally aged at 60, 70, 80, and $90^{\circ}C$ for 2 - 185 days in a convection oven and changes of the crosslink densities by the accelerated thermal aging were investigated. The crosslink densities increased as the aging time elapsed and as the aging temperature became higher. Degrees of the crosslink density changes of the BR composite were on the whole larger than those of the CR one except the short-term thermal aging at 60 and $70^{\circ}C$. The crosslink densities abnormally increased after themal aging at high temperatures for a long time. Activation energies for the crosslink density changes of the rubber composites tended to increase with increase of the aging time and the variation showed a local minimum. The activation energies of the CR composite were lower than those of the BR one. The experimental results were explained with a role of ligand of chlorine atom of CR in a zinc complex, steric hindrance by chlorine atom of CR, and oxidation of rubber chain.

THE CONTRIBUTION TO THE EXTRAGALACTIC γ-RAY BACKGROUND BY HADRONIC INTERACTIONS OF COSMIC RAYS PRODUCING EUV EMISSION IN CLUSTERS OF GALAXIES

  • KUO PING-HUNG;BOWYER STUART;HWANG CHORNG- YUAN
    • Journal of The Korean Astronomical Society
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    • v.37 no.5
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    • pp.597-600
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    • 2004
  • A substantial number of processes have been suggested as possible contributors to the extragalactic $\gamma$-ray background (EGRB). Yet another contribution to this background will be emission produced in hadronic interactions of cosmic-ray protons with the cluster thermal gas; this class of cosmic rays (CRs) has been shown to be responsible for the EUV emission in the Coma Cluster of galaxies. In this paper we assume the CRs in the Coma Cluster is prototypic of all clusters and derive the contribution to the EGRB from all clusters over time. We examine two different possibilities for the scaling of the CR flux with cluster size: the number density of the CRs scale with the number density of the thermal plasma, and alternatively, the energy density of the CRs scale with the energy density of the plasma. We find that in all scenarios the EGRB produced by this process is sufficiently low that it will not be observable in comparison with other mechanisms that are likely to produce an EGRB.

Fabrication and characterization of Copper/Silicon Nitride composites

  • Ahmed, Mahmoud A.;Daoush, Walid M.;El-Nikhaily, Ahmed E.
    • Advances in materials Research
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    • v.5 no.3
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    • pp.131-140
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    • 2016
  • Copper/silicon nitride ($Cu/Si_3N_4$) composites are fabricated by powder technology process. Copper is used as metal matrix and very fine $Si_3N_4$ particles (less than 1 micron) as reinforcement material. The investigated powder were used to prepare homogenous ($Cu/Si_3N_4$) composite mixtures with different $Si_3N_4$ weight percentage (2, 4, 6, 8 and10). The produced mixtures were cold pressed and sintered at different temperatures (850, 950, 1000, $1050^{\circ}C$). The microstructure and the chemical composition of the produced $Cu/Si_3N_4$ composites were investigated by (SEM) and XRD. It was observed that the $Si_3N_4$ particles were homogeneously distributed in the Cu matrix. The density, electrical conductivity and coefficient of thermal expansion of the produced $Cu/Si_3N_4$ composites were measured. The relative green density, sintered density, electrical conductivity as well as coefficient of thermal expansion were decreased by increasing the reinforcement phase ($Si_3N_4$) content in the copper matrix. It is also founded that the sintered density and electrical conductivity of the $Cu/Si_3N_4$ composites were increased by increase the sintering temperature.

세라믹 패키지 내에서 비아에 따른 열적 거동에 관한 연구

  • 이우성;고영우;유찬세;김경철;박종철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.153-157
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    • 2002
  • Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

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THREE-DIMENSIONAL CORE DESIGN OF A SUPER FAST REACTOR WITH A HIGH POWER DENSITY

  • Cao, Liangzhi;Oka, Yoshiaki;Ishiwatari, Yuki;Ikejiri, Satoshi;Ju, Haitao
    • Nuclear Engineering and Technology
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    • v.42 no.1
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    • pp.47-54
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    • 2010
  • The SuperCritical Water-cooled Reactor (SCWR) pursues high power density to reduce its capital cost. The fast spectrum SCWR, called a super fast reactor, can be designed with a higher power density than thermal spectrum SCWR. The mechanism of increasing the average power density of the super fast reactor is studied theoretically and numerically. Some key parameters affecting the average power density, including fuel pin outer diameter, fuel pitch, power peaking factor, and the fraction of seed assemblies, are analyzed and optimized to achieve a more compact core. Based on those sensitivity analyses, a compact super fast reactor is successfully designed with an average power density of 294.8 W/$cm^3$. The core characteristics are analyzed by using three-dimensional neutronics/thermal-hydraulics coupling method. Numerical results show that all of the design criteria and goals are satisfied.