Browse > Article
http://dx.doi.org/10.12989/amr.2016.5.3.131

Fabrication and characterization of Copper/Silicon Nitride composites  

Ahmed, Mahmoud A. (Department of Production Technology, Faculty of Industrial Education, Helwan University)
Daoush, Walid M. (Department of Production Technology, Faculty of Industrial Education, Helwan University)
El-Nikhaily, Ahmed E. (Mechanical Department, Faculty of Industrial Education, Suez University)
Publication Information
Advances in materials Research / v.5, no.3, 2016 , pp. 131-140 More about this Journal
Abstract
Copper/silicon nitride ($Cu/Si_3N_4$) composites are fabricated by powder technology process. Copper is used as metal matrix and very fine $Si_3N_4$ particles (less than 1 micron) as reinforcement material. The investigated powder were used to prepare homogenous ($Cu/Si_3N_4$) composite mixtures with different $Si_3N_4$ weight percentage (2, 4, 6, 8 and10). The produced mixtures were cold pressed and sintered at different temperatures (850, 950, 1000, $1050^{\circ}C$). The microstructure and the chemical composition of the produced $Cu/Si_3N_4$ composites were investigated by (SEM) and XRD. It was observed that the $Si_3N_4$ particles were homogeneously distributed in the Cu matrix. The density, electrical conductivity and coefficient of thermal expansion of the produced $Cu/Si_3N_4$ composites were measured. The relative green density, sintered density, electrical conductivity as well as coefficient of thermal expansion were decreased by increasing the reinforcement phase ($Si_3N_4$) content in the copper matrix. It is also founded that the sintered density and electrical conductivity of the $Cu/Si_3N_4$ composites were increased by increase the sintering temperature.
Keywords
Copper; Silicon Nitrides; powder metallurgy; sintering; electrical conductivity; coefficient of thermal expansion;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Arai, S., Saito, T. and Endo, M. (2010), "Cu-MWCNT composite films fabricated by electrode-position", J. Electrochem. Soc., 157(3), 147-153.
2 Gauche, P. and Xu, W. (2000), "Modeling phase change material in electronics using. CFD-a case study", Proceedings of the International Conference on High Density Interconnect and Systems Packaging, Denver, Colorado, April.
3 Gilleo, K. and Dennis, J. (2005), "Injection molded & micro fabrication electronic packaging", Proceedings of Molding Conference, New Orleans, June.
4 Lee, W.E. and Rainforth, W.M. (1994), Ceramic Microstructures, Property Control by Processing, Chapman & Hall, New York.
5 Lekka, M., Koumoulis, D., Kouloumbi, N. and Bonora, P.L. (2009), "Mechanical and anti-corrosive properties of copper matrix micro- and nano-composite coatings", Electrochim. Acta, 54(9), 2540-2546.   DOI
6 Li, H., Wan, Y., Liang, H., Li, X., Huang, Y. and He, F. (2009), "Composite electroplating of $Cu-SiO_2$ nanoparticles on carbon fiber reinforced epoxy composites", Appl. Surf. Sci., 256(5), 1614-1616.   DOI
7 Madou, M.J. (2002), Fundamentals of Microfabrication, 2nd ed., CRC Press, Boca Raton (FL).
8 Massalski, T.B., Okamoto, H., Subramanian, P.R. and Kacprzak, L. (1995), Binary alloy phase diagrams, ASM International, 1485-1486.
9 Mangam, V., Das, K. and Das, S. (2010), "Structure and properties of electrocodeposited $Cu-CeO_2$ nanocomposite thin films", Mater. Chem. Phys., 120(2), 631-635.   DOI
10 Medeline, V., Juskenas, R. and Kurtinaitiene, M. (2004), "Copper metal matrix composite Cu-TiO electrodeposited in aqueous suspensions of the nanometric size particles of anatase and rutile", Pol. J. Chem., 78(9), 1305-1317.
11 Robin, A., Santana, J.C.P.d. and Sartori, A.F. (2011), "Co-electrodeposition and characterization of $Cu-Si_3N_4$ composite coatings", Surf. Coat. Technol., 205(19), 4596-4601.   DOI
12 Medeliene, V. and Kosenko, A. (2008), "Structural and functional properties of electrodeposited copper metal matrix composite coating with inclusions of WC", Mater. Sci., 14(1), 29-33.
13 Montes, J.M., Rodriguez, J.A. and Herrera, E.J. (2003), "Thermal and electrical conductivities of sintered powder compacts", Powder Metallurgy, 46, 251-255.   DOI
14 Ramalingam, S., Muralidharan, V.S. and Subramania, A. (2009), "Electrodeposition and characterization of $Cu-TiO_2$ nanocomposite coatings", J. Solid. State Electrochem., 13(11), 1777-1783.   DOI
15 Stankovic, V.D. and Gojo, M. (1996), "Electrodeposited composite coatings of copper with inert, semiconductive and conductive particles", Surf. Coat. Technol., 81(2), 225-232.   DOI
16 Sundberg, G. (2004), "CuSiC for IGBT thermal management", Adv. Microelectron. Nov. /Dec., 8-11.
17 Terzieva, V., Fransaer, J. and Celis, J.P. (2000), "Codeposition of hydrophilic and hydropho-bic silica with copper from acid copper sulfate baths", J. Electrochem. Soc., 147(1), 198-202.   DOI
18 Ashby, M.F. and Jones, D.R.H. (1996), Engineering Materials: An Introduction to Their Properties & Applications, 2nd ed., Butterworth-Heinemann, Oxford, UK.
19 Weissgaerber, T., Lefranc, G. and Schulz-Harder, J. (2003), Advances in Powder Metallurgy & Particulate Materials, Part 6, Metal Powder Industries Federation, Princeton, NJ.
20 Zhu, J., Liu, L., Zhao, H., Bin, S. and Wenbin, H. (2007), "Microstructure and performance of electroformed Cu/nano-SiC composite", Mater. Des., 28(6), 1958-1962.   DOI
21 Baughman, R.H., Zakhidov, A.A. and de Heer, W.A. (2002), "Carbon nanotubes-the route towards applications", Science, 297(5582), 787-792.   DOI
22 Benea, L., Mitoseriu, O., Galland, J., Wenger, F. and Ponthiaux, P. (2000), "Corrosion study of copper composite coating by impedance spectroscopy method", Mater. Corros., 51(7), 491-495.   DOI
23 Allahkaram, S.R., Golroh, S. and Mohammad, M. (2011), "Properties of $Al_2O_3$ nano-particle reinforced copper matrix composite coatings prepared by pulse and direct current electroplating", Mater. Des., 32(8), 4478-4484.   DOI