• Journal of the Korean Society of Industry Convergence
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• v.5 no.4
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• pp.373-378
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• 2002

This paper presents a method to predict tool deflection induced by the thermal distribution and the cutting force using FEM in milling operation. The thermal distribution of cutting tool was predicted using FEM after measuring the temperature of the end of tool and of the tool holder. The thermal deflection of cutting tool was predicted using FEM as well. The tool deflection induced by the cutting force was analyzed with the solid model of cutting tool. An end mill tool caused most of tool deflection comparing to tool holder. Most of thermal deflection came from Z-direction and most of tool deflection induced by the cutting force came from X and Y direction. Precision cutting will be accomplished when tool locations are generated considering the thermal deflection of cutting tool and the tool deflection induced by the cutting force in CAD/CAM.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2465-2470
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• 2007

We have analyzed the three-dimensional thermal conduction in anisotropic materials using nonsymmetric-Fourier transforms. And a complete theoretical treatment of the photothermal deflection spectroscopy has been performed for thermal conductivity measurement in anisotropic medium. Thermal conductivity tensor was determined by the deflection angle and phase angle with the relative position between the heating and probe beams. The influence of the parameters, such as modulation frequency of the heating beam, the thermal conductivity tensor, was investigated.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Earthquakes and Structures
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• v.26 no.4
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• pp.251-259
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• 2024

In this paper, the thermal post-buckling behavior of graphene platelets reinforced metal foams (GPLRMFs) plate with initial geometric imperfections on nonlinear elastic foundations are studied. First, the governing equation is derived based on the first-order shear deformation theory (FSDT) of plate. To obtain a single equation that only contains deflection, the Galerkin principle is employed to solve the governing equation. Subsequently, a comparative analysis was conducted with existing literature, thereby verifying the correctness and reliability of this paper. Finally, considering three GPLs distribution types (GPL-A, GPL-B, and GPL-C) of plates, the effects of initial geometric imperfections, foam distribution types, foam coefficients, GPLs weight fraction, temperature changes, and elastic foundation stiffness on the thermal post-buckling characteristics of the plates were investigated. The results show that the GPL-A distribution pattern exhibits the best buckling resistance. And with the foam coefficient (GPLs weight fraction, elastic foundation stiffness) increases, the deflection change of the plate under thermal load becomes smaller. On the contrary, when the initial geometric imperfection (temperature change) increases, the thermal buckling deflection increases. According to the current research situation, the results of this article can play an important role in the thermal stability analysis of GPLRMFs plates.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.25.2-25.2
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• 2005

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.123-129
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• 2000

To make high accuracy cutting of long materials and a piston for the engines it must be necessary to keep the thermal stability of spindle and tail stock in CNC lathe. If a object is clamped at the ends the thermal expansion and cutting process generate the deflection of cutting objects. Especially in the case of a piston ring piston ovality and piston profile the influences of deflection are very serious. In order to solve the problems most of piston cutting are worked under simply support. However the prob-lems exist yet. Therefore this paper proposes the new structure of tail stock which can compensates the deflection.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.9 no.2
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• pp.75-82
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• 2005

An inverse problem of transient heat conduction in a thin finite circular plate with the given temperature distribution on the interior surface of a thin circular plate being a function of both time and position has been solved with the help of integral transform technique and also determine the thermal deflection on the outer curved surface of a thin circular plate defined as $0\;{\leq}\;r\;{\leq}\;a,\;0\;{\leq}\;z\;{\leq}\;h$. The results, obtained in the series form in terms of Bessel's functions, are illustrated numerically.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.25 no.1
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• pp.1-15
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• 2021

A Green's function approach is adopted to solve the two-dimensional thermoelastic problem of a thin hollow circular disk. Initially, the disk is kept at temperature T0(r, z). For times t > 0, the inner and outer circular edges are thermally insulated and the upper and lower surfaces of the disk are subjected to convection heat transfer with convection coefficient hc and fluid temperature T∞, while the disk is also subjected to the axisymmetric heat source. As a special case, different metallic disks have been considered. The results for temperature and thermal deflection has been computed numerically and illustrated graphically.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.26 no.1
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• pp.67-75
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• 2022

Analysis of non-integer order thermoelastic temperature distribution and it's thermal deflection of thin hollow circular disk under the axi-symmetric heat supply is investigated. Initially, the disk is kept at zero temperature. For t > 0 the parametric surfaces are thermally insulated and axi-symmetric heat supply on the thickness of the disk. The governing heat conduction equation has been solved by integral transform technique, including Mittag-Leffler function. The results have been computed numerically and illustrated graphically with the help of PTC-Mathcad.

• Advances in Computational Design
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• v.7 no.2
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• pp.99-112
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• 2022

This research has been devoted to examine nonlinear static bending analysis of smart beams with nano dimension exposed to thermal environment. The beam elastic properties are corresponding to piezo-magnetic material of different compositions. The large deflection analysis of the beam has been performed assuming that the beam is exposed to transverse uniform pressure. Based on the rule of Hamilton, the governing equations have been derived for a nonlocal thin beam and solved using differential quadrature method. Temperature variation effect on nonlinear deflection of the smart beams has been studied. Also, the beam deflection is shown to be affected by electric voltage, magnetic intensity and material composition.