• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.1010-1014
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• 2002

A new type actuator has been designed and investigated to overcome thermal problems in slim optical disc drive which is adopted in mobile storage devices. Recently, in optical storage device technical trends, the size of optical disc drives is slimmer to adopt notebook computer and the spindle rotate velocity is faster to achieve high transfer rate and the power of actuator is higher to perform tilting, etc. However, these trends of optical disc drives tend to raise the environment temperature of drives, actuator power and parts temperature. Moreover, it is more difficult to remove the heat inside a drive and the temperature of an actuator increases and drive slims. As a result, increase of surface temperature of actuator body caused that second resonance of an actuator moves down to a lower frequency band and the performance of optical parts also deteriorates. Especially objective lens, coil and magnet of the actuator parts are easily damaged. To manage these thermal problems, in this paper an actuator with a hybrid blade, which is composed of vectra which has low thermal conductivity and magnesium which has high thermal conductivity, has been suggested and verified. Despite the high temperature environment, the proposed actuator showed good dynamic performance.

• Journal of Mechanical Science and Technology
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• v.19 no.10
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• pp.1932-1938
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• 2005

Graphite foams consist of a network of interconnected graphite ligaments and are beginning to be applied to thermal management of electronics. The thermal conductivity of the bulk graphite foam is similar to aluminum, but graphite foam has one-fifth the density of aluminum. This combination of high thermal conductivity and low density results in a specific thermal conductivity about five times higher than that of aluminum, allowing heat to rapidly propagate into the foam. This heat is spread out over the very large surface area within the foam, enabling large amounts of energy to be transferred with relatively low temperature difference. For the purpose of graphite foam thermosyphon design in electronics cooling, various effects such as graphite foam geometry, sub-cooling, working fluid effect, and liquid level were investigated in this study. The best thermal performance was achieved with the large graphite foam, working fluid with the lowest boiling point, a liquid level with the exact height of the graphite foam, and at the lowest sub-cooling temperature.

• 한국컴퓨터산업교육학회:학술대회논문집
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• 2003.11a
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• pp.79-82
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2$ and $Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.243-248
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• 2001

The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

• Transactions on Electrical and Electronic Materials
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• v.1 no.2
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• pp.32-37
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• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• Korean Journal of Soil Science and Fertilizer
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• v.45 no.1
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• pp.1-8
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• 2012

The thermal properties including volumetric heat capacity, thermal conductivity, thermal diffusivity, and diurnal and annual damping depths of 10 representative soil series of Korea were calculated using some measurable soil parameters based on the Taxonomical Classification of Korean Soils. The heat capacity of soils demonstrated a linear function of water content and ranged from 0.2 to $0.8cal\;cm^{-3}^{\circ}C^{-1}$ for dry and saturated medium-textured soil, respectively. A small increase in water content of the dry soils caused a sharp increase in thermal conductivity. Upon further increases in water content, the conductivity increased ever more gradually and reached to a maximum value at saturation. The transition from low to high thermal conductivity occurred at low water content in the soils with coarse texture, and at high water content in the other textures. Thermal conductivity ranged between $0.37{\times}10^{-3}cal\;cm^{-1}s^{-1}^{\circ}C^{-1}$ for dry (medium-textured) soil and $4.01{\times}10^{-3}cal\;cm^{-1}s^{-1}^{\circ}C^{-1}$ for saturated (medium/coarse-textured) soil. The thermal diffusivity initially increased rapidly with small increases in water content of the soils, and then decreased upon further increases in the soil-water content. Even in an extreme soil with the highest diffusivity value ($1.1{\times}10^{-2}cm^2s^{-1}$), the daily temperature variation did not penetrate below 70 cm soil depth and the yearly variation not below 13.4 m as four times of damping depths.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.711-717
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• 2000

Effect of alloying element additions to Ag on thermal conductivity electrical conductivity and mechanical properties of sheath materials for BSCCO tapes has been characterized. The thermal conductivity at low temperature range(10~300K) of Ag alloys were evaluated by both direct and indirect measurement techniques and compared with each other. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Au, Pd and Mg. Thermal conductivity of pure Ag at 30 K was measured to be 994.0 W/m.K on the other hand the corresponding values of A $g_{0.9995}$/M $g_{0.0005}$, A $g_{0.974}$/A $u_{0.025}$/M $g_{0.001}$, A $g_{0.973}$/Au.0.025//M $g_{0.002}$, and A $g_{0.92}$/P $d_{0.06}$/M $g_{0.02}$ were 342.6, 62.1, 59.2, 28.9 W/m.K respectively indicating 3 to 30 times lower than that of pure Ag. In addition alloying element additions to Ag improved mechanical strength while reduced elongation probably due to the strengthening mechanisms by the presence of additive atoms.s.

• Transactions on Electrical and Electronic Materials
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• v.5 no.4
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• pp.129-132
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• 2004

The electrothermal characteristics of a high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) using thin silicon on insulator (SOI) and silicon on sapphire (SOS) such as thermal conductivity and sink is analyzed by MEDICI. The device simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for modeling of the thermal behavior of SOI devices. In this paper we simulated the thermal conductivity and temperature distribution of a SOI LIGBT with an insulator layer of SiO$_2$ and $Al_2$O$_3$ at before and after latch-up and verified that the SOI LIGBT with the $Al_2$O$_3$ insulator had good thermal conductivity and reliability.

• International Journal of Automotive Technology
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• v.6 no.6
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• pp.563-570
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• 2005

A numerical study of high pressure and temperature droplet vaporization and combustion is conducted by formulating one dimensional evaporation model and single-step chemical reaction in the mixture of hydrocarbon fuel and air. The ambient pressure ranged from atmospheric conditions to the supercritical conditions. In order to account for the real gas effect on fluid p-v-T properties in high pressure conditions, the modified Soave-Redlich-Kwong state equation is used in the evaluation of thermophysical properties. Some computational results are compared with Sato's experimental data for the validation of calculations in case of vaporization. The comparison between predictions and experiments showed quite a good agreement. Droplet surface temperature increased with increasing pressure. Ignition time increased with increasing initial droplet diameter. Temporal or spatial distribution of mass fraction, mass diffusivity, Lewis number, thermal conductivity, and specific heat were presented.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.1
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• pp.93-100
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• 2011

The thermal property of insulation material is essential in developing a high-temperature superconductor (HTS) power cable to be operated at around liquid-nitrogen temperature. Unlike metallic materials, nonmetallic materials have a high thermal resistance; therefore, accurate estimate of the heat flow is difficult in the case of nonmetallic materials. The aim of this study is to develop an instrument for precisely measuring the thermal conductivity of insulating materials over a temperature range of 30 K to approximately the room temperature by using a cryocooler. The details of the thermal-conductivity measurement system, including the design and fabrication processes, are described in this paper. In addition, the design optimization to minimize unavoidable heat leakage from room temperature is discussed.