1 |
Wu, W., Du, J. -H., Hu, X. -J., Wang, B. -X., 2002, 'Pool Boiling Heat Transfer and Simplified One-dimensional Model for Prediction on Coated Porous Surfaces with Vapor Channels,' Int. J. of Heat and Mass Transfer 45, pp. 1117-1125
DOI
ScienceOn
|
2 |
Viswanath, R., Wakharkar, V., Watwe, A. and Lebonheur, V., 2000, 'Thermal Performance Challenges from Silicon to Systems,' Intel Technology Journal, Q3, pp. 1-16
|
3 |
Ramaswamy, C., Joshi, Y. and Nakayama, W., 2000, 'Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon,' IEEE Transactions on Components and Packaging Technologies, pp. 61-69
DOI
ScienceOn
|
4 |
Ramaswamy, C., Joshi, Y., Nakayama, W. and Johnson, W. B., 2001, 'Thermal Performance of a Compact Two-phase Thermosyphon : Response to Evaporator Confinement and Transient Loads,' Enhanced Heat Transfer, 6, pp. 279-288
DOI
ScienceOn
|
5 |
Mudawar, I. and Anderson, T. M., 1989, 'High Flux Electronic Cooling by Means of Pool Boiling - Part I : Parametric Investigation of the Effects of Coolant Variation, Pressurization, Subcooling, and Surface Augmentation,' Heat Transfer in Electronics, ASME HTD-Vol. 111, Ed. R. K. Shah, pp. 25-34
|
6 |
Mudawar, I. and Anderson, T. M., 1989, 'High Flux Electronic Cooling by Means of Pool Boiling - Part II : Optimization of Enhanced Surface Geometry,' Heat Transfer in Electronics, ASME HTD-Vol. 111, Ed. R. K. Shah, pp. 35-49
|
7 |
Kedzierski, 2002, M., Private Communication
|
8 |
Poco Graphite Foam, Accessed: March 25, 2002, 'Properties Data Sheet,' Online: http://www.pocofoam.com/Library/techdata.pdf
|
9 |
Klett, J., Klett, L., Burchell, T. and Walls, C., 2000, 'Graphitic Foam Thermal Management Materials for Electronic Packaging,' 00FCC-117 Society of Automotive Engineers
|
10 |
MRI, Accessed: March 25, 2002, 'S-BondTM Joining Graphite Foams,' Online : http://www.pocofoam.com/Library/techdata.pdf
|
11 |
Klett, J. and Conway, B., 2000, 'Thermal Management Solutions Utilizing High Thermal Conductivity Graphite Foams,' Proceedings of the 45th International SAMPE Symposium and Exhibition, Long Beach, CA, May 21-25
|
12 |
Garman, R. W., Elwell, R. J., Accessed: April 5, 2002, 'Thermal Performance of a Graphite Foam Material with Water Flow for Cooling Power Electronics,' Online: http://www.3m.com
|
13 |
Jiang, Y. Y., Wang, W. C., Wang, D. and Wang, B. X., 2001, 'Boiling Heat Transfer on Machined Porous Surfaces with Structural Optimization,' Int. J. of Heat and Mass Transfer 44, pp. 443-456
DOI
ScienceOn
|
14 |
3M, Accessed: April 5, 2002a, 'Fluorinert Electronic Liquid FC-72 Product Information,' Online : http://www.3m.com
|
15 |
3M, Accessed: April 5, 2002b, 'Fluorinert Electronic Liquid FC-87 Product Information,' Online: http://www.3m.com
|
16 |
Gunther, S. H., Binns, F., Carmean, D. M. and Hall, J. C., 2001, 'Managing the Impact of Increasing Microprocessor Power Consumption,' Intel Technology Journal, Q1, pp. 1-9
|