• 제목/요약/키워드: Test Probe

검색결과 674건 처리시간 0.033초

Dual Core Differential Pulsed Eddy Current Probe to Detect the Wall Thickness Variation in an Insulated Stainless Steel Pipe

  • Angani, C.S.;Park, D.G.;Kim, C.G.;Kollu, P.;Cheong, Y.M.
    • Journal of Magnetics
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    • 제15권4호
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    • pp.204-208
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    • 2010
  • Local wall thinning in pipelines affects the structural integrity of industries like nuclear power plants (NPPs). In the present study, a pulsed eddy current (PEC) differential probe with two excitation coils and two Hall-sensors was fabricated to measure the wall thinning in insulated pipelines. A stainless steel test sample was prepared with a thickness that varied from 1 mm to 5 mm and was laminated by plastic insulation to simulate the pipelines in NPPs. The excitation coils in the probe were driven by a rectangular current pulse, the difference of signals from two Hall-sensors was measured as the resultant PEC signal. The peak value of the detected signal is used to describe the wall thinning. The peak value increased as the thickness of the test sample increased. The results were measured at different insulation thicknesses on the sample. Results show that the differential PEC probe has the potential to detect wall thinning in an insulated NPP pipelines.

Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing

  • Lim, Jae-Hwan;Ryu, Jee-Youl;Choi, Woo-Chang
    • Transactions on Electrical and Electronic Materials
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    • 제14권2호
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    • pp.63-66
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    • 2013
  • This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

한국형 147검사 방법을 이용한 디젤자동차의 매연프로브 성능 향상 연구 (A Study on the Improvement of Smoke Probe Performance in Diesel Vehicles Using Korean 147 Test Method)

  • 김재열;채일석;김상유;양동희
    • 한국기계가공학회지
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    • 제20권7호
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    • pp.25-32
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    • 2021
  • In the previous study, a study was conducted to improve the exhaust gas intake efficiency by improving the existing soot measurement probe in the shape and angle of the exhaust port. As a result, it can be seen that the smoke measurement performance according to the shape and angle is improved. In previous studies, the performance of the soot probe was not confirmed for the Korean KD 147 mode, which has a low suction flow rate and a long inspection time. So, we would like to confirm the improvement of the smoke probe performance of the Korean KD 147 mode, which is close to the actual driving conditions. The probe used in this study is another type of probe, and has a circular ring shape instead of a rib and variable center position unit, so the probe center hole is located close to the center of the exhaust pipe.

마이크로스트립 커플러 구조를 이용한 BCI 프로브 Emulator (BCI Probe Emulator Using a Microstrip Coupler)

  • 정원주;김소영
    • 한국전자파학회논문지
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    • 제25권11호
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    • pp.1164-1171
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    • 2014
  • Bulk Current Injection(BCI) 테스트는 전류 주입 프로브를 사용하여 측정하고자 하는 Integrated Circuit(IC)에 전류를 주입하여 Electromagnetic Compatibility(EMC) 규격을 충족시키는지 시험하는 방법이다. 본 논문에서는 국제전기표준회의에서 제정한 IEC 62132-part 3에서 규정하는 BCI 테스트의 전류 주입 프로브를 대체하여, RF 잡음을 인가할 수 있는 마이크로스트립 커플러 구조를 제안하였다. 전통적으로 높은 전원 전압을 사용하는 자동차 IC 테스트에 사용되어 오던 BCI 전류 주입 프로브를 저 전압을 사용하는 저 전력 IC의 테스트에 사용할 수 있는 마이크로스트립 커플러 구조를 개발하여 그 유효성을 100 MHz에서부터 1,000 MHz까지의 주파수 영역에서 비교 및 검증하였다. 또한, 주파수에 따라 전류 주입 프로브를 통한 RF 잡음 인가와 마이크로스트립 커플러 구조를 통한 RF 잡음 인가 시 규정한 노이즈를 얻는데 필요한 전력을 dBm 단위로 측정, 비교하여 마이크로스트립 커플러 구조를 이용한 경우에 더 적은 전력으로 필요한 RF 잡음을 주입할 수 있음을 확인하였다.

인홀 시험을 이용한 터널 막장의 암반강성 측정에 대한 적용성 연구 (A Pilot Study of Stiffness Mesurements for Tunnel-Face Materials Using In-hole Seismic Method)

  • 목영진;김영수
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2005년도 춘계 학술발표회 논문집
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    • pp.445-456
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    • 2005
  • The research concentrates on improving the in-hole seismic probe, which has been developed in past five years, to be used in stiffness measurements of tunnel-face materials. The probe was down-sized to be fit in 45-mm diameter holes(or BX) drilled by a jumbo-drill, which is used to drill holes to install explosives for tunneling. Also trigger system was improved by using a down-speeding motor for operating convenience and air packing system was replaced with a set of plate-springs to eliminate supply of compressed air. These modifications are to adjust the probe for the unfavourable environment inside of tunnels and to test without any further drilling cost. The probe and testing procedure were successfully adopted with horizontal holes drilled by a jumbo-drill at a tunnel-face to evaluate the stiffness of rock mass. The measured shear wave velocities can be used to estimate deformation properties of rock mass for tunnel analyses.

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대면적 SPL(Scanning Probe Lithography) 시스템 제작 (Manufacturing of SPL system having a large scanning area)

  • 윤상준;김원효;성우경;박영근;황규호;정관수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.699-702
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    • 2004
  • Next generation lithography technologies, such as EBL(Electron Beam Lithography), X-ray lithography, SPL(Scanning Probe Lithography), have been studied widely for getting over line width limitation of photolithography. Among the next generation lithography technologies, SPL has been highlighted because of its high resolution advantage. But is also has problem which are slow processing time and sample size limitation. The purpose of this study is complement of present SPL system. Brand new SPL system was made. SPL test was performed with the system in ultra thin PMMA(polymethlymethacrylate) film.

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LED 검사장비용 탐침의 특성 규명 (Characterization of Probe Pin for LED Inspection System)

  • 심희수;김선경
    • 한국생산제조학회지
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    • 제24권6호
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    • pp.647-652
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    • 2015
  • A probe pin is a key component of LED inspection equipment. The probe pin makes contact with the LED electrodes and supplies an electric current. Because the mechanical and electrical homogeneity of the probe surface affects the service life and reliability, its characterization is essential. For this study, the hardness was measured using a micro-Vickers hardness test. Moreover, the thicknesses of the plating at different locations and the elemental compositions were examined using an FE-SEM. The uniformity of the plating was found to be acceptable because palladium was detected consistently throughout the tested domain. In addition, the hardness of the surface was determined to be higher than that of the typical palladium range, which is attributed to the use of undercoated nickel.

단자속양자 회로 측정프로브의 특성 분석을 위한 시뮬레이션 (Simulation for characterization of high speed probe for measurement of single flux quantum circuits)

  • 김상문;김영환;최종현;조운조;윤기현
    • 한국초전도ㆍ저온공학회논문지
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    • 제4권2호
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    • pp.11-15
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    • 2002
  • High speed probe for measurement of sin91e flux quantum circuits is comprised of coaxial cables and microstrip lines in order to carry high speed signals without loss. For the impedance matching between coaxial cable and microstrip line, we have determined the dimension of the microstrip line with 50${\Omega}$ impedance by simulation and then have investigated the effect of line width and cross-sectional shape of signal line, dielectric material, thickness of soldering lead at the coaxial-to-microstrip transition Point, and the an91c between dielectric material and end part of the signal line on the characteristics of signal transmission of the microstrip line. From the simulation, we have found that these all parameter's had influenced on the characteristic of signal transmission on the microstrip line and should be reflected in fabricating high speed probe, We have also determined the dimension of coplanar waveguide to fabricate testing sample for performance test of high speed probe.

ICT 융합 환경에서의 안전 특성화 접지 설계를 위한 스마트 대지 저항 측정 기술에 관한 연구 (A Study on Smart Soil Resistance Measuring Device for Safety Characterized Ground Design in Converged Information Technology)

  • 김홍용;신승중
    • 한국인터넷방송통신학회논문지
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    • 제19권1호
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    • pp.203-209
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    • 2019
  • 본 연구에서는 WENNER 4전극법 기반에 GMD(신규 대지 고유 저항 측정 장치)와 측정용 Probe(접지동봉)가 PLC(전력선 통신)로 연결된다. 측정용 Probe는 2개(P1,P2)가 1조로 모두 5조 10개의 Probe가 직렬로 각각 1m, 2m, 4m, 8m, 16m 간격으로 대지(토양)에 설치되어 있다. GMD에서 보낸 PLC 신호를 측정용 Probe 1조(P1)의 수신기가 감지하면 Probe에 부착된 PSD(전력 공급 장치)에서 측정용 미세 전압과 전류가 대지로 흐르게 되고 P1과 P2 사이의 토양을 거쳐 Probe 1조(P2)에 유입 된다. 이때 대지 저항으로 인해 전압 강하가 발생되는 원리로 저항값을 측정하게 된다. 이렇게 1~5조까지 T초 간격으로 대지 저항을 측정하고 측정된 데이터는 메인 장비에 탑재된 Arduino Server에 저장 한다. 저장된 측정 데이터는 옴의 법칙(Ohm's Law)에 의한 수식 R=E/I와 고유저항 ${\rho}=6.28aR$ (여기서, R: 측정저항, E: 측정전압, I: 측정전류, a:Probe 간격, ${\rho}$: 고유저항 )를 통해 고유저항을 얻을 수 있다. 실시간으로 얻어진 데이터를 Main PC에 설치된 CDGES 프로그램과 연동되어 데이터 분석이 가능하게 되고 대지(토양)의 접지 환경을 실시간 모니터링 할 수 있게 된다. 또한, 대지(토양)의 온도, 습도 등 계절의 특성을 파악하여 3D 그래프 지원으로 입체적인 Display가 가능하다. 연구의 한계점은 실험적으로 개발 운용한 모델로 상업적인 접근을 위해 Test Bed의 구체적인 적용 방안이 필요할 것이다.

실내모형실험을 통한 TDR 함수량계의 현장 함수비 보정 (Water Content Calibration of Time-Domain Reflectometry Probe Using Laboratory Model Test)

  • 신은철;류병현;박정준
    • 한국지반신소재학회논문집
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    • 제12권2호
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    • pp.1-11
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    • 2013
  • 지하매설구조물인 상수도관 주변 지반의 간극수 동결로 상수도관의 변형에 영향을 미칠 수 있다. 이에 최근에는 현장 계측을 통한 포장 하부구조체의 함수비를 주기적으로 측정하기 위해서 미국 Campbell사의 TDR(time domain reflectometry) CS616 함수량계와 독일의 IMKO사 제품의 TRIME FM를 이용한 수동 함수량계 TRIME P3, T3 Probe를 사용하고 있다. 일반적으로 TDR 함수량계와 TRIME 수동 함수량계는 흙의 종류, 입도, 다짐도, 온도 등에 의해 오차가 유발될 수 있기 때문에, 현장의 시료를 사용하여 TDR 함수량계의 실내보정실험을 반드시 수행해야 한다. 즉, TDR함수량계의 매뉴얼에서는 일반적인 흙의 보정방정식을 제안하고 있지만 현장 적용시에는 반드시 보정실험을 수행하도록 권고하고 있다. 본 연구에서는 상수관 등 지하매설구조물의 주변의 다양한 채움재료를 사용하여 실내 보정 실험을 수행하였으며, 이 결과로부터 TDR함수량계인 CS616, TRIME-T3, TRIME-P3의 보정모델식을 제안하였으며, 보정식에 대한 현장검증을 수행하였다.